Market Growth Has Experienced a Change of -5.86% YoY in 2020
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The semiconductor assembly and packaging services market is forecasted to grow byUSD 17.88 billion during 2023-2028, accelerating at a CAGR of 6.15% during the forecast period. The report on the semiconductor assembly and packaging services market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for semiconductor wafers, the explosive growth of wireless computing devices due to the advent of IoT, and the development of 3D chip packaging, FIWLP, and FOWLP technology.
The semiconductor assembly and packaging services market is segmented as below:
By Service Type
- Assembly services
- Testing services
By Application
- Communication
- Computing and networking
- Industrial
- Consumer electronics
- Automotive electronics
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the semiconductor assembly and packaging services market covers the following areas:
- Semiconductor assembly and packaging services market sizing
- Semiconductor assembly and packaging services market forecast
- Semiconductor assembly and packaging services market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global semiconductor assembly and packaging services market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., HANA Micron Co. Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., KLA Corp., Microchip Technology Inc., Powertech Technology Inc., Promex Industries Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., SIGNETICS Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Toshiba Corp., ULVAC Inc., and Yole Developpement SA.Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is the short product lifecycle of mobile devices."
According to the report, one of the major drivers for this market is the growing demand for semiconductor wafers.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- ASMPT Ltd.
- ChipMOS TECHNOLOGIES INC.
- HANA Micron Co. Ltd.
- Intel Corp.
- Jiangsu Changdian Technology Co. Ltd.
- King Yuan Electronics Co. Ltd.
- KLA Corp.
- Microchip Technology Inc.
- Powertech Technology Inc.
- Promex Industries Inc.
- Renesas Electronics Corp.
- Samsung Electronics Co. Ltd.
- SIGNETICS Corp.
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Tokyo Electron Ltd.
- Toshiba Corp.
- ULVAC Inc.
- Yole Developpement SA
