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Global Semiconductor Assembly and Packaging Services Market 2020-2024

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    Report

  • 120 Pages
  • December 2020
  • Region: Global
  • TechNavio
  • ID: 5232369
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Market Growth Has Experienced a Change of -5.86% YoY in 2020

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The semiconductor assembly and packaging services market is poised to grow by $11.33 billion during 2020-2024, progressing at a CAGR of 3% during the forecast period.

This report on the the semiconductor assembly and packaging services market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors. The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment.

The market is driven by the growing demand for semiconductor wafers, large-scale use of polymer adhesive technology, and development of 3D chip packaging, FIWLP, and FOWLP technology. In addition, the growing demand for semiconductor wafers is anticipated to boost the growth of the market as well.

The semiconductor assembly and packaging services market analysis includes type segment, application segment, service provider segment, and geographical landscapes.

The semiconductor assembly and packaging services market is segmented as below:

By Type
  • WLP
  • Die level packaging

By Application
  • Communication sector
  • Industrial and automotive sector
  • Computing and networking sector
  • Consumer electronics sector

By Service Provider
  • OSATs
  • IDMs
  • Foundries

By Geographic Landscapes
  • APAC
  • North America
  • Europe
  • South America
  • MEA

This study identifies the development of 3D chip packaging, FIWLP, and FOWLP technology as one of the prime reasons driving the semiconductor assembly and packaging services market growth during the next few years.

The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters.

This report on the semiconductor assembly and packaging services market covers the following areas:
  • Semiconductor assembly and packaging services market sizing
  • Semiconductor assembly and packaging services market forecast
  • Semiconductor assembly and packaging services market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor assembly and packaging services market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., HANA Micron Inc. , Intel Corp., King Yuan Electronic Corp. Ltd., Samsung Electro-Mechanics Co. Ltd., Siliconware Precision Industries Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., and Tongfu Microelectronics Co. Ltd. Also, the semiconductor assembly and packaging services market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary.

The market research report provides a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.

Table of Contents

Executive Summary
  • Market Overview

Market Landscape
  • Market ecosystem
  • Value chain analysis

Market Sizing
  • Market definition
  • Market segment analysis
  • Market size 2019
  • Market outlook: Forecast for 2019-2024

Five Forces Analysis
  • Five forces analysis
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by Application
  • Market segments
  • Comparison by Application
  • Communication sector - Market size and forecast 2019-2024
  • Industrial and automotive sector - Market size and forecast 2019-2024
  • Computing and networking sector - Market size and forecast 2019-2024
  • Consumer electronics sector - Market size and forecast 2019-2024
  • Market opportunity by Application

Market Segmentation by Type
  • Market segments
  • Comparison by Type
  • WLP - Market size and forecast 2019-2024
  • Die level packaging - Market size and forecast 2019-2024
  • Market opportunity by Type

By Service provider
  • OSATs
  • IDMs
  • Foundries

Customer Landscape
Geographic Landscape
  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2019-2024
  • North America - Market size and forecast 2019-2024
  • Europe - Market size and forecast 2019-2024
  • South America - Market size and forecast 2019-2024
  • MEA - Market size and forecast 2019-2024
  • Key leading countries
  • Market opportunity by geography
  • Market drivers
  • Market challenges
  • Market trends

Vendor Landscape
  • Vendor landscape
  • Landscape disruption

Vendor Analysis
  • Vendors covered
  • Market positioning of vendors
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • HANA Micron Inc.
  • Intel Corp.
  • King Yuan Electronic Corp. Ltd.
  • Samsung Electro-Mechanics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • Tongfu Microelectronics Co. Ltd.

Appendix
  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

List of Exhibits
1: Key Finding 1
2: Key Finding 2
3: Key Finding 3
4: Key Finding 5
5: Key Finding 6
6: Key Finding 7
7: Key Finding 8
8: Key Finding 9
9: Parent market
10: Market characteristics
11: Offerings of vendors included in the market definition
12: Market segments
13: Global - Market size and forecast 2019-2024 ($ million)
14: Global market: Year-over-year growth 2019-2024 (%)
15: Five forces analysis 2019 & 2024
16: Bargaining power of buyers
17: Bargaining power of suppliers
18: Threat of new entrants
19: Threat of substitutes
20: Threat of rivalry
21: Market condition - Five forces 2019
22: Application - Market share 2019-2024 (%)
23: Comparison by Application
24: Communication sector - Market size and forecast 2019-2024 ($ million)
25: Communication sector - Year-over-year growth 2019-2024 (%)
26: Industrial and automotive sector - Market size and forecast 2019-2024 ($ million)
27: Industrial and automotive sector - Year-over-year growth 2019-2024 (%)
28: Computing and networking sector - Market size and forecast 2019-2024 ($ million)
29: Computing and networking sector - Year-over-year growth 2019-2024 (%)
30: Consumer electronics sector - Market size and forecast 2019-2024 ($ million)
31: Consumer electronics sector - Year-over-year growth 2019-2024 (%)
32: Market opportunity by Application
33: Type - Market share 2019-2024 (%)
34: Comparison by Type
35: WLP - Market size and forecast 2019-2024 ($ million)
36: WLP - Year-over-year growth 2019-2024 (%)
37: Die level packaging - Market size and forecast 2019-2024 ($ million)
38: Die level packaging - Year-over-year growth 2019-2024 (%)
39: Market opportunity by Type
40: Customer landscape
41: Market share by geography 2019-2024 (%)
42: Geographic comparison
43: APAC - Market size and forecast 2019-2024 ($ million)
44: APAC - Year-over-year growth 2019-2024 (%)
45: North America - Market size and forecast 2019-2024 ($ million)
46: North America - Year-over-year growth 2019-2024 (%)
47: Europe - Market size and forecast 2019-2024 ($ million)
48: Europe - Year-over-year growth 2019-2024 (%)
49: South America - Market size and forecast 2019-2024 ($ million)
50: South America - Year-over-year growth 2019-2024 (%)
51: MEA - Market size and forecast 2019-2024 ($ million)
52: MEA - Year-over-year growth 2019-2024 (%)
53: Key leading countries
54: Market opportunity by geography ($ million)
55: Impact of drivers and challenges
56: Vendor landscape
57: Landscape disruption
58: Industry risks
59: Vendors covered
60: Market positioning of vendors
61: Amkor Technology Inc. - Overview
62: Amkor Technology Inc. - Product and service
63: Amkor Technology Inc. - Key offerings
64: Amkor Technology Inc. - Key customers
65: Amkor Technology Inc. - Segment focus
66: ASE Technology Holding Co. Ltd. - Overview
67: ASE Technology Holding Co. Ltd. - Business segments
68: ASE Technology Holding Co. Ltd. - Key offerings
69: ASE Technology Holding Co. Ltd. - Key customers
70: ASE Technology Holding Co. Ltd. - Segment focus
71: ChipMOS TECHNOLOGIES Inc. - Overview
72: ChipMOS TECHNOLOGIES Inc. - Business segments
73: ChipMOS TECHNOLOGIES Inc. - Key offerings
74: ChipMOS TECHNOLOGIES Inc. - Key customers
75: ChipMOS TECHNOLOGIES Inc. - Segment focus
76: HANA Micron Inc. - Overview
77: HANA Micron Inc. - Product and service
78: HANA Micron Inc. - Key offerings
79: HANA Micron Inc. - Key customers
80: HANA Micron Inc. - Segment focus
81: Intel Corp. - Overview
82: Intel Corp. - Business segments
83: Intel Corp. - Key offerings
84: Intel Corp. - Key customers
85: Intel Corp. - Segment focus
86: King Yuan Electronic Corp. Ltd. - Overview
87: King Yuan Electronic Corp. Ltd. - Product and service
88: King Yuan Electronic Corp. Ltd. - Key offerings
89: King Yuan Electronic Corp. Ltd. - Key customers
90: King Yuan Electronic Corp. Ltd. - Segment focus
91: Samsung Electro-Mechanics Co. Ltd. - Overview
92: Samsung Electro-Mechanics Co. Ltd. - Business segments
93: Samsung Electro-Mechanics Co. Ltd. - Key offerings
94: Samsung Electro-Mechanics Co. Ltd. - Key customers
95: Samsung Electro-Mechanics Co. Ltd. - Segment focus
96: Siliconware Precision Industries Co. Ltd. - Overview
97: Siliconware Precision Industries Co. Ltd. - Business segments
98: Siliconware Precision Industries Co. Ltd. - Key offerings
99: Siliconware Precision Industries Co. Ltd. - Key customers
100: Siliconware Precision Industries Co. Ltd. - Segment focus
101: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
102: Taiwan Semiconductor Manufacturing Co. Ltd. - Business segments
103: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
104: Taiwan Semiconductor Manufacturing Co. Ltd. - Key customers
105: Taiwan Semiconductor Manufacturing Co. Ltd. - Segment focus
106: Tongfu Microelectronics Co. Ltd. - Overview
107: Tongfu Microelectronics Co. Ltd. - Product and service
108: Tongfu Microelectronics Co. Ltd. - Key offerings
109: Tongfu Microelectronics Co. Ltd. - Key customers
110: Tongfu Microelectronics Co. Ltd. - Segment focus
111: Currency conversion rates for US$
112: Research Methodology
113: Validation techniques employed for market sizing
114: Information sources
115: List of abbreviations

Executive Summary

The analyst recognizes the following companies as the key players in the global semiconductor assembly and packaging services market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., HANA Micron Inc. , Intel Corp., King Yuan Electronic Corp. Ltd., Samsung Electro-Mechanics Co. Ltd., Siliconware Precision Industries Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., and Tongfu Microelectronics Co. Ltd.

According to one of the team's analysts: The latest trend gaining momentum in the market is the development of 3D chip packaging, FIWLP, and FOWLP technology.

According to the report, one of the major drivers for this market is the growing demand for semiconductor wafers.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • HANA Micron Inc.
  • Intel Corp.
  • King Yuan Electronic Corp. Ltd.
  • Samsung Electro-Mechanics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • Tongfu Microelectronics Co. Ltd.