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The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising sales of IoT devices, increasing incorporation of electronic parts in vehicles, and rising adoption of cloud computing data centers.
The analyst's semiconductor assembly and testing services market is segmented as below:
By Application
- Communication
- Computing and networking
- Industrial
- Consumer electronics
- Automotive electronics
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This report on the semiconductor assembly and testing services market covers the following areas:
- Semiconductor assembly and testing services market sizing
- Semiconductor assembly and testing services market forecast
- Semiconductor assembly and testing services market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The analyst presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The analyst's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
Executive Summary
The analyst recognizes the following companies as the key players in the global semiconductor assembly and testing services market: Amkor Technology Inc., Aptasic SA, ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., DPA Components International, Flexitallic Group, Formosa Advanced Technologies Co. Ltd. , GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Koninklijke Philips NV, Micross Inc., Ose Corp., Powertech Technology Inc., Rochester Electronics LLC, Teledyne Technologies Inc., Tianshui Huatian Technology Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Walton Advanced Engineering Inc.Commenting on the report, one of the analysts from the research team said: "The latest trend gaining momentum in the market is advancing in SATS."
According to the report, one of the major drivers for this market is the rising sales of IoT devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- Aptasic SA
- ASE Technology Holding Co. Ltd.
- ChipMOS TECHNOLOGIES Inc.
- DPA Components International
- Flexitallic Group
- Formosa Advanced Technologies Co. Ltd.
- GlobalFoundaries Inc.
- Jiangsu Changdian Technology Co. Ltd.
- King Yuan Electronics Co. Ltd.
- Koninklijke Philips NV
- Micross Inc.
- Ose Corp.
- Powertech Technology Inc.
- Rochester Electronics LLC
- Teledyne Technologies Inc.
- Tianshui Huatian Technology Co. Ltd.
- Unisem M Berhad
- UTAC Holdings Ltd.
- Walton Advanced Engineering Inc.