Some of the Key Innovations Profiled Include AR HUD for Autonomous Vehicles, Beam Steering Weatherproof Chip for Self-Driving Vehicles, and Sensor Fusion Enabling Autonomous Driving
The Mobility Technology Opportunity Engine (TOE) issue for November 2020 covers advancements in augmented reality (AR) heads-up displays (HUDs), autonomous vehicles, sensor fusion, artificial intelligence, ride hailing electric vehicles, and test benches. Some of the key innovations profiled include AR HUD for autonomous vehicles, beam steering weatherproof chip for self-driving vehicles, sensor fusion enabling autonomous driving, self-powered quantum sensors, and high performance lithium-selenide batteries for electric vehicles.
The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant, but potentially offering commercial value. Each monthly TOE provides subscribers valuable descriptions and analyses of 10 noteworthy innovations. The main focus is on highway-licensed motor vehicles (light, medium and heavy). Passenger cars, trucks, buses, motorcycles, scooters and railway locomotives are within the product scope, energized by any fuel. Many of the innovations concern powertrains (internal combustion engines, turbines, battery electrics, fuel cell electrics, hybrid-electrics), as well as drivetrains (including transmissions), interiors - seating and displays, advanced materials - as for body/chassis, wireless connectivity, and self-driving technology that is currently receiving so much attention. The Mobility TOE outlines and evaluates each innovation, notes which organizations and developers are involved, projects the likely timing for commercialization, furnishes a patent analysis, and provides valuable strategic insights for industry stakeholders.
The Advanced Manufacturing and Automation (AMA) Cluster covers technologies that enable clean, lean and flexible manufacturing and industrial automation. Technologies such as three-dimensional (3D) and four-dimensional (4D) printing, wireless sensors and networks, information and communication technology, multimaterial joining, composites manufacturing, digital manufacturing, micro- and nano-manufacturing, lasers, advanced software, and printing techniques, are covered as part of this cluster. The technologies covered here impact a wide range of industries, such as the impact semiconductor, automotive and transportation, aerospace and defense, industrial, healthcare, logistics, and electronics industries.
Table of Contents
1. Innovations in Mobility
- Futurus, China
- Envisics, UK - Growth Opportunities
- University of Texas at Austin, US - Growth Opportunities
- Holomatic, China - Growth Opportunities
- Argonne National Laboratory, US - Growth Opportunities
- Washington University in St. Louis, US - Growth Opportunities
- University of Surrey, UK - Growth Opportunities
- University of California - San Diego, US - Growth Opportunities
- Didi Chuxing, China Byd, China - Growth Opportunities
- FEV Group GmbH, Germany - Growth Opportunities
2. Key Contacts
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Argonne National Laboratory
- Didi Chuxing
- Envisics
- FEV Group GmbH
- Futurus
- Holomatic
- University of California - San Diego
- University of Surrey
- University of Texas at Austin
- Washington University in St. Louis
