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Asia Pacific Sensor Fusion Market By Technology, By Type, By End User, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

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    Report

  • 111 Pages
  • January 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5552900
The Asia Pacific Sensor Fusion Market is expected to witness market growth of 17.9% CAGR during the forecast period (2021-2027).

The sensor fusion market is primarily driven by the rapidly developing consumer electronics, automotive, and healthcare industries. Electric vehicles manufacturers are using modern technology such as ADAS and other safety measures in their automobiles. Furthermore, the growing trend of miniaturization in electronics aids the growth of the sensor fusion market.

Each sensor type, or modality, has its own set of advantages and disadvantages. Radars are excellent at estimating distance and speed, especially in adverse weather, but they can't read street signs or see the colour of a stoplight. On the other hand, dirt, sun, rain, snow, or darkness can easily blind them. All of these sensor types are being integrated to form sensor fusion by applying software algorithms to create the most comprehensive and accurate environmental model possible. Through a process called internal and external sensor fusion, it may also correlate data from inside the cabin.

Furthermore, the region's significant investment in 5G, as well as its promotion of C-V2X, is broadening the breadth of automotive applications such as autonomous driving, V2X, and the MaaS market. For instance, Qualcomm is collaborating with more than 30 Chinese automakers, including joint ventures based in China, to show the economic viability of C-V2X technology for autonomous and connected vehicles.

The China market dominated the Asia Pacific Sensor Fusion Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $1,207.1 million by 2027. The Japan market is poised to grow a CAGR of 17.2% during (2021 - 2027). Additionally, The India market is expected to witness a CAGR of 18.7% during (2021 - 2027).

Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).

Scope of the Study


Market Segments Covered in the Report:


By Technology

  • MEMS
  • Non MEMS

By Type

  • IMU
  • Radar Sensors
  • Image Sensors
  • Temperature Sensors
  • Others

By End User

  • Consumer Electronics
  • Healthcare
  • Military & Defense
  • Automotive
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players


List of Companies Profiled in the Report:

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Sensor Fusion Market, by Technology
1.4.2 Asia Pacific Sensor Fusion Market, by Type
1.4.3 Asia Pacific Sensor Fusion Market, by End User
1.4.4 Asia Pacific Sensor Fusion Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements 2017, Dec - 2021, Dec) Leading Players
Chapter 4. Asia Pacific Sensor Fusion Market by Technology
4.1 Asia Pacific Sensor Fusion MEMS Market by Country
4.2 Asia Pacific Sensor Fusion Non MEMS Market by Country
Chapter 5. Asia Pacific Sensor Fusion Market by Type
5.1 Asia Pacific IMU Sensor Fusion Market by Country
5.2 Asia Pacific Radar Sensors Sensor Fusion Market by Country
5.3 Asia Pacific Image Sensors Sensor Fusion Market by Country
5.4 Asia Pacific Temperature Sensors Sensor Fusion Market by Country
5.5 Asia Pacific Other Type Sensor Fusion Market by Country
Chapter 6. Asia Pacific Sensor Fusion Market by End User
6.1 Asia Pacific Sensor Fusion Consumer Electronics Market by Country
6.2 Asia Pacific Sensor Fusion Healthcare Market by Country
6.3 Asia Pacific Sensor Fusion Military & Defense Market by Country
6.4 Asia Pacific Sensor Fusion Automotive Market by Country
6.5 Asia Pacific Sensor Fusion Others Market by Country
Chapter 7. Asia Pacific Sensor Fusion Market by Country
7.1 China Sensor Fusion Market
7.1.1 China Sensor Fusion Market by Technology
7.1.2 China Sensor Fusion Market by Type
7.1.3 China Sensor Fusion Market by End User
7.2 Japan Sensor Fusion Market
7.2.1 Japan Sensor Fusion Market by Technology
7.2.2 Japan Sensor Fusion Market by Type
7.2.3 Japan Sensor Fusion Market by End User
7.3 India Sensor Fusion Market
7.3.1 India Sensor Fusion Market by Technology
7.3.2 India Sensor Fusion Market by Type
7.3.3 India Sensor Fusion Market by End User
7.4 South Korea Sensor Fusion Market
7.4.1 South Korea Sensor Fusion Market by Technology
7.4.2 South Korea Sensor Fusion Market by Type
7.4.3 South Korea Sensor Fusion Market by End User
7.5 Singapore Sensor Fusion Market
7.5.1 Singapore Sensor Fusion Market by Technology
7.5.2 Singapore Sensor Fusion Market by Type
7.5.3 Singapore Sensor Fusion Market by End User
7.6 Malaysia Sensor Fusion Market
7.6.1 Malaysia Sensor Fusion Market by Technology
7.6.2 Malaysia Sensor Fusion Market by Type
7.6.3 Malaysia Sensor Fusion Market by End User
7.7 Rest of Asia Pacific Sensor Fusion Market
7.7.1 Rest of Asia Pacific Sensor Fusion Market by Technology
7.7.2 Rest of Asia Pacific Sensor Fusion Market by Type
7.7.3 Rest of Asia Pacific Sensor Fusion Market by End User
Chapter 8. Company Profiles
8.1 Analog Devices, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments
8.1.5.1 Partnerships, Collaborations, and Agreements
8.1.6 SWOT Analysis
8.2 Renesas Electronics Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Acquisition and Mergers:
8.3 TDK Corporation (InvenSense, Inc.)
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.5.2 Product Launches and Product Expansions
8.4 STMicroelectronics N.V.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Infineon Technologies AG
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments
8.5.5.1 Product Launches and Product Expansions
8.5.6 SWOT Analysis
8.6 NXP Semiconductors N.V.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Product Launches and Product Expansions
8.6.6 SWOT Analysis
8.7 Asahi Kasei Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 Robert Bosch GmbH
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent strategies and developments
8.8.5.1 Partnerships, Collaborations, and Agreements
8.8.6 SWOT Analysis
8.9 CEVA, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments
8.9.5.1 Partnerships, Collaborations, and Agreements
8.9.5.2 Acquisition and Mergers:
8.10. MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
8.10.1 Company Overview

Companies Mentioned

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Methodology

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