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Flip Chip Technology Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027

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    Report

  • 145 Pages
  • March 2022
  • Region: Global
  • IMARC Group
  • ID: 5562610
The global flip chip technology market reached a value of US$ 27.55 Billion in 2021. Looking forward, the publisher expects the market to reach US$ 39.67 Billion by 2027, exhibiting at a CAGR of 6.4% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct a well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.



Flip chip, or direct chip attach, technology is a semiconductor packaging solution that involves flipping the active area of a chip to cover all interconnections, package leads and metallic solders. It is a controlled collapse chip connection (C4)-based solution that uses bumps or balls soldered into the circuit board and underfilled with epoxy. Flip chip technology is used for interconnecting semiconductor devices, integrated circuit chips and micro-electromechanical systems (MEMS) to the external circuitry. In comparison to the traditionally used wire-based systems, flip chip technology consumes lesser space, enables a larger number of interconnects with shorter distances and enhances the efficiency of ultrasonic and microwave operations. As a result, it is widely used in the assembly of laptops, desktops, gaming devices, central processing units (CPUs) and chipsets.

Flip Chip Technology Market Trends:


Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Flip chip technology is widely used in consumer electronics and robotic solutions for device miniaturization, enhanced electrical efficiency and minimal power consumption. Moreover, the increasing requirement for multi-functional devices in various industries, such as automotive, telecommunication, medical and military, is providing a thrust to the market growth. For instance, the global positioning system (GPS), satellite-based navigation and radio detection and ranging (RADAR) systems use the technology for geo-sensing and operating military devices. In line with this, the emerging trend of real-world gaming is also contributing to the growth of the market. Flip chip technology is extensively used for embedding sensors and processors in gaming consoles and graphic cards for improved data transmission. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), and the utilization of flip chip technology for improved microwave and ultrasonic operations, are favoring the growth of the market. Other factors, including the increasing requirement for circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.

Key Market Segmentation:


The publisher provides an analysis of the key trends in each sub-segment of the global flip chip technology market, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on product, packaging technology, bumping technology and industry vertical.

Breakup by Product:

  • Memory
  • CMOS Image Sensor
  • LED
  • CPU
  • RF, Analog, Mixed Signal and Power IC
  • GPU
  • SOC

Breakup by Packaging Technology:

  • 3D IC
  • 2.5D IC
  • 2D IC

Breakup by Bumping Technology:

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others

Breakup by Industry Vertical:

  • Electronics
  • Healthcare
  • Automotive and Transport
  • IT and Telecommunication
  • Aerospace and Defense
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:


The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and United Microelectronics Corporation.

Key Questions Answered in This Report:


  • How has the global flip chip technology market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global flip chip technology market?
  • What are the key regional markets?
  • What is the breakup of the market based on the product?
  • What is the breakup of the market based on the packaging technology?
  • What is the breakup of the market based on the bumping technology?
  • What is the breakup of the market based on the industry vertical?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global flip chip technology market and who are the key players?
  • What is the degree of competition in the industry?
Frequently Asked Questions about the Global Flip Chip Technology Market

What is the estimated value of the Global Flip Chip Technology Market?

The Global Flip Chip Technology Market was estimated to be valued at $27.55 Billion in 2021.

What is the growth rate of the Global Flip Chip Technology Market?

The growth rate of the Global Flip Chip Technology Market is 6.2%, with an estimated value of $39.67 Billion by 2027.

What is the forecasted size of the Global Flip Chip Technology Market?

The Global Flip Chip Technology Market is estimated to be worth $39.67 Billion by 2027.

Who are the key companies in the Global Flip Chip Technology Market?

Key companies in the Global Flip Chip Technology Market include 3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited and Texas Instruments Incorporated.

Table of Contents

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Flip Chip Technology Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Product
6.1 Memory
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 CMOS Image Sensor
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 LED
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 CPU
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 RF, Analog, Mixed Signal and Power IC
6.5.1 Market Trends
6.5.2 Market Forecast
6.6 GPU
6.6.1 Market Trends
6.6.2 Market Forecast
6.7 SOC
6.7.1 Market Trends
6.7.2 Market Forecast
7 Market Breakup by Packaging Technology
7.1 3D IC
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 2.5D IC
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 2D IC
7.3.1 Market Trends
7.3.2 Market Forecast
8 Market Breakup by Bumping Technology
8.1 Copper Pillar
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Solder Bumping
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Gold Bumping
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Others
8.4.1 Market Trends
8.4.2 Market Forecast
9 Market Breakup by Industry Vertical
9.1 Electronics
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Healthcare
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Automotive and Transport
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 IT and Telecommunication
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Aerospace and Defense
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Others
9.6.1 Market Trends
9.6.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 3M Company
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 Amkor Technology Inc.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.2.3 Financials
15.3.2.4 SWOT Analysis
15.3.3 ASE Group
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.4 Fujitsu Limited
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 Intel Corporation
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6 Jiangsu Changdian Technology Co. Ltd.
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.7 Powertech Technology Inc.
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.7.4 SWOT Analysis
15.3.8 Samsung Electronics Co.Ltd.
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.8.3 Financials
15.3.8.4 SWOT Analysis
15.3.9 Taiwan Semiconductor Manufacturing Company Limited
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 Financials
15.3.9.4 SWOT Analysis
15.3.10 Texas Instruments Incorporated
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.10.4 SWOT Analysis
15.3.11 United Microelectronics Corporation
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.11.3 Financials
15.3.11.4 SWOT Analysis
List of Figures
Figure 1: Global: Flip Chip Technology Market: Major Drivers and Challenges
Figure 2: Global: Flip Chip Technology Market: Sales Value (in Billion US$), 2016-2021
Figure 3: Global: Flip Chip Technology Market Forecast: Sales Value (in Billion US$), 2022-2027
Figure 4: Global: Flip Chip Technology Market: Breakup by Product (in %), 2021
Figure 5: Global: Flip Chip Technology Market: Breakup by Packaging Technology (in %), 2021
Figure 6: Global: Flip Chip Technology Market: Breakup by Bumping Technology (in %), 2021
Figure 7: Global: Flip Chip Technology Market: Breakup by Industry Vertical (in %), 2021
Figure 8: Global: Flip Chip Technology Market: Breakup by Region (in %), 2021
Figure 9: Global: Flip Chip Technology (Memory) Market: Sales Value (in Million US$), 2016 & 2021
Figure 10: Global: Flip Chip Technology (Memory) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 11: Global: Flip Chip Technology (CMOS Image Sensor) Market: Sales Value (in Million US$), 2016 & 2021
Figure 12: Global: Flip Chip Technology (CMOS Image Sensor) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 13: Global: Flip Chip Technology (LED) Market: Sales Value (in Million US$), 2016 & 2021
Figure 14: Global: Flip Chip Technology (LED) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 15: Global: Flip Chip Technology (CPU) Market: Sales Value (in Million US$), 2016 & 2021
Figure 16: Global: Flip Chip Technology (CPU) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 17: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market: Sales Value (in Million US$), 2016 & 2021
Figure 18: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 19: Global: Flip Chip Technology (GPU) Market: Sales Value (in Million US$), 2016 & 2021
Figure 20: Global: Flip Chip Technology (GPU) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 21: Global: Flip Chip Technology (SOC) Market: Sales Value (in Million US$), 2016 & 2021
Figure 22: Global: Flip Chip Technology (SOC) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 23: Global: Flip Chip Technology (3D IC) Market: Sales Value (in Million US$), 2016 & 2021
Figure 24: Global: Flip Chip Technology (3D IC) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 25: Global: Flip Chip Technology (2.5D IC) Market: Sales Value (in Million US$), 2016 & 2021
Figure 26: Global: Flip Chip Technology (2.5D IC) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 27: Global: Flip Chip Technology (2D IC) Market: Sales Value (in Million US$), 2016 & 2021
Figure 28: Global: Flip Chip Technology (2D IC) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 29: Global: Flip Chip Technology (Copper Pillar) Market: Sales Value (in Million US$), 2016 & 2021
Figure 30: Global: Flip Chip Technology (Copper Pillar) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 31: Global: Flip Chip Technology (Solder Bumping) Market: Sales Value (in Million US$), 2016 & 2021
Figure 32: Global: Flip Chip Technology (Solder Bumping) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 33: Global: Flip Chip Technology (Gold Bumping) Market: Sales Value (in Million US$), 2016 & 2021
Figure 34: Global: Flip Chip Technology (Gold Bumping) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 35: Global: Flip Chip Technology (Other Bumping Technologies) Market: Sales Value (in Million US$), 2016 & 2021
Figure 36: Global: Flip Chip Technology (Other Bumping Technologies) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 37: Global: Flip Chip Technology (Electronics) Market: Sales Value (in Million US$), 2016 & 2021
Figure 38: Global: Flip Chip Technology (Electronics) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 39: Global: Flip Chip Technology (Healthcare) Market: Sales Value (in Million US$), 2016 & 2021
Figure 40: Global: Flip Chip Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 41: Global: Flip Chip Technology (Automotive and Transport) Market: Sales Value (in Million US$), 2016 & 2021
Figure 42: Global: Flip Chip Technology (Automotive and Transport) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 43: Global: Flip Chip Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2016 & 2021
Figure 44: Global: Flip Chip Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 45: Global: Flip Chip Technology (Aerospace and Defense) Market: Sales Value (in Million US$), 2016 & 2021
Figure 46: Global: Flip Chip Technology (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 47: Global: Flip Chip Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2016 & 2021
Figure 48: Global: Flip Chip Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 49: North America: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 50: North America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 51: United States: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 52: United States: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 53: Canada: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 54: Canada: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 55: Asia-Pacific: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 56: Asia-Pacific: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 57: China: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 58: China: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 59: Japan: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 60: Japan: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 61: India: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 62: India: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 63: South Korea: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 64: South Korea: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 65: Australia: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 66: Australia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 67: Indonesia: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 68: Indonesia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 69: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 70: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 71: Europe: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 72: Europe: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 73: Germany: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 74: Germany: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 75: France: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 76: France: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 77: United Kingdom: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 78: United Kingdom: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 79: Italy: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 80: Italy: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 81: Spain: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 82: Spain: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 83: Russia: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 84: Russia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 85: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 86: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 87: Latin America: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 88: Latin America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 89: Brazil: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 90: Brazil: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 91: Mexico: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 92: Mexico: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 93: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 94: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 95: Middle East and Africa: Flip Chip Technology Market: Sales Value (in Million US$), 2016 & 2021
Figure 96: Middle East and Africa: Flip Chip Technology Market: Breakup by Country (in %), 2021
Figure 97: Middle East and Africa: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 98: Global: Flip Chip Technology Industry: SWOT Analysis
Figure 99: Global: Flip Chip Technology Industry: Value Chain Analysis
Figure 100: Global: Flip Chip Technology Industry: Porter's Five Forces Analysis
List of Tables
Table 1: Global: Flip Chip Technology Market: Key Industry Highlights, 2021 and 2027
Table 2: Global: Flip Chip Technology Market Forecast: Breakup by Product (in Million US$), 2022-2027
Table 3: Global: Flip Chip Technology Market Forecast: Breakup by Packaging Technology (in Million US$), 2022-2027
Table 4: Global: Flip Chip Technology Market Forecast: Breakup by Bumping Technology (in Million US$), 2022-2027
Table 5: Global: Flip Chip Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2022-2027
Table 6: Global: Flip Chip Technology Market Forecast: Breakup by Region (in Million US$), 2022-2027
Table 7: Global: Flip Chip Technology Market: Competitive Structure
Table 8: Global: Flip Chip Technology Market: Key Players

Companies Mentioned

  • 3M Company
  • Amkor Technology Inc.
  • ASE Group
  • Fujitsu Limited
  • Intel Corporation
  • Jiangsu Changdian Technology Co. Ltd.
  • Powertech Technology Inc.
  • Samsung Electronics Co.Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • United Microelectronics Corporation.

Methodology

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