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Passive & Interconnecting Electronic Components Market - Global Forecast 2025-2032

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    Report

  • 183 Pages
  • October 2025
  • Region: Global
  • 360iResearch™
  • ID: 5460230
UP TO OFF until Jan 01st 2026
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The Passive & Interconnecting Electronic Components Market is undergoing transformation as organizations pursue optimized functionality, enhanced sustainability, and seamless integration in next-generation electronic systems.

Market Snapshot: Passive & Interconnecting Electronic Components Market

The global Passive & Interconnecting Electronic Components Market grew from USD 244.58 billion in 2024 to USD 264.27 billion in 2025. With a projected CAGR of 8.03%, the market is expected to reach USD 453.75 billion by 2032. Driving factors include demand for energy-efficient solutions, innovation in miniaturized components, and the push for advanced digital integration. The sector's growth is shaped by rising adoption of compact devices, expanded telecommunication infrastructure, and intensifying sustainability initiatives across varied industries.

Scope & Segmentation

This comprehensive research delivers a granular review of critical segments, emerging technologies, and regional dynamics, aiding decision-makers in evaluating options and identifying growth opportunities.

  • Component Types: Capacitors, Connectors, Inductors & Transformers, Resistors, Switches & Relays — These components form the backbone of electrical circuit performance, supporting reliability and functionality.
  • Mounting Methods: Surface Mount, Through Hole — Selection impacts manufacturing efficiencies and ability to target space-constrained or specialized applications.
  • Dielectric Materials: Aluminum Electrolytic, Ceramic, Polymer, Supercapacitor, Tantalum — Material choice addresses evolving sustainability objectives and diverse system requirements.
  • Frequency Ranges: Low Frequency, Radio Frequency — Market demand includes traditional and high-frequency applications, supporting varied end-user needs.
  • Operating Temperatures: High, Standard — Performance across extreme and standard conditions remains a key purchasing criteria.
  • End User Industries: Aerospace, Automotive, Consumer Electronics, Energy, Healthcare, Industrial, Telecommunications — Segment coverage reflects technology adoption across specialized and mass-market verticals.
  • Applications: Circuit Protection, EMI Suppression, Power Management, Signal Filtering — Application breadth aligns with the growth in electronic design complexity.
  • Regions: Americas (North America, Latin America), Europe, Middle East & Africa, Asia-Pacific — Regionally segmented insights guide market entry, risk assessment, and supply chain management strategies.

Key regional markets highlighted in this analysis include the United States, Canada, Brazil, United Kingdom, Germany, United Arab Emirates, South Africa, China, India, Japan, South Korea, and others. The report also features industry leaders such as TE Connectivity Ltd., Amphenol Corporation, Samsung Electro-Mechanics Co., Ltd., Murata Manufacturing Co., Ltd., Vishay Intertechnology, Inc., and Yageo Corporation as benchmarks for performance and innovation.

Key Takeaways for Senior Decision-Makers

  • Ongoing miniaturization and advancements in material science set new standards for reliability and integration within electronic systems.
  • Increased adoption of sustainable processes, including green materials and recyclable packaging, positions product portfolios to align with regulatory and end-user demands.
  • Enhanced digital integration, such as embedded sensors and AI-enabled supply chains, underpins operational flexibility and supports predictive maintenance efforts.
  • Adapting to variable trade environments by diversifying regional supply chains and implementing agile procurement practices helps mitigate disruptions.
  • Market segmentation confirms robust demand across automotive, consumer electronics, energy, and telecommunications, each with unique compliance and performance requirements.
  • Industry frontrunners are leveraging technologies like blockchain for component tracking and digital twins to optimize manufacturing yield and quality.

Tariff Impact and Supply Chain Dynamics

Amid recent United States tariff adjustments, organizations are reassessing sourcing and production strategies to accommodate new trade realities. This trend accelerates the formation of regional supplier partnerships and shifts towards nearshoring. Tighter alignment between engineering and procurement teams ensures adherence to local regulations while balancing cost objectives with reliability. The sector is increasingly focused on diversifying supplier bases and standardizing components, which improves operational agility and reduces exposure to trade-related risks.

Methodology & Data Sources

A rigorous multi-stage research process forms the foundation of this report. Secondary data from industry publications and regulatory sources is validated through executive interviews and expert workshops. Data triangulation and scenario modeling provide context, while independent peer reviews uphold analytical accuracy and ensure actionable outcomes.

Why This Report Matters

  • Supports critical procurement, R&D, and investment decisions with evidence-based market insights tailored to the electronic components ecosystem.
  • Equips organizations to manage risk and streamline supply chains during evolving tariff regimes and changing regional trade policies.
  • Enables senior leaders to align product strategies with sustainability goals, market trends, and compliance developments for sustained competitive advantage.

Conclusion

This analysis empowers organizations to enhance their market position via innovation, operational agility, and robust supplier ecosystems. Proactive strategies in materials, digitalization, and compliance lay the groundwork for sustainable, resilient growth in an evolving industry landscape.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Increasing adoption of embedded passive components in printed circuit boards for space savings and performance improvements
5.2. Rising demand for ultra-low ESR multilayer ceramic capacitors in high-frequency power conversion applications
5.3. Development of flexible and stretchable interconnect materials for wearable electronics and smart textiles
5.4. Integration of additive manufacturing processes to produce customized interconnects and complex passive geometries
5.5. Growing requirement for high-density interconnect PCB substrates to support 5G mmWave and high-speed digital signals
5.6. Use of wide bandgap semiconductor based passive modules for enhanced thermal management in electric vehicles
5.7. Shift toward sustainable and lead-free solder alloys and eco friendly dielectric materials in component assembly
5.8. Advancements in hybrid chiplet packaging and microvia interposer technologies for next generation computing
6. Cumulative Impact of United States Tariffs 2025
7. Cumulative Impact of Artificial Intelligence 2025
8. Passive & Interconnecting Electronic Components Market, by Component Type
8.1. Capacitors
8.2. Connectors
8.3. Inductors & Transformers
8.4. Resistors
8.5. Switches & Relays
9. Passive & Interconnecting Electronic Components Market, by Mounting Type
9.1. Surface Mount
9.2. Through Hole
10. Passive & Interconnecting Electronic Components Market, by Dielectric Material
10.1. Aluminum Electrolytic
10.2. Ceramic
10.3. Polymer
10.4. Supercapacitor
10.5. Tantalum
11. Passive & Interconnecting Electronic Components Market, by Frequency Range
11.1. Low Frequency
11.2. Radio Frequency
12. Passive & Interconnecting Electronic Components Market, by Operating Temperature
12.1. High
12.2. Standard
13. Passive & Interconnecting Electronic Components Market, by End User Industry
13.1. Aerospace
13.2. Automotive
13.3. Consumer Electronics
13.4. Energy
13.5. Healthcare
13.6. Industrial
13.7. Telecommunications
14. Passive & Interconnecting Electronic Components Market, by Application
14.1. Circuit Protection
14.2. EMI Suppression
14.3. Power Management
14.4. Signal Filtering
15. Passive & Interconnecting Electronic Components Market, by Region
15.1. Americas
15.1.1. North America
15.1.2. Latin America
15.2. Europe, Middle East & Africa
15.2.1. Europe
15.2.2. Middle East
15.2.3. Africa
15.3. Asia-Pacific
16. Passive & Interconnecting Electronic Components Market, by Group
16.1. ASEAN
16.2. GCC
16.3. European Union
16.4. BRICS
16.5. G7
16.6. NATO
17. Passive & Interconnecting Electronic Components Market, by Country
17.1. United States
17.2. Canada
17.3. Mexico
17.4. Brazil
17.5. United Kingdom
17.6. Germany
17.7. France
17.8. Russia
17.9. Italy
17.10. Spain
17.11. China
17.12. India
17.13. Japan
17.14. Australia
17.15. South Korea
18. Competitive Landscape
18.1. Market Share Analysis, 2024
18.2. FPNV Positioning Matrix, 2024
18.3. Competitive Analysis
18.3.1. TE Connectivity Ltd.
18.3.2. Amphenol Corporation
18.3.3. TDK Corporation
18.3.4. Murata Manufacturing Co., Ltd.
18.3.5. Samsung Electro-Mechanics Co., Ltd.
18.3.6. Taiyo Yuden Co., Ltd.
18.3.7. Vishay Intertechnology, Inc.
18.3.8. Yageo Corporation
18.3.9. Hirose Electric Co., Ltd.
18.3.10. AVX Corporation
List of Tables
List of Figures

Samples

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Companies Mentioned

The key companies profiled in this Passive & Interconnecting Electronic Components market report include:
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • TDK Corporation
  • Murata Manufacturing Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • Taiyo Yuden Co., Ltd.
  • Vishay Intertechnology, Inc.
  • Yageo Corporation
  • Hirose Electric Co., Ltd.
  • AVX Corporation

Table Information