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North America Sensor Fusion Market By Technology, By Type, By End User, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

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    Report

  • 101 Pages
  • January 2022
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5553146
The North America Sensor Fusion Market is expected to witness market growth of 17.6% CAGR during the forecast period (2021-2027).

Sensor fusion is becoming more popular in a variety of industries, including automotive, healthcare, consumer electronics, military & defence, and others. As the need for these industries grows, the sensor fusion market share is predicted to grow significantly in the coming years. Smartphones, tablets, automobiles, medical devices, and other industrial equipment are among the key users of sensor fusion.

Smartphones are embedded with a wide variety of sensors, including Inertial Measuring Unit (IMU) sensors, temperature sensors, light sensors, and more. Sensors of this type are used to determine a variety of actions, including positioning, tracking, and recognition. Wearable gadgets in healthcare involve sensor fusion in the form of accelerometers and gyroscopes. Along with that, wearable sensor systems that may be employed in a range of medical situations are becoming possible due to advancements in the size and power consumption of MEMS sensor devices and microcontrollers.

For instance, Pony.ai, is testing a sensor fusion-enabled robotaxi in the United States. GeoCue Group, situated in the United States, introduced the drone market to their new hardware as a service (HaaS) Evergreen Subscription for their True View UAV LiDAR/Imagery Fusion Sensors in 2019. It is the industry's first integrated LIDAR/camera fusion platform, according to the company, built from the bottom up to generate high-accuracy 3D colourized LIDAR point clouds.

The US market dominated the North America Sensor Fusion Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $2,057.4 million by 2027. The Canada market is expected to witness a CAGR of 20.2% during (2021 - 2027). Additionally, The Mexico market is expected to showcase a CAGR of 19.2% during (2021 - 2027).

Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).

Scope of the Study


Market Segments Covered in the Report:


By Technology

  • MEMS
  • Non MEMS

By Type

  • IMU
  • Radar Sensors
  • Image Sensors
  • Temperature Sensors
  • Others

By End User

  • Consumer Electronics
  • Healthcare
  • Military & Defense
  • Automotive
  • Others

By Country

  • US
  • Canada
  • Mexico
  • Rest of North America

Key Market Players


List of Companies Profiled in the Report:

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

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  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
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  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Sensor Fusion Market, by Technology
1.4.2 North America Sensor Fusion Market, by Type
1.4.3 North America Sensor Fusion Market, by End User
1.4.4 North America Sensor Fusion Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements 2017, Dec - 2021, Dec) Leading Players
Chapter 4. North America Sensor Fusion Market by Technology
4.1 North America Sensor Fusion MEMS Market by Country
4.2 North America Sensor Fusion Non MEMS Market by Country
Chapter 5. North America Sensor Fusion Market by Type
5.1 North America IMU Sensor Fusion Market by Country
5.2 North America Radar Sensors Sensor Fusion Market by Country
5.3 North America Image Sensors Sensor Fusion Market by Country
5.4 North America Temperature Sensors Sensor Fusion Market by Country
5.5 North America Other Type Sensor Fusion Market by Country
Chapter 6. North America Sensor Fusion Market by End User
6.1 North America Sensor Fusion Consumer Electronics Market by Country
6.2 North America Sensor Fusion Healthcare Market by Country
6.3 North America Sensor Fusion Military & Defense Market by Country
6.4 North America Sensor Fusion Automotive Market by Country
6.5 North America Sensor Fusion Others Market by Country
Chapter 7. North America Sensor Fusion Market by Country
7.1 US Sensor Fusion Market
7.1.1 US Sensor Fusion Market by Technology
7.1.2 US Sensor Fusion Market by Type
7.1.3 US Sensor Fusion Market by End User
7.2 Canada Sensor Fusion Market
7.2.1 Canada Sensor Fusion Market by Technology
7.2.2 Canada Sensor Fusion Market by Type
7.2.3 Canada Sensor Fusion Market by End User
7.3 Mexico Sensor Fusion Market
7.3.1 Mexico Sensor Fusion Market by Technology
7.3.2 Mexico Sensor Fusion Market by Type
7.3.3 Mexico Sensor Fusion Market by End User
7.4 Rest of North America Sensor Fusion Market
7.4.1 Rest of North America Sensor Fusion Market by Technology
7.4.2 Rest of North America Sensor Fusion Market by Type
7.4.3 Rest of North America Sensor Fusion Market by End User
Chapter 8. Company Profiles
8.1 Analog Devices, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments
8.1.5.1 Partnerships, Collaborations, and Agreements
8.1.6 SWOT Analysis
8.2 Renesas Electronics Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Acquisition and Mergers:
8.3 TDK Corporation (InvenSense, Inc.)
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.5.2 Product Launches and Product Expansions
8.4 STMicroelectronics N.V.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Infineon Technologies AG
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments
8.5.5.1 Product Launches and Product Expansions
8.5.6 SWOT Analysis
8.6 NXP Semiconductors N.V.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Product Launches and Product Expansions
8.6.6 SWOT Analysis
8.7 Asahi Kasei Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 Robert Bosch GmbH
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent strategies and developments
8.8.5.1 Partnerships, Collaborations, and Agreements
8.8.6 SWOT Analysis
8.9 CEVA, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments
8.9.5.1 Partnerships, Collaborations, and Agreements
8.9.5.2 Acquisition and Mergers:
8.10. MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
8.10.1 Company Overview

Companies Mentioned

  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • TDK Corporation (InvenSense, Inc.)
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Asahi Kasei Corporation
  • Robert Bosch GmbH
  • CEVA, Inc.
  • MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)

Methodology

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