Chemical mechanical planarization Market - Forecast (2021-2026)

Chemical mechanical planarization Market Overview

Chemical mechanical planarization (CMP) market is expected to reach $7649 million by 2026 at a CAGR of 7.2% during the forecast period 2021-2026. owing to the technological advancements in fabrication and semiconductor processes, mainly to enhance the performance of the semiconductor. The increasing investment in semiconductor wafer fabrication materials by manufacturers for product innovation is primarily driving the studied market growth. In addition, rising demand for micro electromechanical systems is another factor expected to further fuel growth of the global market over the forecast period 2021-2026.

Chemical mechanical planarization Market Report Coverage

The report: “Chemical mechanical planarization Market - Forecast (2021-2026)” covers an in-depth analysis of the following segments of the Chemical mechanical planarization market

By Type: CMP Equipment, CMP Consumable

By Device Type: Memory, Logic

By Technology: Leading Edge, More Than Moore’s, Emerging

By Application: Integrated Circuits, Mems & Nems, Compound Semiconductors, Optics, Others

By Geography: North America (U.S, Canada, Mexico), South America(Brazil, Argentina and others), Europe(Germany, UK, France, Italy, Spain, Russia and Others), APAC(China, Japan India, SK, Aus and Others), and RoW (Middle east and Africa)

Key Takeaways

• APAC dominated the market by a market share of more than 35.5% in 2019, the economy of APAC is majorly influenced by the major countries such as China and India. In these countries, the government are investing heavily for the development of several industries such as Semiconductor, consumer electronics and so on.
• The demand for planarization in semiconductor devices will increase with an expanding number of end-use applications such as IC manufacturing, micro-electro-mechanical systems (MEMS), optics, compound semiconductors, and computer hard drive manufacturing.
• The prominent players of chemical mechanical planarization (CMP) market are focusing on product innovation and expansion of their product line to meet demand associated with different applications and segments.
• Chemical mechanical planarization top 10 companies include Cabot Microelectronics Corporation, DOW Electronic Materials, Ebara Corporation, Fujimi Incorporated, LAM Research Corporation, Lapmaster Wolters GmbH, Strasbaugh Inc., DuPont Electronic Solutions, BASF SE, Sungmoon Electronics Co. Ltd among others.

Chemical mechanical planarization Market Segment Analysis - By Device Type

Memory segment is growing at a highest CAGR of 9.2% in the forecast period. Flash memory has been an essential driving force due to the increasing popularity of mobile devices with large storage requirements. Also, emerging technology such as NVM (Non-Volatile Memory), which offers better speed and durability than traditional NAND is expected to poise the memory growth. As NAND technology moved from 2D to 3D, additional CMP steps were added, such as channel poly CMP and staircase (or ILD) CMP. Channel poly CMP is to polish many materials simultaneously, such as SiN, oxide, and poly-Si. Therefore, it needs an individual material rate tunability to meet the final topography requirement. It is thereby increasing the demand for the CMP market in the forecast period 2021-2026.

Chemical mechanical planarization Market Segment Analysis - By Type

CMP consumables is growing at a CAGR of 9.8% in the forecast period. The CMP consumables market is seeing increased growth in the forecast period as it plays a significant role in manufacturing of transistors, and other interconnect devices smaller for building a new generation of chips. The growing adoption of transistors and ongoing development in the industry, down to the 5 nm node from the 14 nm node, also presents massive opportunities for the CMP consumables. In addition CMP consumables has become a standard manufacturing process practiced by the semiconductor manufacturers to fabricate integrated circuits (IC) and memory disks. Therefore, these growing adoption of these consumables is analyzed to drive the market for CMP consumables in the forecast period 2021-2026.

Chemical mechanical planarization Market Segment Analysis - By Geography

APAC dominated the market by a market share of more than 33.5% in 2019, the economy of APAC is majorly influenced by the major countries such as China and India. In these countries, the government are investing heavily for the development of several industries such as Semiconductor, consumer electronics and so on. Moreover with the rising trade war between the United States and China, China is pushing ahead with the development of its own chip industry. Also, Chinese firms such as Huawei Technologies Co., Ltd has been banned from American technology, which is further boosting China’s push for its own semiconductor industry. In addition, the government initiative such as Made in China 2026 plan, aims to boost the production of higher-value products. As a result, China aims to produce 40% of the semiconductors it uses by 2021 and 70% by 2026. Also, this initiative would also support China's aim to become a world leader in developing semiconductor silicon chips, including NAND, DRAM, CPUs, and GPUs. Owing to such developments in China, several competitors in the APAC region are intensifying their efforts of expansion. In 2019, SK Hynix, the world’s second-largest memory-chip maker announced that it is planning to invest $106 billion to establish four new semiconductor fabrication plants in Seoul, South Korea. Similarly, Indian government has also invested $111 for providing a boost to the semiconductor as well as the electronics manufacturing. Therefore, the above factors are expected to drive the market for CMP in the forecast period 2021-2026.

Chemical mechanical planarization Market Drivers

Growing demand for CMP in Semiconductor manufacturing

Chemical Mechanical Planarization is an enabling technology that has rapidly spread throughput the semiconductor manufacturing process. The demand for planarization in semiconductor devices will increase with an expanding number of end-use applications such as IC manufacturing, micro-electro-mechanical systems (MEMS), optics, compound semiconductors, and computer hard drive manufacturing. In addition the increasing global semiconductor sales and growing economic activities in Asia-Pacific and North America is providing opportunities to the CMP equipment manufacturers. Moreover growing investments by governments of several countries in the production next generation semiconductor is also analyzed to drive the market. In 2019 China has committed to invest $29 billion state-backed fund to invest in the semiconductor industry in advancing its goal of reducing a dependency on U.S. technology. Similarly, U.S has also committed to invest heavily for the production of next generation semiconductors. Hence increasing investments and applications in semiconductors are analyzed to drive the market in the forecast period 2021-2026.

Advancements in CMP process

The prominent players of chemical mechanical planarization (CMP) market are focusing on product innovation and expansion of their product line to meet demand associated with different applications and segments. For instance, in 2017, Cabot launched LITX 300, a new conductive additive for high power lithium-ion battery applications. Cabot has also launched two new CAB-O-SIL products for use as external additives in electro photographic toner applications. Similarly, Samsung unveiled the 850 EVO M.2 and 850 EVO mSATA solid state drive (SSD) line-ups. Moreover in March 2021 US-based ACM Research Inc. has launched the Ultra SFP AP tool for advanced packaging solutions. It leverages ACM's stress-free polishing (SFP) technology and integrates it with CMP and wet-etch chambers into a single system. It is designed to save more than 80% of slurry for metal polishing in 2.5D and 3D package applications. Hence these advancements are analysed to drive the market in the forecast period 2021-2026.

Chemical mechanical planarization Market Challenges

Limitations of Chemical mechanical planarization

Defects in chemical mechanical planarization is one of the major yield detractors in IC (integrated circuit) devices. In addition new structures and materials in 7nm devices make it challenging for the chemical mechanical planarization process to meet device requirements. The chemical mechanical planarization process needs to control or contain not only the number of defects, but also defect size in accordance with the scaling speed. Issues such as film delamination, scratching, dishing, erosion, and corrosion can lead to defects during the chemical mechanical planarization process. This can adversely affect the yield and reliability. Hence these limitations will restrain the market growth in the forecast period 2021-2026.

Chemical mechanical planarization Market Landscape

Acquisitions, Partnerships and R&D activities are key strategies adopted by players in the Chemical mechanical planarization market. In 2019, the market of Chemical mechanical planarization industry outlook has been fragmented by several companies. Chemical mechanical planarization top 10 companies include Cabot Microelectronics Corporation, DOW Electronic Materials, Ebara Corporation, Fujimi Incorporated, LAM Research Corporation, Lapmaster Wolters GmbH, Strasbaugh Inc., DuPont Electronic Solutions, BASF SE, Sungmoon Electronics Co. Ltd among others.

Acquisitions/Technology Launches

• In January 2021 - Entegris Inc, acquired Sinmat. Sinmat's Chemical Mechanical Planarization (CMP) slurries are used for polishing ultra-hard surface materials, including SiC (silicon carbide) and GaN (gallium nitride). SiC and GaN are substrates utilized in the fast-growing end-markets of power electronics and advanced communications. This acquisition has enhanced the product offerings of Entegris Inc.