Some of the Innovations Profiled Include 3D Printing of Compound Semiconductors, Printed Circuit Boards, and Flexible Electronics
This Advanced Manufacturing Technology Opportunity Engine (TOE) issue for November 2020 covers innovations in 3D printing, robotic grippers, and machine monitoring. Some of the innovations profiled include 3D printing of compound semiconductors, printed circuit boards, and flexible electronics. Other innovations in focus are robotic grippers for handling flexible objects, material handling, machine monitoring, large format metal 3D printers, and a cloud-based 3D printer management platform.
The Advanced Manufacturing TOE covers global innovations and developments related to manufacturing and industrial automation on a monthly basis. Innovations are focused toward improving product traceability, energy efficiency and reducing environmental footprints, integrating product design and manufacturing aspects for reducing time-to-market. Research focus areas include rapid prototyping (additive manufacturing), lightweighting (multimaterial joining, plastics and metals manufacturing, carbon fiber-based composite manufacturing), smart robotics (agile robots, consumer robots, swarm robotics, cobots), monitoring and control (wireless control networks, human machine interface), and simulation and modeling (design and simulation software).
The Advanced Manufacturing and Automation (AMA) Cluster covers technologies that enable clean, lean and flexible manufacturing and industrial automation. Technologies such as three-dimensional (3D) and four-dimensional (4D) printing, wireless sensors and networks, information and communication technology, multimaterial joining, composites manufacturing, digital manufacturing, micro- and nano-manufacturing, lasers, advanced software, and printing techniques, are covered as part of this cluster. The technologies covered here impact a wide range of industries, such as the impact semiconductor, automotive and transportation, aerospace and defense, industrial, healthcare, logistics, and electronics industries.
Table of Contents
1. Innovations in Advanced Manufacturing
- Johns Hopkins University Applied Physics Laboratory, US
- Hensoldt AG, Germany
- Deutsches Elektronen-Synchrotron Desy, Germany - Growth Opportunities
- Massachusetts Institute of Technology, US
- OnRobot A/S, Denmark
- National Tsing Hua University, Taiwan - Growth Opportunities
- Micro-Epsilon Messtechnik, Germany - Growth Opportunities
- Leosphere SAS, France - Growth Opportunities
- 3D Control Systems Ltd. US - Growth Opportunities
- Velo 3D Inc. US
- Open Additive LLC, US
- AML3D Limited, Australia - Growth Opportunities
2. Key Contacts
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- 3D Control Systems Ltd.
- AML3D Limited
- Deutsches Elektronen-Synchrotron Desy
- Hensoldt AG
- Johns Hopkins University Applied Physics Laboratory
- Leosphere SAS
- Massachusetts Institute of Technology
- Micro-Epsilon Messtechnik
- National Tsing Hua University
- OnRobot A/S
- Open Additive LLC
- Velo 3D Inc.
