+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Europe Semiconductor Wafer Market By Wafer Size, By Technology, By product type, By end User, By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027

  • PDF Icon

    Report

  • 102 Pages
  • November 2021
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5514541

The Europe Semiconductor Wafer Market is expected to witness market growth of 4.2% CAGR during the forecast period (2021-2027).


Silicon wafers are thinner in size in comparison to the unutilized wafers and majorly provide similar performance as utilized or virgin test water. Generally, a silicon wafer process starts with sorting, analysis, and assessment for the prevention of metallic contamination in the reclaim process.


Some growth factors for the market are a surge in demand for the manufacturing of chips or microchips utilized in electronic instruments, and the growing application of silicon wafers to determine the process conditions and status of the instruments utilized in semiconductor manufacturing processes.


The massive demand for semiconductor wafers across the automotive market is majorly responsible for the prominent growth of the European semiconductor wafer market. The market is characterized by the massive investment of leading market players. For example, Robert Bosch has established a new semiconductor plant named Wafer Fab RB300 in Dresden, East Germany, in 2019 to expand the revenue of its automotive electronics business.


The Germany market dominated the Europe 12 Inch Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $785.4 million by 2027. The UK market is experiencing a CAGR of 3% during (2021 - 2027). Additionally, The France market is expected to witness a CAGR of 4.6% during (2021 - 2027).


Based on Wafer Size, the market is segmented into 6 Inch, 8 Inch, 12 inch, and others. Based on Technology, the market is segmented into Packaging & Assembly, Wafer Bumping, Testing & inspection, and others. Based on product type, the market is segmented into Processor, Memory, Analog, and others. Based on end User, the market is segmented into Consumer Electronics, Automotive, Industrial, Telecommunications, and others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.



The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASM International N.V., Shin-Etsu Chemical Co., Ltd., Okmetic Oy (National Silicon Industry Group NSIG), GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.), ASML Holding N.V., Elkem ASA, Lanco Infratech, Applied Materials, Inc., and Sumco Corporation.



Scope of the Study

Market Segments Covered in the Report:


By Wafer Size


  • 6 Inch
  • 8 Inch
  • 12 inch
  • Others

By Technology


  • Packaging & Assembly
  • Wafer Bumping
  • Testing & inspection
  • Others

By Product Type


  • Processor
  • Memory
  • Analog
  • Others

By End User


  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Others

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players

List of Companies Profiled in the Report:


  • ASM International N.V.
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic Oy (National Silicon Industry Group NSIG)
  • GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.)
  • ASML Holding N.V.
  • Elkem ASA
  • Lanco Infratech
  • Applied Materials, Inc.
  • Sumco Corporation

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Semiconductor Wafer Market, by Wafer Size
1.4.2 Europe Semiconductor Wafer Market, by Technology
1.4.3 Europe Semiconductor Wafer Market, by Product Type
1.4.4 Europe Semiconductor Wafer Market, by End User
1.4.5 Europe Semiconductor Wafer Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Semiconductor Wafer Market
Chapter 4. Europe Semiconductor Wafer Market by Wafer Size
4.1 Europe 12 Inch Market by Country
4.2 Europe 6 Inch by Country
4.3 Europe 8 Inch Market by Country
4.4 Europe Others Wafer Size Market by Country
Chapter 5. Europe Semiconductor Wafer Market by Technology
5.1 Europe Packaging & Assembly Market by Country
5.2 Europe Wafer Bumping Market by Country
5.3 Europe Testing & Inspection Market by Country
5.4 Europe Others Market by Country
Chapter 6. Europe Semiconductor Wafer Market by Product Type
6.1 Europe Memory Market by Country
6.2 Europe Processor Market by Country
6.3 Europe Analog Market by Country
6.4 Europe Others Market by Country
Chapter 7. Europe Semiconductor Wafer Market by End User
7.1 Europe Consumer Electronics Market by Country
7.2 Europe Automotive Market by Country
7.3 Europe Industrial Market by Country
7.4 Europe Telecommunication Market by Country
7.5 Europe Others Market by Country
Chapter 8. Europe Semiconductor Wafer Market by Country
8.1 Germany Semiconductor Wafer Market
8.1.1 Germany Semiconductor Wafer Market by Wafer Size
8.1.2 Germany Semiconductor Wafer Market by Technology
8.1.3 Germany Semiconductor Wafer Market by Product Type
8.1.4 Germany Semiconductor Wafer Market by End User
8.2 UK Semiconductor Wafer Market
8.2.1 UK Semiconductor Wafer Market by Wafer Size
8.2.2 UK Semiconductor Wafer Market by Technology
8.2.3 UK Semiconductor Wafer Market by Product Type
8.2.4 UK Semiconductor Wafer Market by End User
8.3 France Semiconductor Wafer Market
8.3.1 France Semiconductor Wafer Market by Wafer Size
8.3.2 France Semiconductor Wafer Market by Technology
8.3.3 France Semiconductor Wafer Market by Product Type
8.3.4 France Semiconductor Wafer Market by End User
8.4 Russia Semiconductor Wafer Market
8.4.1 Russia Semiconductor Wafer Market by Wafer Size
8.4.2 Russia Semiconductor Wafer Market by Technology
8.4.3 Russia Semiconductor Wafer Market by Product Type
8.4.4 Russia Semiconductor Wafer Market by End User
8.5 Spain Semiconductor Wafer Market
8.5.1 Spain Semiconductor Wafer Market by Wafer Size
8.5.2 Spain Semiconductor Wafer Market by Technology
8.5.3 Spain Semiconductor Wafer Market by Product Type
8.5.4 Spain Semiconductor Wafer Market by End User
8.6 Italy Semiconductor Wafer Market
8.6.1 Italy Semiconductor Wafer Market by Wafer Size
8.6.2 Italy Semiconductor Wafer Market by Technology
8.6.3 Italy Semiconductor Wafer Market by Product Type
8.6.4 Italy Semiconductor Wafer Market by End User
8.7 Rest of Europe Semiconductor Wafer Market
8.7.1 Rest of Europe Semiconductor Wafer Market by Wafer Size
8.7.2 Rest of Europe Semiconductor Wafer Market by Technology
8.7.3 Rest of Europe Semiconductor Wafer Market by Product Type
8.7.4 Rest of Europe Semiconductor Wafer Market by End User
Chapter 9. Company Profiles
9.1 ASM International N.V
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Regional & Segmental Analysis
9.1.4 Regional & Segmental Analysis
9.1.5 Research & Development Expenses
9.1.6 Recent strategies and developments:
9.1.6.1 Partnerships, Collaborations, and Agreements:
9.1.6.2 Product Launches and Product Expansions:
9.2 Shin-Etsu Chemical Co., Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Regional & Segmental Analysis
9.2.4 Regional & Segmental Analysis
9.2.5 Research & Development Expenses
9.2.6 Recent strategies and developments:
9.2.6.1 Partnerships, Collaborations, and Agreements:
9.3 Okmetic Oy (National Silicon Industry Group)
9.3.1 Company Overview
9.4 GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products, Inc.)
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional & Segmental Analysis
9.4.4 Regional & Segmental Analysis
9.4.5 Research & Development Expenses
9.4.6 Recent strategies and developments:
9.4.6.1 Partnerships, Collaborations, and Agreements:
9.4.6.2 Acquisition and Mergers:
9.5 ASML Holding N.V.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Regional Analysis
9.5.4 Research & Development Expenses
9.6 Elkem ASA
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional & Segmental Analysis
9.6.4 Research & Development Expenses
9.7 Lanco Infratech
9.7.1 Company Overview
9.8 Applied Materials, Inc.
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental & Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments:
9.8.5.1 Partnerships, Collaborations, and Agreements:
9.8.5.2 Product Launches and Product Expansions:
9.9 Sumco Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses

Companies Mentioned

  • ASM International N.V.
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic Oy (National Silicon Industry Group NSIG)
  • GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.)
  • ASML Holding N.V.
  • Elkem ASA
  • Lanco Infratech
  • Applied Materials, Inc.
  • Sumco Corporation

Methodology

Loading
LOADING...