+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

North America Rugged IC Market By Level, By End Use, By Application, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

  • PDF Icon

    Report

  • 103 Pages
  • January 2022
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5553148
The North America Rugged IC Market is expected to witness market growth of 5.3% CAGR during the forecast period (2021-2027).

Silicon carbide is used to make rugged ICs since this semiconducting material can sustain high voltage and has a high thermal conductivity. Rugged ICs are considerably superior than standard ICs in terms of design and build quality, and hence deliver higher performance to electrical equipment. These advanced integrated circuits increase analogue and digital circuit efficiency and are widely employed in industries such as electronics, power generation, automobiles, and aerospace.

With modest investments in development, research, and testing, the Rugged IC sector is likely to provide moderate cash production in the next years. The rugged IC market, on the other hand, is nearing maturity and should provide modest revenue for important key market players in the future.

Several manufacturing companies across this region need to manage their factories and warehouses. These warehouses hold a wide range of valuable objects, parts, and raw materials that can be utilised in a variety of industrial processes, as well as machine maintenance and distribution. These, together with the finished goods, must be preserved in a well-organized manner at all times, with sufficient responsibility. Owing to this, the demand and growth of rugged IC market is expected to witness a surge in the coming years.

The US market dominated the North America Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $262.3 million by 2027. The Canada market is expected to witness a CAGR of 7.7% during (2021 - 2027). Additionally, The Mexico market is expected to experience a CAGR of 6.7% during (2021 - 2027).

Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.

Scope of the Study


Market Segments Covered in the Report:


By Level

  • Fully Rugged
  • Semi Rugged and
  • Others

By End Use

  • Consumer Electronics
  • Manufacturing
  • Healthcare
  • Industrial
  • Automotive and
  • Others

By Application

  • Mobile Phones
  • Tablets
  • Scanners and
  • Others

By Country

  • US
  • Canada
  • Mexico
  • Rest of North America

Key Market Players


List of Companies Profiled in the Report:

  • Crystal Group, Inc.
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Honeywell International, Inc.
  • Analog Devices, Inc.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • MediaTek, Inc.
  • General Dynamics Corporation

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Rugged IC Market, by Level
1.4.2 North America Rugged IC Market, by End Use
1.4.3 North America Rugged IC Market, by Application
1.4.4 North America Rugged IC Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.2.4 Geographical Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions 2020, Jun - 2021, Aug) Leading Players
Chapter 4. North America Rugged IC Market by Level
4.1 North America Rugged IC Fully Rugged Market by Country
4.2 North America Rugged IC Semi Rugged Market by Country
4.3 North America Rugged IC Ultra Rugged Market by Country
Chapter 5. North America Rugged IC Market by End Use
5.1 North America Consumer Electronics Rugged IC Market by Country
5.2 North America Manufacturing Rugged IC Market by Country
5.3 North America Healthcare Rugged IC Market by Country
5.4 North America Industrial Rugged IC Market by Country
5.5 North America Automotive Rugged IC Market by Country
5.6 North America Other End Use Rugged IC Market by Country
Chapter 6. North America Rugged IC Market by Application
6.1 North America Mobile Phones Rugged IC Market by Country
6.2 North America Tablets Rugged IC Market by Country
6.3 North America Scanners Rugged IC Market by Country
6.4 North America Others Rugged IC Market by Country
Chapter 7. North America Rugged IC Market by Country
7.1 US Rugged IC Market
7.1.1 US Rugged IC Market by Level
7.1.2 US Rugged IC Market by End Use
7.1.3 US Rugged IC Market by Application
7.2 Canada Rugged IC Market
7.2.1 Canada Rugged IC Market by Level
7.2.2 Canada Rugged IC Market by End Use
7.2.3 Canada Rugged IC Market by Application
7.3 Mexico Rugged IC Market
7.3.1 Mexico Rugged IC Market by Level
7.3.2 Mexico Rugged IC Market by End Use
7.3.3 Mexico Rugged IC Market by Application
7.4 Rest of North America Rugged IC Market
7.4.1 Rest of North America Rugged IC Market by Level
7.4.2 Rest of North America Rugged IC Market by End Use
7.4.3 Rest of North America Rugged IC Market by Application
Chapter 8. Company Profiles
8.1 Crystal Group, Inc.
8.1.1 Company Overview
8.2 NXP Semiconductors N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Product Launches and Product Expansions
8.2.6 SWOT Analysis
8.3 Qualcomm, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 Honeywell International, Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional & Segmental Analysis
8.4.4 Research & Development Expenses
8.4.5 SWOT Analysis
8.5 Analog Devices, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent strategies and developments
8.5.5.1 Geographical Expansions
8.5.6 SWOT Analysis
8.6 Infineon Technologies AG
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Partnerships, Collaborations, and Agreements
8.6.5.2 Product Launches and Product Expansions
8.6.5.3 Acquisitions and Mergers:
8.6.6 SWOT Analysis
8.7 STMicroelectronics N.V.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent Strategies and Developments:
8.7.5.1 Partnerships, Collaborations and Agreements:
8.7.5.2 Product Launches and Product Expansions
8.7.6 SWOT Analysis
8.8 General Dynamics Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 SWOT Analysis
8.9 Texas Instruments, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. MediaTek, Inc.
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Research & Development Expense
8.10.1 Recent strategies and developments
8.10.1.1 Partnerships, Collaborations, and Agreements
8.10.1.2 Acquisitions and Mergers:

Companies Mentioned

  • Crystal Group, Inc.
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Honeywell International, Inc.
  • Analog Devices, Inc.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • MediaTek, Inc.
  • General Dynamics Corporation

Methodology

Loading
LOADING...