The Latin America, Middle East and Africa Rugged IC Market is expected to witness market growth of 7.5% CAGR during the forecast period (2021-2027).
Rugged ICs, unlike regular ICs, are better developed and manufactured, resulting in increased performance and operating speed for the electronic equipment. Also, rugged ICs can provide solutions in practically every situation. In addition, these integrated circuits with extraordinary robustness and rugged packaging have been created by IC manufacturers.
A robust integrated circuit should last much beyond its initial power-up on the bench. These integrated circuits are capable of operating through thermal cycling, thermal stress, and a wide temperature range. Rugged ICs are also equipped with bespoke drivers, hardware, and software, allowing them to withstand harsh environmental conditions.
The untapped potential of this region is attracting more companies and manufacturers to enter this region for expanding their market. The availability of low-cost labor and supporting government policies is expected to support the production of rugged IC across this region. In addition, the number of manufacturers is increasing in this region who are creating more demand for advanced devices and components.
The Brazil market dominated the LAMEA Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $28.2 million by 2027. The Argentina market is poised to grow a CAGR of 8.1% during (2021 - 2027). Additionally, The UAE market is expected to exhibit a CAGR of 7.2% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Rugged ICs, unlike regular ICs, are better developed and manufactured, resulting in increased performance and operating speed for the electronic equipment. Also, rugged ICs can provide solutions in practically every situation. In addition, these integrated circuits with extraordinary robustness and rugged packaging have been created by IC manufacturers.
A robust integrated circuit should last much beyond its initial power-up on the bench. These integrated circuits are capable of operating through thermal cycling, thermal stress, and a wide temperature range. Rugged ICs are also equipped with bespoke drivers, hardware, and software, allowing them to withstand harsh environmental conditions.
The untapped potential of this region is attracting more companies and manufacturers to enter this region for expanding their market. The availability of low-cost labor and supporting government policies is expected to support the production of rugged IC across this region. In addition, the number of manufacturers is increasing in this region who are creating more demand for advanced devices and components.
The Brazil market dominated the LAMEA Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $28.2 million by 2027. The Argentina market is poised to grow a CAGR of 8.1% during (2021 - 2027). Additionally, The UAE market is expected to exhibit a CAGR of 7.2% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Level
- Fully Rugged
- Semi Rugged and
- Others
By End Use
- Consumer Electronics
- Manufacturing
- Healthcare
- Industrial
- Automotive and
- Others
By Application
- Mobile Phones
- Tablets
- Scanners and
- Others
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
Unique Offerings from the Publisher
- Exhaustive coverage
- The highest number of market tables and figures
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. LAMEA Rugged IC Market by Level
Chapter 5. LAMEA Rugged IC Market by End Use
Chapter 6. LAMEA Rugged IC Market by Application
Chapter 7. LAMEA Rugged IC Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
Methodology
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