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Asia Pacific Semiconductor Wafer Market By Wafer Size, By Technology, By product type, By end User, By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027

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    Report

  • 102 Pages
  • November 2021
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5514579

The Asia Pacific Semiconductor Wafer Market is expected to witness market growth of 4.6% CAGR during the forecast period (2021-2027).


Factors such as the rise in utilization of semiconductor wafers in power amplifiers for sending ultra-high radio frequency, rapid electronic switching, and fast signals applications are expected to create lucrative growth opportunities for the players operating in the overall semiconductor wafer market during the forecasting period.


The demand for small-sized gadgets has fuelled the requirement for a large number of features from a single device. Thus, an IC chip should now have a greater number of transistors in order to complement a large number of functionalities. 


The APAC is a promising region for the semiconductor wafer market. Among all the nations, China is expected to be the crucial country over the forthcoming years, especially across the consumer electronics and automotive segments. The Chinese automotive market is the biggest around the globe, manufacturing and delivering millions of passengers as well as light commercial vehicles in 2017.


The Packaging & Assembly market dominated the Asia Pacific Semiconductor Wafer Market by Technology 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $3,284.9 million by 2027. The Wafer Bumping market is expected to exhibit a CAGR of 4.9% during (2021 - 2027). Additionally, the Testing & Inspection market is anticipated to grow highest CAGR of 5.2% during (2021 - 2027).


Based on Wafer Size, the market is segmented into 6 Inch, 8 Inch, 12 inch, and others. Based on Technology, the market is segmented into Packaging & Assembly, Wafer Bumping, Testing & inspection, and others. Based on product type, the market is segmented into Processor, Memory, Analog, and others. Based on end User, the market is segmented into Consumer Electronics, Automotive, Industrial, Telecommunications, and others. Based on countries, the market is segmented into China, Japan, Taiwan, India, South Korea, Singapore, and Rest of Asia Pacific.



The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASM International N.V., Shin-Etsu Chemical Co., Ltd., Okmetic Oy (National Silicon Industry Group NSIG), GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.), ASML Holding N.V., Elkem ASA, Lanco Infratech, Applied Materials, Inc., and Sumco Corporation.



Scope of the Study

Market Segments Covered in the Report:


By Wafer Size


  • 6 Inch
  • 8 Inch
  • 12 inch
  • Others

By Technology


  • Packaging & Assembly
  • Wafer Bumping
  • Testing & inspection
  • Others

By Product Type


  • Processor
  • Memory
  • Analog
  • Others

By End User


  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:


  • ASM International N.V.
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic Oy (National Silicon Industry Group NSIG)
  • GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.)
  • ASML Holding N.V.
  • Elkem ASA
  • Lanco Infratech
  • Applied Materials, Inc.
  • Sumco Corporation

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Semiconductor Wafer Market, by Wafer Size
1.4.2 Asia Pacific Semiconductor Wafer Market, by Technology
1.4.3 Asia Pacific Semiconductor Wafer Market, by Product Type
1.4.4 Asia Pacific Semiconductor Wafer Market, by End User
1.4.5 Asia Pacific Semiconductor Wafer Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Semiconductor Wafer Market
Chapter 4. Asia Pacific Semiconductor Wafer Market by Wafer Size
4.1 Asia Pacific 12 Inch Market by Country
4.2 Asia Pacific 6 Inch by Country
4.3 Asia Pacific 8 Inch Market by Country
4.4 Asia Pacific Others Wafer Size Market by Country
Chapter 5. Asia Pacific Semiconductor Wafer Market by Technology
5.1 Asia Pacific Packaging & Assembly Market by Country
5.2 Asia Pacific Wafer Bumping Market by Country
5.3 Asia Pacific Testing & Inspection Lumens Semiconductor Wafer Market by Country
5.4 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific Semiconductor Wafer Market by Product Type
6.1 Asia Pacific Memory Market by Country
6.2 Asia Pacific Processor Market by Country
6.3 Asia Pacific Analog Market by Country
6.4 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific Semiconductor Wafer Market by End User
7.1 Asia Pacific Consumer Electronics Market by Country
7.2 Asia Pacific Automotive Market by Country
7.3 Asia Pacific Industrial Market by Country
7.4 Asia Pacific Telecommunication Market by Country
7.5 Asia Pacific Others Market by Country
Chapter 8. Asia Pacific Semiconductor Wafer Market by Country
8.1 China Semiconductor Wafer Market
8.1.1 China Semiconductor Wafer Market by Wafer Size
8.1.2 China Semiconductor Wafer Market by Technology
8.1.3 China Semiconductor Wafer Market by Product Type
8.1.4 China Semiconductor Wafer Market by End User
8.2 Japan Semiconductor Wafer Market
8.2.1 Japan Semiconductor Wafer Market by Wafer Size
8.2.2 Japan Semiconductor Wafer Market by Technology
8.2.3 Japan Semiconductor Wafer Market by Product Type
8.2.4 Japan Semiconductor Wafer Market by End User
8.3 Taiwan Semiconductor Wafer Market
8.3.1 Taiwan Semiconductor Wafer Market by Wafer Size
8.3.2 Taiwan Semiconductor Wafer Market by Technology
8.3.3 Taiwan Semiconductor Wafer Market by Product Type
8.3.4 Taiwan Semiconductor Wafer Market by End User
8.4 India Semiconductor Wafer Market
8.4.1 India Semiconductor Wafer Market by Wafer Size
8.4.2 India Semiconductor Wafer Market by Technology
8.4.3 India Semiconductor Wafer Market by Product Type
8.4.4 India Semiconductor Wafer Market by End User
8.5 South Korea Semiconductor Wafer Market
8.5.1 South Korea Semiconductor Wafer Market by Wafer Size
8.5.2 South Korea Semiconductor Wafer Market by Technology
8.5.3 South Korea Semiconductor Wafer Market by Product Type
8.5.4 South Korea Semiconductor Wafer Market by End User
8.6 Singapore Semiconductor Wafer Market
8.6.1 Singapore Semiconductor Wafer Market by Wafer Size
8.6.2 Singapore Semiconductor Wafer Market by Technology
8.6.3 Singapore Semiconductor Wafer Market by Product Type
8.6.4 Singapore Semiconductor Wafer Market by End User
8.7 Rest of Asia Pacific Semiconductor Wafer Market
8.7.1 Rest of Asia Pacific Semiconductor Wafer Market by Wafer Size
8.7.2 Rest of Asia Pacific Semiconductor Wafer Market by Technology
8.7.3 Rest of Asia Pacific Semiconductor Wafer Market by Product Type
8.7.4 Rest of Asia Pacific Semiconductor Wafer Market by End User
Chapter 9. Company Profiles
9.1 ASM International N.V
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Regional & Segmental Analysis
9.1.4 Regional & Segmental Analysis
9.1.5 Research & Development Expenses
9.1.6 Recent strategies and developments:
9.1.6.1 Partnerships, Collaborations, and Agreements:
9.1.6.2 Product Launches and Product Expansions:
9.2 Shin-Etsu Chemical Co., Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Regional & Segmental Analysis
9.2.4 Regional & Segmental Analysis
9.2.5 Research & Development Expenses
9.2.6 Recent strategies and developments:
9.2.6.1 Partnerships, Collaborations, and Agreements:
9.3 Okmetic Oy (National Silicon Industry Group)
9.3.1 Company Overview
9.4 GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products, Inc.)
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional & Segmental Analysis
9.4.4 Regional & Segmental Analysis
9.4.5 Research & Development Expenses
9.4.6 Recent strategies and developments:
9.4.6.1 Partnerships, Collaborations, and Agreements:
9.4.6.2 Acquisition and Mergers:
9.5 ASML Holding N.V.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Regional Analysis
9.5.4 Research & Development Expenses
9.6 Elkem ASA
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional & Segmental Analysis
9.6.4 Research & Development Expenses
9.7 Lanco Infratech
9.7.1 Company Overview
9.8 Applied Materials, Inc.
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental & Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments:
9.8.5.1 Partnerships, Collaborations, and Agreements:
9.8.5.2 Product Launches and Product Expansions:
9.9 Sumco Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses

Companies Mentioned

  • ASM International N.V.
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic Oy (National Silicon Industry Group NSIG)
  • GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.)
  • ASML Holding N.V.
  • Elkem ASA
  • Lanco Infratech
  • Applied Materials, Inc.
  • Sumco Corporation

Methodology

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