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Global High Performance Computing (HPC) Chipset Market By Chip Type (Graphic Processing Unit (GPU), Central Processing Unit (CPU), Field Programmable Gate Array (FPGA) and Application Specific Integrated Circuit (ASIC)), By Region, Industry Analysis and F

  • ID: 5305663
  • Report
  • February 2021
  • Region: Global
  • 155 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)

FEATURED COMPANIES

  • Cisco Systems, Inc.
  • Google, Inc.
  • IBM Corporation
  • Intel Corporation
  • MediaTek, Inc.
  • NVIDIA Corporation
  • MORE
The Global High Performance Computing (HPC) Chipset Market size is expected to reach $12.7 billion by 2026, rising at a market growth of 20.8% CAGR during the forecast period. High-performance computing (HPC) can perform complicated calculations at high speeds and possesses the ability to process large datasets. The method of aggregating computing power is termed as high-performance computing. This technology offers much superior performance than traditional desktop computers or workstations to address big issues in engineering, business, or science.

The global high-performance computing market is expected to be driven by many factors such as growing investments in artificial intelligence (AI), engineering, and the Industrial Internet of Things (IIoT), which requires electronic design automation (EDA). Moreover, various hardware providers are consistently investing in creating solutions that enhance these capabilities, which in turn, expected to augment the growth of the HPC chipset market over the upcoming years. The requirement to maintain consistent quality, combined with the increasing demand for short product development cycles (PLCs), is not possible to manage in real-time without using suitable tools & advanced technologies.

The outbreak of the COVID-19 pandemic is expected to considerably impact the global HPC market. The growth of the market has hampered as numerous new ventures & projects across the world have been stopped. In addition, end-use industries are confronting with significant challenges due to this pandemic, which may decline the growth of the HPC chipset market. Majorly, manufacturing units & supply chains are disrupted across the world and hence, there is only a temporary impact of the COVID-19 pandemic on the HPC chipset market.

Chip Type Outlook

Based on Chip Type, the market is segmented into Graphic Processing Unit (GPU), Central Processing Unit (CPU), Field Programmable Gate Array (FPGA) and Application Specific Integrated Circuit (ASIC). GPU segment procured the highest revenue of the market in 2019 and is anticipated to grow at a prominent growth rate during the forecast period. The growth of the GPU segment in the HPC chipset industry is supported by the huge parallel processing capability of the graphical processing unit (GPU).

Regional Outlook

Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. The North American region has emerged as the early adopter of new technologies which is fuelled by health technology advancements in the United States & Canada. Many leading players have their presence in the region such as AMD, NVIDIA, HPE, Microsoft, and HPE, the demand for high-performance computing in the region is anticipated to observe considerable growth.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Cisco Systems, Inc., IBM Corporation, Google, Inc., NVIDIA Corporation, Hewlett Packard Enterprise Company, Advanced Micro Devices, Inc., Lattice Semiconductor Corporation, MediaTek, Inc., and Achronix Semiconductor Corporation.

Strategies deployed in High Performance Computing (HPC) Chipset Market

Jan-2021: Intel launched the new N-series 10-nanometer Intel Pentium Silver and Intel Celeron processors. These processors provide an unmatched balance of performance, media and collaboration for education systems.

Nov-2020: IBM signed a joint development agreement with AMD for enhancing and extending the security and Artificial Intelligence (AI) offerings of both the companies. The agreement aimed to expand this vision by building upon open-source software, open standards, and open system architectures for driving 'confidential computing' in hybrid cloud environments.

Oct-2020: AMD completed the acquisition of Xilinx, an American technology company. Both the companies is expected to merge to create a new high-performance computing company. Xilinx’s technology is expected to be integrated into AMD’s products for actualizing a highly integrated CPU+FPGA solution.

Sep-2020: NVIDIA agreed to acquire British chip designer Arm, from SoftBankWe. The acquisition aims to maintain its open-licensing model and customer neutrality, offering customers in any industry, across the world, and is expected to further expand Arm’s IP licensing portfolio with NVIDIA’s world-leading GPU and AI technology.

Nov-2019: Intel introduced the new GPU Architecture with High-Performance Computing and AI Acceleration, and oneAPI Software Stack with Unified and Scalable Abstraction for Heterogeneous Architectures. The company launched its vision for accelerating its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and a new software initiative.

Jun-2019: AMD came into partnership with Samsung Exynos. Following this partnership, Samsung licensed AMD’s Radeon graphics technologies for use in mobile applications including smartphones. Samsung uses ultra-low power high-performance mobile graphics IP based on AMD Radeon graphics technologies for use in its devices.

Scope of the Study

Market Segments covered in the Report:

By Chip Type
  • Graphic Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Field Programmable Gate Array (FPGA)
  • Application Specific Integrated Circuit (ASIC)
By Geography
  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA
Companies Profiled
  • Intel Corporation
  • Cisco Systems, Inc.
  • IBM Corporation
  • Google, Inc.
  • NVIDIA Corporation
  • Hewlett Packard Enterprise Company
  • Advanced Micro Devices, Inc.
  • Lattice Semiconductor Corporation
  • MediaTek, Inc.
  • Achronix Semiconductor Corporation
Unique Offerings from the Publisher
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  • Highest number of market tables and figures
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  • Assured post sales research support with 10% customization free
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Cisco Systems, Inc.
  • Google, Inc.
  • IBM Corporation
  • Intel Corporation
  • MediaTek, Inc.
  • NVIDIA Corporation
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global High Performance Computing (HPC) Chipset Market, by Chip Type
1.4.2 Global High Performance Computing (HPC) Chipset Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Global High Performance Computing (HPC) Chipset Market by Chip Type
3.1 Global Graphic Processing Unit (GPU) High Performance Computing (HPC) Chipset Market by Region
3.2 Global Central Processing Unit (CPU) High Performance Computing (HPC) Chipset Market by Region
3.3 Global Field Programmable Gate Array (FPGA) High Performance Computing (HPC) Chipset Market by Region
3.4 Global Application Specific Integrated Circuit (ASIC) High Performance Computing (HPC) Chipset Market by Region

Chapter 4. Global High Performance Computing (HPC) Chipset Market by Region
4.1 North America High Performance Computing (HPC) Chipset Market
4.1.1 North America High Performance Computing (HPC) Chipset Market by Chip Type
4.1.1.1 North America Graphic Processing Unit (GPU) High Performance Computing (HPC) Chipset Market by Country
4.1.1.2 North America Central Processing Unit (CPU) High Performance Computing (HPC) Chipset Market by Country
4.1.1.3 North America Field Programmable Gate Array (FPGA) High Performance Computing (HPC) Chipset Market by Country
4.1.1.4 North America Application Specific Integrated Circuit (ASIC) High Performance Computing (HPC) Chipset Market by Country
4.1.2 North America High Performance Computing (HPC) Chipset Market by Country
4.1.2.1 US High Performance Computing (HPC) Chipset Market
4.1.2.1.1 US High Performance Computing (HPC) Chipset Market by Chip Type
4.1.2.2 Canada High Performance Computing (HPC) Chipset Market
4.1.2.2.1 Canada High Performance Computing (HPC) Chipset Market by Chip Type
4.1.2.3 Mexico High Performance Computing (HPC) Chipset Market
4.1.2.3.1 Mexico High Performance Computing (HPC) Chipset Market by Chip Type
4.1.2.4 Rest of North America High Performance Computing (HPC) Chipset Market
4.1.2.4.1 Rest of North America High Performance Computing (HPC) Chipset Market by Chip Type
4.2 Europe High Performance Computing (HPC) Chipset Market
4.2.1 Europe High Performance Computing (HPC) Chipset Market by Chip Type
4.2.1.1 Europe Graphic Processing Unit (GPU) High Performance Computing (HPC) Chipset Market by Country
4.2.1.2 Europe Central Processing Unit (CPU) High Performance Computing (HPC) Chipset Market by Country
4.2.1.3 Europe Field Programmable Gate Array (FPGA) High Performance Computing (HPC) Chipset Market by Country
4.2.1.4 Europe Application Specific Integrated Circuit (ASIC) High Performance Computing (HPC) Chipset Market by Country
4.2.2 Europe High Performance Computing (HPC) Chipset Market by Country
4.2.2.1 Germany High Performance Computing (HPC) Chipset Market
4.2.2.1.1 Germany High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.2 UK High Performance Computing (HPC) Chipset Market
4.2.2.2.1 UK High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.3 France High Performance Computing (HPC) Chipset Market
4.2.2.3.1 France High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.4 Russia High Performance Computing (HPC) Chipset Market
4.2.2.4.1 Russia High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.5 Spain High Performance Computing (HPC) Chipset Market
4.2.2.5.1 Spain High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.6 Italy High Performance Computing (HPC) Chipset Market
4.2.2.6.1 Italy High Performance Computing (HPC) Chipset Market by Chip Type
4.2.2.7 Rest of Europe High Performance Computing (HPC) Chipset Market
4.2.2.7.1 Rest of Europe High Performance Computing (HPC) Chipset Market by Chip Type
4.3 Asia Pacific High Performance Computing (HPC) Chipset Market
4.3.1 Asia Pacific High Performance Computing (HPC) Chipset Market by Chip Type
4.3.1.1 Asia Pacific Graphic Processing Unit (GPU) High Performance Computing (HPC) Chipset Market by Country
4.3.1.2 Asia Pacific Central Processing Unit (CPU) High Performance Computing (HPC) Chipset Market by Country
4.3.1.3 Asia Pacific Field Programmable Gate Array (FPGA) High Performance Computing (HPC) Chipset Market by Country
4.3.1.4 Asia Pacific Application Specific Integrated Circuit (ASIC) High Performance Computing (HPC) Chipset Market by Country
4.3.2 Asia Pacific High Performance Computing (HPC) Chipset Market by Country
4.3.2.1 China High Performance Computing (HPC) Chipset Market
4.3.2.1.1 China High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.2 Japan High Performance Computing (HPC) Chipset Market
4.3.2.2.1 Japan High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.3 Taiwan High Performance Computing (HPC) Chipset Market
4.3.2.3.1 Taiwan High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.4 South Korea High Performance Computing (HPC) Chipset Market
4.3.2.4.1 South Korea High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.5 India High Performance Computing (HPC) Chipset Market
4.3.2.5.1 India High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.6 Singapore High Performance Computing (HPC) Chipset Market
4.3.2.6.1 Singapore High Performance Computing (HPC) Chipset Market by Chip Type
4.3.2.7 Rest of Asia Pacific High Performance Computing (HPC) Chipset Market
4.3.2.7.1 Rest of Asia Pacific High Performance Computing (HPC) Chipset Market by Chip Type
4.4 LAMEA High Performance Computing (HPC) Chipset Market
4.4.1 LAMEA High Performance Computing (HPC) Chipset Market by Chip Type
4.4.1.1 LAMEA Graphic Processing Unit (GPU) High Performance Computing (HPC) Chipset Market by Country
4.4.1.2 LAMEA Central Processing Unit (CPU) High Performance Computing (HPC) Chipset Market by Country
4.4.1.3 LAMEA Field Programmable Gate Array (FPGA) High Performance Computing (HPC) Chipset Market by Country
4.4.1.4 LAMEA Application Specific Integrated Circuit (ASIC) High Performance Computing (HPC) Chipset Market by Country
4.4.2 LAMEA High Performance Computing (HPC) Chipset Market by Country
4.4.2.1 Brazil High Performance Computing (HPC) Chipset Market
4.4.2.1.1 Brazil High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.2 Argentina High Performance Computing (HPC) Chipset Market
4.4.2.2.1 Argentina High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.3 UAE High Performance Computing (HPC) Chipset Market
4.4.2.3.1 UAE High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.4 Saudi Arabia High Performance Computing (HPC) Chipset Market
4.4.2.4.1 Saudi Arabia High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.5 South Africa High Performance Computing (HPC) Chipset Market
4.4.2.5.1 South Africa High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.6 Nigeria High Performance Computing (HPC) Chipset Market
4.4.2.6.1 Nigeria High Performance Computing (HPC) Chipset Market by Chip Type
4.4.2.7 Rest of LAMEA High Performance Computing (HPC) Chipset Market
4.4.2.7.1 Rest of LAMEA High Performance Computing (HPC) Chipset Market by Chip Type

Chapter 5. Company Profiles
5.1 Intel Corporation
5.1.1 Company Overview
5.1.2 Financial Analysis
5.1.3 Segmental and Regional Analysis
5.1.4 Research & Development Expenses
5.1.5 Recent strategies and developments:
5.1.5.1 Product Launches and Product Expansions:
5.1.6 SWOT Analysis
5.2 Cisco Systems, Inc.
5.2.1 Company Overview
5.2.2 Financial Analysis
5.2.3 Segmental and Regional Analysis
5.2.4 Research & Development Expense
5.2.5 SWOT Analysis
5.3 IBM Corporation
5.3.1 Company Overview
5.3.2 Financial Analysis
5.3.3 Regional & Segmental Analysis
5.3.4 Research & Development Expenses
5.3.5 Recent strategies and developments:
5.3.5.1 Partnerships, Collaborations, and Agreements:
5.3.6 SWOT Analysis
5.4 Google, Inc.
5.4.1 Company Overview
5.4.2 Financial Analysis
5.4.3 Segmental and Regional Analysis
5.4.4 Research & Development Expense
5.4.5 SWOT Analysis
5.5 NVIDIA Corporation
5.5.1 Company Overview
5.5.2 Financial Analysis
5.5.3 Segmental and Regional Analysis
5.5.4 Research & Development Expense
5.5.5 Recent strategies and developments:
5.5.5.1 Acquisition and Mergers:
5.5.6 SWOT Analysis
5.6 Hewlett Packard Enterprise Company
5.6.1 Company Overview
5.6.2 Financial Analysis
5.6.3 Segmental Analysis
5.6.4 Research & Development Expense
5.6.5 SWOT Analysis
5.7 Advanced Micro Devices, Inc.
5.7.1 Company Overview
5.7.2 Financial Analysis
5.7.3 Segmental and Regional Analysis
5.7.4 Research & Development Expenses
5.7.5 Recent strategies and developments:
5.7.5.1 Acquisition and Mergers:
5.7.5.2 Partnerships, Collaborations, and Agreements:
5.8 Lattice Semiconductor Corporation
5.8.1 Company Overview
5.8.2 Financial Analysis
5.8.3 Regional Analysis
5.8.4 Research & Development Expenses
5.9 MediaTek, Inc.
5.9.1 Company Overview
5.9.2 Financial Analysis
5.9.3 Regional Analysis
5.9.4 Research & Development Expenses
5.10. Achronix Semiconductor Corporation
5.10.1 Company Overview
Note: Product cover images may vary from those shown
  • Intel Corporation
  • Cisco Systems, Inc.
  • IBM Corporation
  • Google, Inc.
  • NVIDIA Corporation
  • Hewlett Packard Enterprise Company
  • Advanced Micro Devices, Inc.
  • Lattice Semiconductor Corporation
  • MediaTek, Inc.
  • Achronix Semiconductor Corporation
Note: Product cover images may vary from those shown

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