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Ericsson 5G NR 39GHz AIR 5331 B260 KRD 901 079/1

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    Report

  • 70 Pages
  • December 2021
  • Region: Global
  • EJL Wireless Research
  • ID: 5510051

This report provides a comprehensive analysis for the Ericsson AIR 5331 B260 39GHz mmWave system. This product is a 5G NR phased array antenna/radio unit and supports single mode 5G NR. 

Features

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
    • Heat Fins
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power
    • capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type
  • Excludes analysis of passive chip resistors, capacitors, and inductors

Total Pages: 70
Total Exhibits: 78
Total Tables: 17

Important Note: There is no component pricing contained within the report.

Table of Contents

Executive Summary
  • Active/Passive Component Summary
  • Important Note
Chapter 1: Ericsson MPAAU
  • Overview of mmWave Phased Array Antenna Unit
  • Product Specifications
Chapter 2: Mechanical Analysis
  • Front Cover/Antenna Radome
  • Top Cover
  • Bottom Cover
  • Interface Panel Connectors
  • Side Covers
  • Main Chassis
  • Heat Transfer Fins
  • Radio Transceiver RF Shield
  • Baseband Thermal Shield
  • Phased Array Antenna Module (PAAM) Frame
  • SFP Optical Gasket
Chapter 3: Radio Transceiver SubsystemChapter 4: mmWave Phased Array Antenna Module (PAAM) SubsystemChapter 5: Power Supply SubsystemAppendix A Component AnalysisAppendix B Component Type By System UnitAppendix C Active Components By SupplierAppendix D Passive Components By Supplier
List of Tables
Table 1: AIR 5331 Electrical Specifications
Table 2: Radio Transceiver PCB Top, Active Bill of Materials
Table 3: Radio Transceiver PCB Top, Area A0, Bill of Materials
Table 4: Radio Transceiver PCB Top, Area A1, Bill of Materials
Table 5: Radio Transceiver PCB Top, Area A2, Bill of Materials
Table 6: Radio Transceiver PCB Top, Area A3, Bill of Materials
Table 7: Radio Transceiver PCB Top, Passive Bill of Materials
Table 8: Radio Transceiver PCB Bottom, Active Bill of Materials
Table 9: Radio Transceiver PCB Bottom, Passive Bill of Materials
Table 10: PAAM PCB, Bottom, Bill of Materials
Table 11: Power Supply PCB, Top, Active Bill of Materials
Table 12: Power Supply PCB, Top, Passive Bill of Materials
Table 13: Power Supply PCB, Bottom, Active Bill of Materials
Table 14: AIR 5331 Unit PCBs by Component Type
Table 15: AIR 5331 Unit PCBs by Component Type (con’t)
Table 16: AIR 5331 Unit PCBs by Active Component Vendor
Table 17: AIR 5331 Unit PCBs by Passive/Connector/Other Component Vendor

List of Exhibits
Exhibit 1: AIR 5331
Exhibit 2: Ericsson mmWave Product Generations
Exhibit 3: AIR 5331 Front (Left) and Rear (Right) Views
Exhibit 4: AIR 5331 Left Side (Left) and Right Side (Right) Views
Exhibit 5: AIR 5331 Top (Left) and Bottom (Right) Views
Exhibit 6: AIR 5331 Product and FCC ID Labels
Exhibit 7: Antenna Radome, External View
Exhibit 8: Antenna Radome, Internal View
Exhibit 9: AIR 5331 Antenna Radome Detail
Exhibit 10: AIR 5331 Antenna Radome
Exhibit 11: AIR 5331 Top Cover, External View (Left) and Internal View (Right)
Exhibit 12: AIR 5331 Top Cover, Top View (Left) and Bottom View (Right)
Exhibit 13: AIR 5331 Bottom Cover, External View (Left) and Internal View (Right)
Exhibit 14: AIR 5331 Bottom Cover, Top View (Left) and Bottom View (Right)
Exhibit 15: AIR 5331 Bottom Cover Interface Ports
Exhibit 16: SFP Panel Mount Connector, Front View (Left) and Rear View (Right)
Exhibit 17: SFP Panel Mount Connector, Side View
Exhibit 18: DC Power Panel Mount Connector, Front View (Left) and Side View (Right)
Exhibit 19: DC Power Cable Terminal Pin Connector, Top View (Left) and Bottom View (Right)
Exhibit 20: Alarm Panel Mount Connector Assembly, Front View (Left) and Side View (Right)
Exhibit 21: LED Indicator Panel Front View w/Cover (Left) and without Cover (Right)
Exhibit 22: LED Indicator Panel Rear View 1 (Left) and View 2 (Right)
Exhibit 23: AIR 5331 Side Covers, External View (Left) and Internal View (Right)
Exhibit 24: AIR 5331 Main Chassis, External View
Exhibit 25: AIR 5331 Main Chassis, Internal View with Baseband Thermal Shield
Exhibit 26: AIR 5331 Main Chassis, Internal View with Baseband Thermal Shield Removed
Exhibit 27: AIR 5331 Main Chassis, Internal View, Thermal Pedestal Map
Exhibit 28: AIR 5331 Main Chassis, Internal View, Power Supply Cavity Dimensions
Exhibit 29: Heat Transfer Fin Dimensions
Exhibit 30: Heat Transfer Fin Types
Exhibit 31: Heat Transfer Fin Stabilizer Posts, Top View
Exhibit 32: Heat Transfer Fin Stabilizer Posts, Side View
Exhibit 33: Radio Transceiver RF Shield Location
Exhibit 34: Radio Transceiver RF Shield, External View
Exhibit 35: Radio Transceiver RF Shield, Internal View
Exhibit 36: Baseband Thermal Shield, External View
Exhibit 37: Baseband Thermal Shield, Internal View
Exhibit 38: PAAM Window Frame Locations
Exhibit 39: PAAM Window Frame Inside Edge Detail
Exhibit 40: PAAM Frame, External View
Exhibit 41: PAAM Frame, Internal View
Exhibit 42: SFP Optical Port Gasket Locations
Exhibit 43: SFP Optical Port Gaskets Removed
Exhibit 44: Radio Transceiver PCB, Top View
Exhibit 45: Radio Transceiver PCB, Bottom View
Exhibit 46: Radio Transceiver Subsystem Block Diagram
Exhibit 47: 63-Pos Male-Male Header Connector
Exhibit 48: Radio Transceiver PCB Top, Active Component Diagram
Exhibit 49: Radio Transceiver PCB Top, Passive Component Diagram
Exhibit 50: PAAM Ground Connector
Exhibit 51: PAAM RF/Digital/DC Power Connector
Exhibit 52: Radio Transceiver PCB Bottom, Active Component Diagram
Exhibit 53: Radio Transceiver PCB Bottom, Passive Component Diagram
Exhibit 54: Phased Array Antenna Module Subsystem Location
Exhibit 55: Phased Array Antenna Module PCB, Top View
Exhibit 56: Phased Array Antenna Module PCB, Bottom View
Exhibit 57: Phased Array Antenna Element Matrix
Exhibit 58: PAAM Beam Configuration Mode
Exhibit 59: PAAM 39GHz Antenna Element Dimensions
Exhibit 60: PAAM Block Diagram
Exhibit 61: PAAM PCB, Bottom, Component Diagram
Exhibit 62: Ericsson 39GHz RFIC ASIC
Exhibit 63: RF Passive Circuits for RF ASICs
Exhibit 64: Location of AIR 5331 Power Supply Sub-System
Exhibit 65: AIR 5331 Power Supply Sub-System
Exhibit 66: AIR 5331 Power Supply Subsystem PCB, Top View
Exhibit 67: AIR 5331 Power Supply Subsystem PCB, Bottom View
Exhibit 68: Power Supply PCB, Top, Active Component Diagram
Exhibit 69: Power Supply DC Voltage Input Terminals
Exhibit 70: Power Supply PCB, Top, Passive Component Diagram
Exhibit 71: Ferrite Inductor and Transformer Locations
Exhibit 72: Power Supply PCB, Bottom, Component Diagram
Exhibit 73: Component Market Share by Type
Exhibit 74: Active Semiconductor Market Share by Vendor
Exhibit 75: Active Semiconductor Market Share by Vendor, 64+ Pin
Exhibit 76: Passive/Connector/Other Component Market Share by Vendor
Exhibit 77: Passive/Connector/Other Component Market Share by Function
Exhibit 78: Passive/Connector/Other Component Market Share by Country of Origin

Samples

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