Supply chains in the communications industry faced a near perfect storm in 2020 caused by the coronavirus pandemic and U.S.-China trade war. In the first quarter of 2021, those same factors continue to adversely affect the industry, despite the revenue growth brought by WFH (Work-From-Home) and 5G products. If upstream suppliers component shortage causes suppliers of finished products to be unable to deliver orders, most vendors will have to take on potential operational risk. This report looks into some of the reasons the shortage exists, an overview of the impact on the communications equipment, and examines the component supply and shortage in 2021.
List of Topics
- Development of component shortage in 2020, touching on key reasons and impact on equipment manufacturers
- Development of component supply in 2021, touching on key components and the anticipated lead time of key components such as communications ICs, microcontroller ICs, CPU/GPU, panel, and printed circuit boards, memory ICs, power management ICs, and MLCC, and companies affected are also included.
- Leading chipmakers and brands views on component shortage, including Foxconn, Nokia, Intel, Qualcomm, and Broadcom
- Possible development of key component shortage in 2021 and beyond
Table of Contents
1. Component Shortage in the Communications Sector in 2020
1.1 The Key Reasons for the Shortage
1.2 The Impact on Communications Equipment Makers
2. Component Supply in 2021
2.1 The Current Supply Status of Key Components
2.2 Shortage Impact on Communications Equipment
3. Analyst's Perspective
Appendix
Glossary of Terms
List of Companies
List of Tables
Table 1. Lead-Time of Communication Chips and Key Components (as of the end of March 2021)
Table 2. Comments of Leading Brands on Component Shortage
List of Figures
Figure 1 Diagram of the Impact of COVID-19 on Broadband Traffic
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ADI
- AMD
- Anpec Electronics
- AT&T
- Broadcom
- Compeq
- Dell
- Elan
- Ericsson
- Foxconn
- Global Mixed-mode Technology
- HiSilicon
- Holtek
- Huawei
- Infineon
- Intel
- MediaTek
- Micron
- Microsoft
- Murata
- Nanya
- Nokia
- Nuvoton
- Nvidia
- NXP
- Oppo
- Qualcomm
- Realtek
- Samsung
- Semco
- SG Micro
- Silergy
- SK Hynix
- Taiyo Yuden
- TI
- TTM
- Unimicron
- Vivo
- Walsin Technology
- Winbond
- Xiaomi
- Yageo
- ZTE
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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