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The semiconductor wafer polishing and grinding equipment market is forecasted to grow by USD 442.01 mn during 2023-2028, accelerating at a CAGR of 4.06% during the forecast period. The report on the semiconductor wafer polishing and grinding equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of miniaturized semiconductor components, growing investment in new fabrication plants, and incentives and discounts for long-term customers of end-users.
The semiconductor wafer polishing and grinding equipment market is segmented as below:
By Application
- 300 mm
- 200 mm
- Less than 200 mm
By End-user
- Foundries
- IDM
- Memory manufacturers
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the semiconductor wafer polishing and grinding equipment market covers the following areas:
- Semiconductor wafer polishing and grinding equipment market sizing
- Semiconductor wafer polishing and grinding equipment market forecast
- Semiconductor wafer polishing and grinding equipment market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
List of Exhibits
Executive Summary
The publisher recognizes the following companies as the key players in the global semiconductor wafer polishing and grinding equipment market: ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp..Commenting on the report, an analyst from the research team said: 'The latest trend gaining momentum in the market is increasing use of NEMS.'
According to the report, one of the major drivers for this market is the emergence of miniaturized semiconductor components.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ALLIED HIGH TECH PRODUCTS INC
- Amtech Systems Inc.
- Applied Materials Inc.
- ASM International NV
- Axus Technology
- DISCO Corp.
- G and N GmbH
- Gigamat Technologies Inc
- KLA Corp.
- Lapmaster Wolters
- Logitech Ltd.
- Okamoto Corp
- Revasum Inc.
- S Cubed
- S3 Alliance.
- Tokyo Electron Ltd.
- TOKYO SEIMITSU CO. LTD
- ULTRA TEC Manufacturing Inc.
- UNITED GRINDING North America Inc.
- Ebara Corp.
