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Global Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), Application (RF Devices, MEMS & Sensors, LED, 3D NAND, CMOS Image Sensors), Process Type, Technology, and Region - Forecast to 2026

  • ID: 5437848
  • Report
  • September 2021
  • Region: Global
  • 201 Pages
  • Markets and Markets
Global Semiconductor Bonding Market is Forecast to Reach $1.06 Billion by 2026, Growing at a CAGR of 3.6% Between 2021 to 2026

FEATURED COMPANIES

  • ASM Pacific Technology
  • Canon Anelva Corporation
  • Finetech
  • Panasonic
  • Shinkawa Ltd.
  • Tokyo Electron Limited

The global semiconductor bonding market was valued at USD 887 million in 2021 and is anticipated to reach USD 1,059 million by 2026, growing at a CAGR of 3.6% between 2021 to 2026. The growing demand for semiconductor bonding in applications such as electric and hybrid vehicles is driving the growth of semiconductor bonding market.

The semiconductor industry plays a vital role in electric and hybrid vehicles. The key components required in electric and hybrid vehicles include power semiconductor devices such as freewheeling diodes, ICs, MEMS, voltage boost DC-DC converters, fuel cell air compressors, motor drives, insulated gate bipolar transistors (IGBTs), and low-voltage power MOSFETs. Innovations in automobiles to build energy-efficient and environment-friendly vehicles have increased the demand for semiconductor devices such as ICs and sensors. Automobile companies also focus on using system on chip (SoC), which offers faster control and secure communication.

To reduce carbon emissions, the use of electric and hybrid vehicles is expanding gradually in some countries because of government support and substantial investments from the automotive industry. Advanced electric cars provided by some of the key car manufacturers, such as Bayerische Motoren Werke AG (BMW) (Germany), Ford Motor Company (US), and Toyota Motor Corporation (Japan), and the initiatives by several countries to reduce carbon emissions have increased the use of hybrid and electric vehicles. As more semiconductor devices are used in electric vehicles, the demand for semiconductor bonding equipment is expected to increase.

According to the International Energy Agency, the adoption of electric vehicles is continuously increasing across the globe, and their demand is expected to grow rapidly in the coming years. According to the Bloomberg New Energy Finance report, the sales of electric vehicles are estimated to grow to 41 million by 2040, thereby leading to a rise in the demand for electronic components used in electric vehicles.

Advanced systems, such as idling stop systems (ISS), would result in the growth in the semiconductor content in traditional fuel-based vehicles. For instance, in 2014, ROHM Semiconductor developed high-performance microcontrollers for various automotive systems, especially in electric and hybrid vehicles. Such advancements in the automotive sector increase the demand for semiconductor devices, subsequently driving the growth of the semiconductor bonding market.

Growing adoption of IoT and AI in automotive sector

The advent of Industry 4.0 and technologies such as IoT and AI in the automotive sector would contribute significantly toward the growth of the semiconductor bonding market. The increasing demand for vehicle connectivity would encourage new developments in the industry. With ongoing trends such as touch-free human-machine interfaces revolutionizing the automotive sector, there is a growing significance of connected cars.

According to a report published by the GSM Association (GSMA) in 2019, the number of IoT connections is projected to reach 24.6 billion globally by 2025. Integration of IoT in automotive safety and communication technologies is one of the major reasons for the anticipated growth of IoT connections. The introduction of technologies such as advanced driver assistance systems (ADAS), adaptive cruise control, and intelligent parking assistance systems would further drive the market growth.

Cellular IoT connectivity and AI play a vital role in automotive and transportation sectors, with major use cases being shared mobility, autonomous vehicles, connected vehicles, telematics, smart public transportation, and C-V2sx vehicles. The development of smart infrastructures such as smart cities and intelligent transportation systems would accelerate the implementation of AI and IoT technologies in automotive and transportation. As per the analyst, the connected car market is expected to grow from USD 53.9 billion in 2019 to USD 166 billion by 2025; it is anticipated to register a CAGR of 25.2% during 2020-2025.

The implementation of IoT and AI technologies in automobiles is leading to the integration of a large number of intelligent sensors and actuators, as well as AI chips such as ADAS, LiDAR, and neuromorphic chips. These components do not use standard packaging, as different customers have different packaging designs. The manufacturing process of these components comprises high-precision dispensing and stamping of epoxy. Some use eutectic and ultraviolet (UV) processes. This necessitates the demand for flexible multi-die and multi-process die bonding machines with high speed and high accuracy.

Asia-Pacific is the fastest-growing region in the semiconductor bonding market

In 2020, APAC accounted for a 62.6% share of the global semiconductor bonding market. The growth of the semiconductor bonding in APAC is attributed to the presence of several OSAT players in China and Taiwan. The region also houses semiconductor fabrication facilities of a few of the major IDMs, such as Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea). Samsung (South Korea), Texas Instruments (US). ASM Pacific Technology Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among the major players in this market that have their headquarters in APAC.

Research Coverage

The report segments the semiconductor bonding market and forecasts its size, by volume and value, based on region (North America, Europe, Asia Pacific, and RoW), Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder and Flip Chip Bonder), Application (RF Devices, MEMS & Sensors, LED, 3D NAND, CMOS Image Sensors), Process Type (Die-to-die bonding, Die-to wafer bonding, Wafer-to-wafer bonding), Technology (Die bonding technology (Eutectic Die Bonding (Epoxy Die Bonding, Flip Chip Attachment, Hybrid Bonding (for 3D-NAND)) and Wafer Bonding Technology (Direct Wafer Bonding, Anodic Wafer Bonding, TCB Wafer Bonding, Hybrid Bonding, Others)). The report also provides a comprehensive review of market drivers, restraints, opportunities, and challenges in the semiconductor bonding market. The report also covers qualitative aspects in addition to the quantitative aspects of these markets.

The breakup of primaries conducted during the study is depicted below:

  • By Company Type: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 - 23%
  • By Designation: C-Level Executives - 30%, Directors - 45%, and Others - 25%
  • By Region: North America - 26%, Europe - 40%, APAC - 22% and RoW - 12%

Key Benefits of Buying This Report

  • This report includes market statistics pertaining to the process type, type, application, technology and region
  • An in-depth value chain analysis has been done to provide deep insight into the semiconductor bonding market
  • Major market drivers, restraints, challenges, and opportunities have been detailed in this report
  • Illustrative segmentation, analyses, and forecasts for the market based on process type, type, application, technology, and region have been conducted to provide an overall view of the semiconductor bonding market
  • The report includes an in-depth analysis and ranking of key players
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • ASM Pacific Technology
  • Canon Anelva Corporation
  • Finetech
  • Panasonic
  • Shinkawa Ltd.
  • Tokyo Electron Limited

1 Introduction
1.1 Study Objectives
1.2 Market Definition and Scope
1.2.1 Inclusions and Exclusions
1.3 Scope
1.3.1 Markets Covered
1.3.2 Years Considered
1.4 Currency
1.5 Limitations
1.6 Stakeholders

2 Research Methodology
2.1 Research Data
Figure 1 Semiconductor Bonding Equipment Market: Research Design
2.1.1 Secondary Data
2.1.1.1 Secondary Sources
2.1.2 Primary Data
2.1.2.1 Primary Sources
2.1.2.2 Breakdown of Primary Interviews
2.2 Market Size Estimation
Figure 2 Market Size Estimation Methodology: Approach 3 - Bottom-Up Market Estimation for Semiconductor Bonding Equipment, by Type
2.2.1 Bottom-Up Approach
2.2.1.1 Approach for Estimating Market Size by Bottom-Up Approach (Demand Side)
Figure 3 Market Size Estimation Methodology: Bottom-Up Approach
2.2.2 Top-Down Approach
2.2.2.1 Approach for Estimating Market Size by Top-Down Approach (Supply Side)
Figure 4 Market Size Estimation Methodology: Top-Down Approach
2.3 Market Breakdown and Data Triangulation
Figure 5 Data Triangulation
2.4 Assumptions
Figure 6 Assumptions for the Research Study
2.5 Risk Assessment
2.6 Limitations
2.7 Primary Insights
Table 1 Market Forecasting Methodology Adopted from 2019 to 2026

3 Executive Summary
Figure 7 Market for Wafer Bonder to Grow at Highest CAGR During 2021-2026
Figure 8 Semiconductor Bonding Market for LED to Grow at Highest CAGR During 2021-2026
Figure 9 APAC to be Fastest-Growing Regional Market for Semiconductor Bonding During Forecast Period
3.1 Impact of COVID-19 on Semiconductor Bonding Market
Figure 10 Impact of COVID-19 on Semiconductor Bonding Market, 2018-2026 (USD Million)
3.2 Pre-COVID-19
3.3 Pessimistic Scenario (Post-COVID-19)
3.4 Optimistic Scenario (Post-COVID-19)
3.5 Realistic Scenario (Post-COVID-19)

4 Premium Insights
4.1 Attractive Opportunities in Semiconductor Bonding Market
Figure 11 Rising Need for 3D Chips is Acting as Potential Opportunity for Market
4.2 Semiconductor Bonding Market, by Type
Figure 12 Market for Wafer Bonder to Grow at Higher CAGR During Forecast Period
4.3 Market for Cloud Semiconductor Bonding, by Country
Figure 13 Semiconductor Bonding Market in Japan to Grow at Highest CAGR During Forecast Period
4.4 Semiconductor Bonding Market in APAC in 2026, by Country & Application
Figure 14 LED to Hold Largest Share of Semiconductor Bonding Market in APAC in 2026
4.5 Semiconductor Bonding Market, by Application
Figure 15 Market for LED to Grow at Highest CAGR Between 2021 and 2026

5 Market Overview
5.1 Introduction
5.2 Market Dynamics
Figure 16 Growing Demand for Miniaturization of Electronic Devices to Drive Semiconductor Bonding Market
5.2.1 Drivers
5.2.1.1 Growing Demand for Miniature Electronic Components
Figure 17 MEMS Market, 2017-2020 (USD Million)
5.2.1.2 Increasing Adoption of Stacked Die Technology in IoT Devices
Figure 18 Industrial IoT Market, by Device and Technology, 2017-2020 (USD Billion)
5.2.1.3 Rising Demand for Electric and Hybrid Vehicles
Figure 19 Electric Vehicle Sales, 2013-2018 (Million Units)
Figure 20 Semiconductor Bonding Market Drivers and Their Impact
5.2.2 Restraints
5.2.2.1 High Cost of Ownership
Figure 21 Semiconductor Bonding Market Restraints and Their Impact
5.2.3 Opportunities
5.2.3.1 Increasing Demand for 3D Semiconductor Assembly and Packaging
Table 2 Semiconductor Manufacturing Equipment Market for 3D ICS, 2020-2025 (USD Million)
5.2.3.2 Expanding IC Industry in China
Table 3 China's Provinces Have Significant Investment in Chip Funds (As of June 2020)
5.2.3.3 Growing Adoption of IoT and AI in Automotive Sector
Figure 22 Projected IoT Connections by 2025 (Billion)
Figure 23 Semiconductor Bonding Market Opportunities and Their Impact
5.2.4 Challenges
5.2.4.1 Mechanical Unbalance of Moving Parts and Thin Wafers Being Volatile and Susceptible to Damage Caused by Pressure or Stress
5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuits
Figure 24 Semiconductor Bonding Market Challenges and Their Impact
5.3 Value Chain Analysis
5.3.1 Semiconductor Bonding Value Chain
Figure 25 Value Chain of Semiconductor Bonding Market: Major Value is Added by Semiconductor Bonding Equipment Providers
5.3.2 Asp Analysis
Table 4 Average Selling Prices of Different Types of Bonding Machines
5.3.3 Regulations
5.3.4 Exports-Imports Regulations
5.3.5 Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE)
5.3.6 Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH)
5.4 Ecosystem
Table 5 Ecosystem Players
5.5 Technology Analysis
5.5.1 MEMS and MOEMS
5.5.2 Wafer Bonding
5.5.3 Die Bonding
5.5.4 Soft Solder
5.6 Case Studies
5.6.1 Latest Die Bonding Solutions for Photonics Manufacturing
5.6.2 MRSI Solves One of Greatest Challenges in Modern Photonics Manufacturing
5.6.3 Quick Setting RFID Tag Bonding - Glutag Bonding
5.6.4 World's First 300 MM Compatible 3D-Integrated LSI Room Temperature Wafer Bonding Device
5.7 Patents Analysis
Figure 26 Key Patent Holders During 2010-2020
Table 6 List of Patents
5.8 Porter's Five Forces Analysis
Table 7 Semiconductor Bonding Market: Porter's Five Forces Analysis
5.8.1 Bargaining Power of Suppliers
5.8.2 Bargaining Power of Buyers
5.8.3 Threat of New Entrants
5.8.4 Threat of Substitutes
5.8.5 Intensity of Competitive Rivalry
Table 8 Impact of Each Force on Market, 2020 Vs. 2026
5.9 Trends/Disruptions Impacting Customer's Business
Figure 27 Revenue Shift for Semiconductor Bonding Market
5.10 Trade Analysis
Table 9 Imports Data for Machines and Apparatuses Used for Manufacturing Semiconductor Devices or Electronic Integrated Circuits, by Country, 2015-2019 (USD Million)
Table 10 Exports Data of Machines and Apparatuses Used for Manufacturing Semiconductor Devices or Electronic Integrated Circuits, by Country, 2015-2019 (USD Million)

6 Semiconductor Bonding Market, by Process Type
6.1 Introduction
Figure 28 Die-To-Wafer Bonding is Expected to Grow at Highest Rate Between 2021 and 2026
Table 11 Semiconductor Bonding Market Size, by Process Type, 2018-2020 (USD Million)
Table 12 Semiconductor Bonding Market Size, by Process Type, 2021-2026 (USD Million)
6.2 Die-To-Die Bonding
6.2.1 Die-To-Die Bonding Segment is Expected to Grow at 4.3% CAGR
Table 13 Semiconductor Bonding Market Size for Die-To-Die Bonding, by Region, 2018-2020 (USD Million)
Table 14 Semiconductor Bonding Market Size for Die-To-Die Bonding, by Region, 2021-2026 (USD Million)
6.3 Die-To-Wafer Bonding
6.3.1 Several Different Die-To-Wafer Bonding Approaches are Being Considered for Heterogeneous Integration
Table 15 Types of Die-To-Wafer Bonding
Table 16 Semiconductor Bonding Market Size for Die-To-Wafer Bonding, by Region, 2018-2020 (USD Million)
Table 17 Semiconductor Bonding Market Size for Die-To-Wafer Bonding, by Region, 2021-2026 (USD Million)
6.4 Wafer-To-Wafer Bonding
6.4.1 Wafer-To-Wafer is Used for Applications Such as CMOS Image Sensors and Various Memory and Logic Technologies
Table 18 Semiconductor Bonding Market Size for Wafer-To-Wafer Bonding, by Region, 2018-2020 (USD Million)
Table 19 Semiconductor Bonding Market Size for Wafer-To-Wafer Bonding, by Region, 2021-2026 (USD Million)

7 Semiconductor Bonding Market, by Technology
7.1 Introduction
7.2 Die Bonding
Figure 29 Epoxy Die Bonding Technology is Projected to Hold Largest Market Share During Forecast Period
Table 20 Die Bonding Market, by Technology, 2018-2020 (USD Million)
Table 21 Die Bonding Market, by Technology, 2021-2026 (USD Million)
7.2.1 Epoxy Die Bonding
7.2.1.1 Epoxy Bonding to Account for Largest Share of Die Bonder Equipment Market due to Low Cost and Low Curing Temperature
7.2.2 Eutectic Die Bonding
7.2.2.1 Eutectic Die Bonding is Primarily Used for Fabrication of Electronic Components
7.2.3 Flip Chip Attachment
7.2.3.1 Flip Chip Attachment Method is Used for Making Electrical Connections to Chips
7.2.4 Hybrid Bonding (For 3D NAND)
7.2.4.1 Main Application of Hybrid Bonding is in Advanced 3D Device Stacking
7.3 Wafer Bonding
Figure 30 Market for Hybrid Bonding Technology to Grow at Highest CAGR During Forecast Period
Table 22 Wafer Bonding Market, by Technology, 2018-2020 (USD Million)
Table 23 Wafer Bonding Market, by Technology, 2021-2026 (USD Million)
7.3.1 Direct Wafer Bonding
7.3.1.1 Direct Wafer Bonding Offers Strong Connection due to Covalent Forces
Figure 31 Direct Wafer Bonding Process Flow
7.3.2 Anodic Wafer Bonding
7.3.2.1 Anodic Wafer Bonding Offers Advantage of Wide Process Window, Which Helps in MEMS Fabrication
Figure 32 Anodic Wafer Bonding Process Flow
Table 24 Differences Between Direct Wafer Bonding and Anodic Wafer Bonding
7.3.3 TCB Wafer Bonding
7.3.3.1 Metals Such as AU, CU, or AL are Used for Metal Thermocompression Bonding
Figure 33 Metal Thermocompression Wafer Bonding Process Flow
7.3.4 Hybrid Bonding
7.3.4.1 Xperi Has Developed New Version of Its Hybrid Bonding Technology

8 Semiconductor Bonding Market, by Type
8.1 Introduction
Figure 34 Wafer Bonder Segment is Expected to Grow at Highest CAGR Between 2021 and 2026
Table 25 Semiconductor Bonding Market Size, by Type, 2018-2020 (Million Unit)
Table 26 Semiconductor Bonding Market Size, by Type, 2021-2026 (Million Units)
Table 27 Semiconductor Bonding Market Size, by Type, 2018-2020 (USD Million)
Table 28 Semiconductor Bonding Market Size, by Type, 2021-2026 (USD Million)
8.2 Die Bonder
8.2.1 Manual Die Bonders
8.2.1.1 Manual Die Bonders Play Significant Role in R&D, Testing, and Prototyping Applications
8.2.2 Semiautomatic Die Bonders
8.2.2.1 Semiautomatic Die Bonders are Flexible and Easy to Use
8.2.3 Fully Automatic Die Bonders
8.2.3.1 Fully Automatic Die Bonders are Expected to Gain More Market Traction
Table 29 Semiconductor Bonding Market Size for Die Bonder, by Region, 2018-2020 (USD Million)
Table 30 Semiconductor Bonding Market Size for Die Bonder, by Region, 2021-2026 (USD Million)
8.3 Wafer Bonder
8.3.1 UV-Release Adhesives, Thermal-Release Adhesives, and Solvent-Release Adhesives are Used in Wafer Bonding
Table 31 Semiconductor Bonding Market Size for Wafer Bonder, by Region, 2018-2020 (USD Million)
Table 32 Semiconductor Bonding Market Size for Wafer Bonder, by Region, 2021-2026 (USD Million)
8.4 Flip Chip Bonder
8.4.1 Flip Chip Bonding Can Offer Several Advantages Over Other Interconnection Processes
Table 33 Semiconductor Bonding Market Size for Flip Chip Bonder, by Region, 2018-2020 (USD Million)
Table 34 Semiconductor Bonding Market Size for Flip Chip Bonder, by Region, 2021-2026 (USD Million)

9 Semiconductor Bonding Market, by Application
9.1 Introduction
Figure 35 LED Application Segment to Grow at Highest Rate Between 2021 and 2026
Table 35 Semiconductor Bonding Market Size, by Application, 2018-2020 (USD Million)
Table 36 Semiconductor Bonding Market Size, by Application, 2021-2026 (USD Million)
9.2 MEMS and Sensors
9.2.1 Growth is Driven by High Demand from Consumer Electronics Manufacturers and Adoption of Patient Monitoring Solutions During COVID-19 Pandemic
Table 37 Semiconductor Bonding Market Size for MEMS and Sensors, by Region, 2018-2020 (USD Million)
Table 38 Semiconductor Bonding Market Size for MEMS and Sensors, by Region, 2021-2026 (USD Million)
9.3 CMOS Image Sensors (CIS)
9.3.1 Increasing Demand from Automotive Vertical is Expected to Drive Demand for CIS
Table 39 Semiconductor Bonding Market Size for CIS, by Region, 2018-2020 (USD Million)
Table 40 Semiconductor Bonding Market Size for CIS, by Region, 2021-2026 (USD Million)
9.4 Radiofrequency (RF) Devices
9.4.1 Increasing Demand for RF Devices for Smartphones to Drive Semiconductor Bonding Market
Table 41 Semiconductor Bonding Market Size for RF Devices, by Region, 2018-2020 (USD Million)
Table 42 Semiconductor Bonding Market Size for RF Devices, by Region, 2021-2026 (USD Million)
9.5 LED
9.5.1 Increasing Demand for LED Components in Home and Infrastructure Market to Augment Growth During Forecast Period
Table 43 Semiconductor Bonding Market Size for LED, by Region, 2018-2020 (USD Million)
Table 44 Semiconductor Bonding Market Size for LED, by Region, 2021-2026 (USD Million)
9.6 3D NAND
Table 45 Semiconductor Bonding Market Size for 3D NAND, by Region, 2018-2020 (USD Million)
Table 46 Semiconductor Bonding Market Size for 3D NAND, by Region, 2021-2026 (USD Million)

10 Geographic Analysis
10.1 Introduction
Figure 36 Semiconductor Bonding in APAC to Grow at Highest CAGR During Forecast Period
Table 47 Semiconductor Bonding Market, by Region, 2018-2020 (USD Million)
Table 48 Semiconductor Bonding Market, by Region, 2021-2026 (USD Million)
10.2 APAC
Figure 37 APAC: Semiconductor Bonding Market Snapshot
Table 49 Semiconductor Bonding Market in APAC, by Type, 2018-2020 (USD Million)
Table 50 Semiconductor Bonding Market in APAC, by Type, 2021-2026 (USD Million)
Table 51 Semiconductor Bonding Market in APAC, by Process Type, 2018-2020 (USD Million)
Table 52 Semiconductor Bonding Market in APAC, by Process Type, 2021-2026 (USD Million)
Table 53 Semiconductor Bonding Market in APAC, by Application, 2018-2020 (USD Million)
Table 54 Semiconductor Bonding Market in APAC, by Application, 2021-2026 (USD Million)
Table 55 Semiconductor Bonding Market in APAC, by Die Bonding Technology, 2018-2020 (USD Million)
Table 56 Semiconductor Bonding Market in APAC, by Die Bonding Technology, 2021-2026 (USD Million)
Table 57 Semiconductor Bonding Market in APAC, by Wafer Bonding Technology, 2018-2020 (USD Million)
Table 58 Semiconductor Bonding Market in APAC, by Wafer Bonding Technology, 2021-2026 (USD Million)
Table 59 Semiconductor Bonding Market in APAC, by Country, 2018-2020 (USD Million)
Table 60 Semiconductor Bonding Market in APAC, by Country, 2021-2026 (USD Million)
10.2.1 Taiwan
10.2.1.1 Presence of Many Key OSAT Companies Drives Market Growth in Taiwan
10.2.2 China
10.2.2.1 Growing Trend of Miniaturization of Consumer Electronic Products Spurs Market Growth in China
10.2.3 Japan
10.2.3.1 Increasing Demand for Passenger Cars and Commercial Vehicles and Expanding Presence of Market Players in Country Fuel Market Growth in Japan
10.2.4 South Korea
10.2.4.1 South Korea to Continue to Account for Largest Market Size in APAC During 2021-2026
10.2.5 Rest of APAC
10.2.5.1 Strong Presence of Semiconductor Bonding Manufacturers Accelerates Market Growth in Rest of APAC
10.3 Americas
Figure 38 Americas: Semiconductor Bonding Market Snapshot
Table 61 Semiconductor Bonding Market in Americas, by Type, 2018-2020 (USD Million)
Table 62 Semiconductor Bonding Market in Americas, by Type, 2021-2026 (USD Million)
Table 63 Semiconductor Bonding Market in Americas, by Process Type, 2018-2020 (USD Million)
Table 64 Semiconductor Bonding Market in Americas, by Process Type, 2021-2026 (USD Million)
Table 65 Semiconductor Bonding Market in Americas, by Application, 2018-2020 (USD Million)
Table 66 Semiconductor Bonding Market in Americas, by Application, 2021-2026 (USD Million)
Table 67 Semiconductor Bonding Market in Americas, by Die Bonding Technology, 2018-2020 (USD Million)
Table 68 Semiconductor Bonding Market in Americas, by Die Bonding Technology, 2021-2026 (USD Million)
Table 69 Semiconductor Bonding Market in Americas, by Wafer Bonding Technology, 2018-2020 (USD Million)
Table 70 Semiconductor Bonding Market in Americas, by Wafer Bonding Technology, 2021-2026 (USD Million)
Table 71 Semiconductor Bonding Market in Americas, by Country, 2018-2020 (USD Million)
Table 72 Semiconductor Bonding Market in Americas, by Country, 2021-2026 (USD Million)
10.3.1 US
10.3.1.1 US to Continue to Lead Semiconductor Bonding Market in Americas During 2021-2026
10.3.2 Canada
10.3.2.1 Ongoing Government Initiatives Toward Development of Electric Vehicle Infrastructure to Create Market Opportunities in Near Future
10.3.3 Rest of Americas
10.3.3.1 Increasing Demand for IoT and 5G is Boosting Demand for Die Bonding Equipment in Rest of Americas
10.4 Europe
Figure 39 Europe: Semiconductor Bonding Market Snapshot
Table 73 Semiconductor Bonding Market in Europe, by Type, 2018-2020 (USD Million)
Table 74 Semiconductor Bonding Market in Europe, by Type, 2021-2026 (USD Million)
Table 75 Semiconductor Bonding Market in Europe, by Process Type, 2018-2020 (USD Million)
Table 76 Semiconductor Bonding Market in Europe, by Process Type, 2021-2026 (USD Million)
Table 77 Semiconductor Bonding Market in Europe, by Application, 2018-2020 (USD Million)
Table 78 Semiconductor Bonding Market in Europe, by Application, 2021-2026 (USD Million)
Table 79 Semiconductor Bonding Market in Europe, by Die Bonding Technology, 2018-2020 (USD Million)
Table 80 Semiconductor Bonding Market in Europe, by Die Bonding Technology, 2021-2026 (USD Million)
Table 81 Semiconductor Bonding Market in Europe, by Wafer Bonding Technology, 2018-2020 (USD Million)
Table 82 Semiconductor Bonding Market in Europe, by Wafer Bonding Technology, 2021-2026 (USD Million)
Table 83 Semiconductor Bonding Market in Europe, by Country, 2018-2020 (USD Million)
Table 84 Semiconductor Bonding Market in Europe, by Country, 2021-2026 (USD Million)
10.4.1 Germany
10.4.1.1 Adoption of Smart Homes and Connected Cars to Spur Demand in Germany
10.4.2 UK
10.4.2.1 Deployment of 5G Infrastructure is Fueling Market Growth in UK
10.4.3 France
10.4.3.1 Developed Communication Network Has Prompted Market Growth in France
10.4.4 Ireland
10.4.4.1 Presence of Intel's Fab Primarily Drives Market Growth in Ireland
10.4.5 Italy
10.4.5.1 Technology Enhancements by Players such as STMicroelectronics Surge Growth of Semiconductor Manufacturing Equipment Market in Italy
10.4.6 Rest of Europe
10.4.6.1 Initiatives of Semiconductor Bonding Manufacturers to Propel Market Growth in Rest of Europe
10.5 RoW
Table 85 Semiconductor Bonding Market in RoW, by Type, 2018-2020 (USD Million)
Table 86 Semiconductor Bonding Market in RoW, by Type, 2021-2026 (USD Million)
Table 87 Semiconductor Bonding Market in RoW, by Process Type, 2018-2020 (USD Million)
Table 88 Semiconductor Bonding Market in RoW, by Process Type, 2021-2026 (USD Million)
Table 89 Semiconductor Bonding Market in RoW, by Application, 2018-2020 (USD Million)
Table 90 Semiconductor Bonding Market in RoW, by Application, 2021-2026 (USD Million)
Table 91 Semiconductor Bonding Market in RoW, by Die Bonding Technology, 2018-2020 (USD Million)
Table 92 Semiconductor Bonding Market in RoW, by Die Bonding Technology, 2021-2026 (USD Million)
Table 93 Semiconductor Bonding Market in RoW, by Wafer Bonding Technology, 2018-2020 (USD Million)
Table 94 Semiconductor Bonding Market in RoW, by Wafer Bonding Technology, 2021-2026 (USD Million)
Table 95 Semiconductor Bonding Market in RoW, by Region, 2018-2020 (USD Million)
Table 96 Semiconductor Bonding Market in RoW, by Region, 2021-2026 (USD Million)

11 Competitive Landscape
11.1 Introduction
11.2 Revenue Analysis
Figure 40 Revenue Analysis of Top Three Companies, 2020
11.3 Market Share Analysis, 2020
Table 97 Semiconductor Bonding Market: Market Share Analysis (2020)
11.4 Key Player Strategies/Right to Win
11.4.1 Overview of Strategies Deployed by Key Semiconductor Bonding Companies
11.5 Competitive Leadership Mapping
11.5.1 Star
11.5.2 Emerging Leader
11.5.3 Pervasive
11.5.4 Participant
Figure 41 Semiconductor Bonding Market: Competitive Leadership Mapping, 2020
11.5.5 Semiconductor Bonding Market: Type Footprint
Table 98 Company Footprint
Table 99 Application Footprint of Companies
Table 100 Regional Footprint of Companies
11.6 Competitive Situations and Trends
11.6.1 Semiconductor Bonding Market: Product Launches, January 2018 - April 2021
11.6.2 Semiconductor Bonding Market: Deals, January 2018 - April 2021

12 Company Profiles
(Business Overview, Products/Services Offered, Recent Developments, and Analyst's View (Key Strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
12.1 Introduction
12.2 Key Players
12.2.1 ASM Pacific Technology
Figure 42 ASM Pacific Technology: Company Snapshot
12.2.2 Besi
Figure 43 Besi: Company Snapshot
12.2.3 Panasonic
Figure 44 Panasonic: Company Snapshot
12.2.4 Fasford Technology
Figure 45 Fuji Corporation: Company Snapshot
12.2.5 Shinkawa Ltd.
Figure 46 Yamaha Motor Robotics Holding Co: Company Snapshot
12.2.6 EV Group (EVG)
12.2.7 SUSS MicroTech SE
Figure 47 SUSS MicroTech SE: Company Snapshot
12.2.8 Kulicke & Soffa Industries
Figure 48 Kulicke & Soffa Industries: Company Snapshot
12.2.9 Palomar Technologies
12.2.10 Shibaura Mechatronics
Figure 49 Shibaura Mechatronics: Company Snapshot
12.3 Other Key Players
12.3.1 TDK Corporation
12.3.2 Tokyo Electron Limited
12.3.3 Mitsubishi Heavy Industries Machine Tools
12.3.4 Mycronic Group
12.3.5 Intel
12.3.6 Samsung
12.3.7 Canon Anelva Corporation
12.3.8 Finetech
12.3.9 Dr. Tresky
12.3.10 SET Corporation SA
12.3.11 Tokyo Ohka Koygo
12.3.12 BondTech
12.3.13 Ayumi Industries
12.3.14 Applied Microengineering Limited
12.3.15 Taiwan Semiconductor Manufacturing Company (TSMC)
12.3.16 Toray Engineering
*Details on Business Overview, Products/Services Offered, Recent Developments, and Analyst's View (Key Strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) Might Not be Captured in Case of Unlisted Companies

13 Appendix
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Knowledge Store: The Subscription Portal
13.4 Available Customizations

Note: Product cover images may vary from those shown
  • Applied Microengineering Limited
  • ASM Pacific Technology
  • Ayumi Industries
  • Besi
  • BondTech
  • Canon Anelva Corporation
  • Dr. Tresky
  • EV Group (EVG)
  • Fasford Technology
  • Finetech
  • Intel
  • Kulicke & Soffa Industries
  • Mitsubishi Heavy Industries Machine Tools
  • Mycronic Group
  • Palomar Technologies
  • Panasonic
  • Samsung
  • SET Corporation SA
  • Shibaura Mechatronics
  • Shinkawa Ltd.
  • STMicroelectronics
  • SUSS MicroTech SE
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • TDK Corporation
  • Tokyo Electron Limited
  • Tokyo Ohka Koygo
  • Toray Engineering
  • Xperi
Note: Product cover images may vary from those shown

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