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Asia Pacific Mixed Signal IC Market By Type (Mixed Signal SoC, Microcontroller and Data Converter), By End User (Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others), By Country, Industry Analysis and Forecast, 2020 - 202

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    Report

  • 91 Pages
  • February 2021
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5305655
The Asia Pacific Mixed Signal IC Market is expected to witness market growth of 7.8% CAGR during the forecast period (2020-2026).

A combination of analog & digital ICs is termed as Mixed-signal IC. A mixed-signal IC is considered an integrated circuit that contains both analog & digital ICs on a single semiconductor die. Consumer electronics applications have extensively adopted Mixed-signal ICs. The manufacturing of mixed-signal ICS is fueled by the surge in penetration of mobile phones & other portable electronics devices. Due to the substantial development of consumer electronics, telecommunication, & other industries, the utilization of mixed-signal IC has been increased in electronics devices and smartphones. The mixed-signal IC market is expected to be boosted by the advent of the 5G network and the growing demand for low-power consumption devices.

Leading industry players are putting high investments into R&D activities that are focused on innovating, creating & providing advanced solutions to the customers. The demand for mixed-signal IC will increase as these solution manufacturers continue to incorporate advanced features into their solutions. Moreover, the high advancements of the Internet of Things (IoT) across industries are creating various profitable opportunities for the growth of the mixed-signal IC market during the forecast period. The factors are expected to boost the growth of the mixed-signal IC market during the forecast period.

Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The China market dominated the Asia Pacific Automotive Mixed Signal IC Market by Country in 2019, and is expected to continue to be a dominant market till 2026. The Japan market is exhibiting a CAGR of 8.4% during (2020 - 2026). Additionally, The India market is anticipated to grow at a CAGR of 9.6% during (2020 - 2026).

The Consumer Electronics market dominated the Malaysia Mixed Signal IC Market by End User in 2019, thereby, achieving a market value of $1,049.8 million by 2026. The Medical & Healthcare market is experiencing a CAGR of 10.3% during (2020 - 2026). The Telecommunication market is showcasing a CAGR of 12.6% during (2020 - 2026).

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.

Scope of the Study

Market Segments covered in the Report:

By Type
  • Mixed Signal SoC
  • Microcontroller
  • Data Converter

By End User
  • Consumer Electronics
  • Medical & Healthcare
  • Telecommunication
  • Automotive
  • Others

By Country
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Companies Profiled
  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited

Unique Offerings from the Publisher
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Mixed Signal IC Market, by Type
1.4.2 Asia Pacific Mixed Signal IC Market, by End User
1.4.3 Asia Pacific Mixed Signal IC Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Asia Pacific Mixed Signal IC Market by Type
3.1 Asia Pacific Mixed Signal SoC Mixed Signal IC Market by Country
3.2 Asia Pacific Microcontroller Mixed Signal IC Market by Country
3.3 Asia Pacific Data Converter Mixed Signal IC Market by Country
Chapter 4. Asia Pacific Mixed Signal IC Market by End User
4.1 Asia Pacific Consumer Electronics Mixed Signal IC Market by Country
4.2 Asia Pacific Medical & Healthcare Mixed Signal IC Market by Country
4.3 Asia Pacific Telecommunication Mixed Signal IC Market by Country
4.4 Asia Pacific Automotive Mixed Signal IC Market by Country
4.5 Asia Pacific Others Mixed Signal IC Market by Country
Chapter 5. Asia Pacific Mixed Signal IC Market by Country
5.1 China Mixed Signal IC Market
5.1.1 China Mixed Signal IC Market by Type
5.1.2 China Mixed Signal IC Market by End User
5.2 Japan Mixed Signal IC Market
5.2.1 Japan Mixed Signal IC Market by Type
5.2.2 Japan Mixed Signal IC Market by End User
5.3 India Mixed Signal IC Market
5.3.1 India Mixed Signal IC Market by Type
5.3.2 India Mixed Signal IC Market by End User
5.4 South Korea Mixed Signal IC Market
5.4.1 South Korea Mixed Signal IC Market by Type
5.4.2 South Korea Mixed Signal IC Market by End User
5.5 Singapore Mixed Signal IC Market
5.5.1 Singapore Mixed Signal IC Market by Type
5.5.2 Singapore Mixed Signal IC Market by End User
5.6 Malaysia Mixed Signal IC Market
5.6.1 Malaysia Mixed Signal IC Market by Type
5.6.2 Malaysia Mixed Signal IC Market by End User
5.7 Rest of Asia Pacific Mixed Signal IC Market
5.7.1 Rest of Asia Pacific Mixed Signal IC Market by Type
5.7.2 Rest of Asia Pacific Mixed Signal IC Market by End User
Chapter 6. Company Profiles
6.1 Analog Devices, Inc.
6.1.1 Company Overview
6.1.2 Financial Analysis
6.1.3 Segmental and Regional Analysis
6.1.4 Research & Development Expenses
6.1.5 Recent strategies and developments:
6.1.5.1 Acquisition and Mergers:
6.1.5.2 Product Launches and Product Expansions:
6.1.5.3 Geographical Expansions:
6.1.6 SWOT Analysis
6.2 Broadcom, Inc.
6.2.1 Company Overview
6.2.2 Financial Analysis
6.2.3 Segmental and Regional Analysis
6.2.4 Research & Development Expense
6.2.5 SWOT Analysis
6.3 Infineon Technologies AG
6.3.1 Company Overview
6.3.2 Financial Analysis
6.3.3 Segmental and Regional Analysis
6.3.4 Research & Development Expense
6.3.5 SWOT Analysis
6.4 NXP Semiconductors N.V.
6.4.1 Company Overview
6.4.2 Financial Analysis
6.4.3 Regional Analysis
6.4.4 Research & Development Expense
6.4.5 SWOT Analysis
6.5 Renesas Electronics Corporation
6.5.1 Company Overview
6.5.2 Financial Analysis
6.5.3 Segmental and Regional Analysis
6.5.4 Research & Development Expense
6.5.5 Recent strategies and developments:
6.5.5.1 Acquisition and Mergers:
6.6 STMicroelectronics N.V.
6.6.1 Company Overview
6.6.2 Financial Analysis
6.6.3 Segmental and Regional Analysis
6.6.4 Research & Development Expense
6.6.5 Recent strategies and developments:
6.6.5.1 Partnerships, Collaborations, and Agreements:
6.6.6 SWOT Analysis
6.7 Texas Instruments, Inc.
6.7.1 Company Overview
6.7.2 Financial Analysis
6.7.3 Segmental and Regional Analysis
6.7.4 Research & Development Expense
6.7.5 Recent strategies and developments:
6.7.5.1 Partnerships, Collaborations, and Agreements:
6.7.6 SWOT Analysis
6.8 Intel Corporation
6.8.1 Company Overview
6.8.2 Financial Analysis
6.8.3 Segmental and Regional Analysis
6.8.4 Research & Development Expenses
6.8.5 SWOT Analysis
6.9 Telephonics Corporation (Griffon Corporation)
6.9.1 Company Overview
6.9.2 Financial Analysis
6.9.3 Segmental and Regional Analysis
6.10. Ensilica Limited
6.10.1 Company Overview

Companies Mentioned

  • Broadcom, Inc.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • Intel Corporation
  • Telephonics Corporation (Griffon Corporation)
  • Ensilica Limited

Methodology

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