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Global Fan-out Wafer Level Packaging Market 2021-2025- Product Image
Global Fan-out Wafer Level Packaging Market 2021-2025- Product Image

Global Fan-out Wafer Level Packaging Market 2021-2025

  • ID: 5454759
  • Report
  • August 2021
  • Region: Global
  • 120 Pages
  • TechNavio
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

The publisher has been monitoring the fan-out wafer level packaging market and it is poised to grow by $ 1.60 bn during 2021-2025, decelerating at a CAGR of 14.29% during the forecast period. This report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increased demand for compactly designed electronics and the growing use of semiconductor ICs in IoT. In addition, the increased demand for compactly designed electronics is anticipated to boost the growth of the market as well.

The fan-out wafer level packaging market analysis includes the technology segment and geographic landscape.

The publisher's fan-out wafer level packaging market is segmented as below:


By Technology

  • High density
  • Standard density

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • MEA
This study identifies the rapid adoption of FinFET technology as one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. This report on fan-out wafer level packaging market covers the following areas:

  • Fan-out wafer level packaging market sizing
  • Fan-out wafer level packaging market forecast
  • Fan-out wafer level packaging market industry analysis
The publisher's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading fan-out wafer level packaging market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd. Also, the fan-out wafer level packaging market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The publisher's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
Executive Summary
  • Market overview
Market Landscape
  • Market ecosystem
  • Value chain analysis
Market Sizing
  • Market definition
  • Market segment analysis
  • Market size 2020
  • Market outlook: Forecast for 2020 - 2025
Five Forces Analysis
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition
Market Segmentation by Technology
  • Market segments
  • Comparison by Technology
  • High density - Market size and forecast 2020-2025
  • Standard density - Market size and forecast 2020-2025
  • Market opportunity by Technology
Customer landscape
  • Customer landscape
Geographic Landscape
  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2020-2025
  • North America - Market size and forecast 2020-2025
  • Europe - Market size and forecast 2020-2025
  • South America - Market size and forecast 2020-2025
  • MEA - Market size and forecast 2020-2025
  • Key leading countries
  • Market opportunity By Geographical Landscape
  • Market drivers
  • Market challenges
  • Market trends
Vendor Landscape
  • Overview
  • Landscape disruption
Vendor Analysis
  • Vendors covered
  • Market positioning of vendors
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • Cypress Semiconductor Corp.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
Appendix
  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

Exhibits
1: Key Finding 1
2: Key Finding 2
3: Key Finding 3
4: Key Finding 5
5: Key Finding 6
6: Key Finding 7
7: Key Finding 8
8: Parent market
9: Market characteristics
10: Offerings of vendors included in the market definition
11: Market segments
12: Global - Market size and forecast 2020 - 2025 ($ million)
13: Global market: Year-over-year growth 2020 - 2025 (%)
14: Five forces analysis 2020 & 2025
15: Bargaining power of buyers
16: Bargaining power of suppliers
17: Threat of new entrants
18: Threat of substitutes
19: Threat of rivalry
20: Market condition - Five forces 2020
21: Technology - Market share 2020-2025 (%)
22: Comparison by Technology
23: High density - Market size and forecast 2020-2025 ($ million)
24: High density - Year-over-year growth 2020-2025 (%)
25: Standard density - Market size and forecast 2020-2025 ($ million)
26: Standard density - Year-over-year growth 2020-2025 (%)
27: Market opportunity by Technology
28: Customer landscape
29: Market share By Geographical Landscape 2020-2025 (%)
30: Geographic comparison
31: APAC - Market size and forecast 2020-2025 ($ million)
32: APAC - Year-over-year growth 2020-2025 (%)
33: North America - Market size and forecast 2020-2025 ($ million)
34: North America - Year-over-year growth 2020-2025 (%)
35: Europe - Market size and forecast 2020-2025 ($ million)
36: Europe - Year-over-year growth 2020-2025 (%)
37: South America - Market size and forecast 2020-2025 ($ million)
38: South America - Year-over-year growth 2020-2025 (%)
39: MEA - Market size and forecast 2020-2025 ($ million)
40: MEA - Year-over-year growth 2020-2025 (%)
41: Key leading countries
42: Market opportunity By Geographical Landscape ($ million)
43: Impact of drivers and challenges
44: Vendor landscape
45: Landscape disruption
46: Industry risks
47: Vendors covered
48: Market positioning of vendors
49: Amkor Technology Inc. - Overview
50: Amkor Technology Inc. - Business segments
51: Amkor Technology Inc. - Key offerings
52: Amkor Technology Inc. - Key customers
53: Amkor Technology Inc. - Segment focus
54: ASE Technology Holding Co. Ltd. - Overview
55: ASE Technology Holding Co. Ltd. - Business segments
56: ASE Technology Holding Co. Ltd. - Key offerings
57: ASE Technology Holding Co. Ltd. - Key customers
58: ASE Technology Holding Co. Ltd. - Segment focus
59: Cypress Semiconductor Corp. - Overview
60: Cypress Semiconductor Corp. - Business segments
61: Cypress Semiconductor Corp. - Key offerings
62: Cypress Semiconductor Corp. - Key customers
63: Cypress Semiconductor Corp. - Segment focus
64: Infineon Technologies AG - Overview
65: Infineon Technologies AG - Business segments
66: Infineon Technologies AG - Key offerings
67: Infineon Technologies AG - Key customers
68: Infineon Technologies AG - Segment focus
69: JCET Group Co. Ltd. - Overview
70: JCET Group Co. Ltd. - Product and service
71: JCET Group Co. Ltd. - Key offerings
72: JCET Group Co. Ltd. - Key customers
73: JCET Group Co. Ltd. - Segment focus
74: NXP Semiconductors NV - Overview
75: NXP Semiconductors NV - Business segments
76: NXP Semiconductors NV - Key offerings
77: NXP Semiconductors NV - Key customers
78: NXP Semiconductors NV - Segment focus
79: Renesas Electronics Corp. - Overview
80: Renesas Electronics Corp. - Business segments
81: Renesas Electronics Corp. - Key offerings
82: Renesas Electronics Corp. - Key customers
83: Renesas Electronics Corp. - Segment focus
84: Samsung Electronics Co. Ltd. - Overview
85: Samsung Electronics Co. Ltd. - Business segments
86: Samsung Electronics Co. Ltd. - Key offerings
87: Samsung Electronics Co. Ltd. - Key customers
88: Samsung Electronics Co. Ltd. - Segment focus
89: Siliconware Precision Industries Co. Ltd. - Overview
90: Siliconware Precision Industries Co. Ltd. - Business segments
91: Siliconware Precision Industries Co. Ltd. - Key offerings
92: Siliconware Precision Industries Co. Ltd. - Key customers
93: Siliconware Precision Industries Co. Ltd. - Segment focus
94: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
95: Taiwan Semiconductor Manufacturing Co. Ltd. - Business segments
96: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
97: Taiwan Semiconductor Manufacturing Co. Ltd. - Key customers
98: Taiwan Semiconductor Manufacturing Co. Ltd. - Segment focus
99: Currency conversion rates for US$
100: Research Methodology
101: Validation techniques employed for market sizing
102: Information sources
103: List of abbreviations
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
The publisher Announces the Publication of its Research Report - Global Fan-out Wafer Level Packaging Market 2021-2025

The publisher recognizes the following companies as the key players in the global fan-out wafer level packaging market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd.

Commenting on the report, an analyst from the publisher said: 'The latest trend gaining momentum in the market is rapid adoption of FinFET technology.'

According to the report, one of the major drivers for this market is the increased demand for compactly designed electronics.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown

A selection of companies mentioned in this report includes:

  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • Cypress Semiconductor Corp.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
Note: Product cover images may vary from those shown

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