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Global Semiconductor Packaging and Assembly Equipment Market 2021-2025

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    Report

  • 120 Pages
  • September 2021
  • Region: Global
  • TechNavio
  • ID: 5510770
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The publisher has been monitoring the semiconductor packaging and assembly equipment market and it is poised to grow by $1.91 bn during 2021-2025, progressing at a CAGR of 8.47% during the forecast period. The report on the semiconductor packaging and assembly equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the development of 3D chip packaging and increase in the number of fabless semiconductor companies.

The semiconductor packaging and assembly equipment market analysis includes the type segment and geographic landscape.

The semiconductor packaging and assembly equipment market is segmented as below:


By Type

  • Wafer-level packaging and assembly equipment
  • Die-level packaging and assembly equipment

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • MEA

This study identifies the growing demand for semiconductor wafers as one of the prime reasons driving the semiconductor packaging and assembly equipment market growth during the next few years.

The report on semiconductor packaging and assembly equipment market covers the following areas:

  • Semiconductor packaging and assembly equipment market sizing
  • Semiconductor packaging and assembly equipment market forecast
  • Semiconductor packaging and assembly equipment market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor packaging and assembly equipment market vendors that include Amkor Technology Inc., Applied Materials Inc., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., EV Group, JCET Group Co. Ltd., Kulicke and Soffa Industries Inc., Powertech Technology Inc., Tokyo Electron Ltd., and Tokyo Seimitsu Co. Ltd. Also, the semiconductor packaging and assembly equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

Executive Summary

  • Market Overview

Market Landscape

  • Market ecosystem
  • Value chain analysis

Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2020
  • Market outlook: Forecast for 2020 - 2025

Five Forces Analysis

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation by Type

  • Market segments
  • Comparison by Type
  • Wafer-level packaging and assembly equipment - Market size and forecast 2020-2025
  • Die-level packaging and assembly equipment - Market size and forecast 2020-2025
  • Market opportunity by Type

Customer landscape

Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2020-2025
  • North America - Market size and forecast 2020-2025
  • Europe - Market size and forecast 2020-2025
  • South America - Market size and forecast 2020-2025
  • MEA - Market size and forecast 2020-2025
  • Key leading countries
  • Market opportunity By Geographical Landscape
  • Market drivers
  • Market challenges
  • Market trends

Vendor Landscape

  • Overview
  • Landscape disruption

Vendor Analysis

  • Vendors covered
  • Market positioning of vendors
  • Amkor Technology Inc.
  • Applied Materials Inc.
  • ASM Pacific Technology Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • EV Group
  • JCET Group Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • Powertech Technology Inc.
  • Tokyo Electron Ltd.
  • Tokyo Seimitsu Co. Ltd.

Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

List of Exhibits

  • Key Finding 1
  • Key Finding 2
  • Key Finding 3
  • Key Finding 5
  • Key Finding 6
  • Key Finding 7
  • Key Finding 8
  • Parent market
  • Market characteristics
  • Offerings of vendors included in the market definition
  • Market segments
  • Global - Market size and forecast 2020 - 2025 ($ million)
  • Global market: Year-over-year growth 2020 - 2025 (%)
  • Five forces analysis 2020 & 2025
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition - Five forces 2020
  • Type - Market share 2020-2025 (%)
  • Comparison by Type
  • Wafer-level packaging and assembly equipment - Market size and forecast 2020-2025 ($ million)
  • Wafer-level packaging and assembly equipment - Year-over-year growth 2020-2025 (%)
  • Die-level packaging and assembly equipment - Market size and forecast 2020-2025 ($ million)
  • Die-level packaging and assembly equipment - Year-over-year growth 2020-2025 (%)
  • Market opportunity by Type
  • Customer landscape
  • Market share By Geographical Landscape 2020-2025 (%)
  • Geographic comparison
  • APAC - Market size and forecast 2020-2025 ($ million)
  • APAC - Year-over-year growth 2020-2025 (%)
  • North America - Market size and forecast 2020-2025 ($ million)
  • North America - Year-over-year growth 2020-2025 (%)
  • Europe - Market size and forecast 2020-2025 ($ million)
  • Europe - Year-over-year growth 2020-2025 (%)
  • South America - Market size and forecast 2020-2025 ($ million)
  • South America - Year-over-year growth 2020-2025 (%)
  • MEA - Market size and forecast 2020-2025 ($ million)
  • MEA - Year-over-year growth 2020-2025 (%)
  • Key leading countries
  • Market opportunity By Geographical Landscape ($ million)
  • Impact of drivers and challenges
  • Vendor landscape
  • Landscape disruption
  • Industry risks
  • Vendors covered
  • Market positioning of vendors
  • Amkor Technology Inc. - Overview
  • Amkor Technology Inc. - Business segments
  • Amkor Technology Inc. - Key offerings
  • Amkor Technology Inc. - Key customers
  • Amkor Technology Inc. - Segment focus
  • Applied Materials Inc. - Overview
  • Applied Materials Inc. - Business segments
  • Applied Materials Inc. - Key offerings
  • Applied Materials Inc. - Key customers
  • Applied Materials Inc. - Segment focus
  • ASM Pacific Technology Ltd. - Overview
  • ASM Pacific Technology Ltd. - Business segments
  • ASM Pacific Technology Ltd. - Key offerings
  • ASM Pacific Technology Ltd. - Key customers
  • ASM Pacific Technology Ltd. - Segment focus
  • ChipMOS TECHNOLOGIES Inc. - Overview
  • ChipMOS TECHNOLOGIES Inc. - Business segments
  • ChipMOS TECHNOLOGIES Inc. - Key offerings
  • ChipMOS TECHNOLOGIES Inc. - Key customers
  • ChipMOS TECHNOLOGIES Inc. - Segment focus
  • EV Group - Overview
  • EV Group - Product and service
  • EV Group - Key offerings
  • EV Group - Key customers
  • EV Group - Segment focus
  • JCET Group Co. Ltd. - Overview
  • JCET Group Co. Ltd. - Product and service
  • JCET Group Co. Ltd. - Key offerings
  • JCET Group Co. Ltd. - Key customers
  • JCET Group Co. Ltd. - Segment focus
  • Kulicke and Soffa Industries Inc. - Overview
  • Kulicke and Soffa Industries Inc. - Business segments
  • Kulicke and Soffa Industries Inc. - Key offerings
  • Kulicke and Soffa Industries Inc. - Key customers
  • Kulicke and Soffa Industries Inc. - Segment focus
  • Powertech Technology Inc. - Overview
  • Powertech Technology Inc. - Product and service
  • Powertech Technology Inc. - Key offerings
  • Powertech Technology Inc. - Key customers
  • Powertech Technology Inc. - Segment focus
  • Tokyo Electron Ltd. - Overview
  • Tokyo Electron Ltd. - Business segments
  • Tokyo Electron Ltd. - Key offerings
  • Tokyo Electron Ltd. - Key customers
  • Tokyo Electron Ltd. - Segment focus
  • Tokyo Seimitsu Co. Ltd. - Overview
  • Tokyo Seimitsu Co. Ltd. - Business segments
  • Tokyo Seimitsu Co. Ltd. - Key offerings
  • Tokyo Seimitsu Co. Ltd. - Key customers
  • Tokyo Seimitsu Co. Ltd. - Segment focus
  • Currency conversion rates for US$
  • Research Methodology
  • Validation techniques employed for market sizing
  • Information sources
  • List of abbreviations

Executive Summary

The publisher recognizes the following companies as the key players in the global semiconductor packaging and assembly equipment market: Amkor Technology Inc., Applied Materials Inc., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., EV Group, JCET Group Co. Ltd., Kulicke and Soffa Industries Inc., Powertech Technology Inc., Tokyo Electron Ltd., and Tokyo Seimitsu Co. Ltd.

Commenting on the report, an analyst from the research team said: `The latest trend gaining momentum in the market is growing demand for semiconductor wafers.`

According to the report, one of the major drivers for this market is the development of 3D chip packaging.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Amkor Technology Inc.
  • Applied Materials Inc.
  • ASM Pacific Technology Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • EV Group
  • JCET Group Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • Powertech Technology Inc.
  • Tokyo Electron Ltd.
  • Tokyo Seimitsu Co. Ltd.