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The semiconductor glass wafer market is forecasted to grow by USD 174.2 million during 2024-2029, accelerating at a CAGR of 4.6% during the forecast period. The report on the semiconductor glass wafer market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of advanced and compact consumer electronic devices, exponential demand growth of iot devices, and growing demand for mems devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
The semiconductor glass wafer market is segmented as below:
By Type
- Borosilicate glass
- Quartz
- Fused silica
By Application
- Consumer electronics
- Automotive
- Industrial
- Aerospace and defense
- Others
By Technology
- Polished glass wafers
- Coated glass wafers
- Bonded glass wafers
- Etched glass wafers
By Product Type
- Less than 100 mm
- 100 mm to 200 mm
- 200 mm to 300 mm
- Above 300 mm
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the semiconductor glass wafer market covers the following areas:
- Semiconductor Glass Wafer Market sizing
- Semiconductor Glass Wafer Market forecast
- Semiconductor Glass Wafer Market industry analysis
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Analysis
3 Market Landscape
4 Market Sizing
5 Historic Market Size
6 Qualitative Analysis
7 Five Forces Analysis
8 Market Segmentation by Type
9 Market Segmentation by Application
10 Market Segmentation by Technology
11 Market Segmentation by Product Type
100 mm to 200 mm - Market size and forecast 2024-2029
200 mm to 300 mm - Market size and forecast 2024-2029
12 Customer Landscape
13 Geographic Landscape
14 Drivers, Challenges, and Opportunity/Restraints
15 Competitive Landscape
16 Competitive Analysis
17 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global semiconductor glass wafer market: AGC Inc., BULLEN ULTRASONICS, Coresix Precision Glass Inc., Corning Inc., HOYA CANDEO OPTRONICS CORP., Mosaic Microsystems, Nano Quarz Wafer, Nippon Electric Glass Co. Ltd., Plan Optik AG, SCHOTT AG, Shin Etsu Chemical Co. Ltd., Specialty Glass Products, Sumitomo Electric Industries Ltd., Swift Glass Co Inc., Sydor Optics, and TECNISCO LTD..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is growing proliferation of iot and connected devices."
According to the report, one of the major drivers for this market is the emergence of advanced and compact consumer electronic devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AGC Inc.
- BULLEN ULTRASONICS
- Coresix Precision Glass Inc.
- Corning Inc.
- HOYA CANDEO OPTRONICS CORP.
- Mosaic Microsystems
- Nano Quarz Wafer
- Nippon Electric Glass Co. Ltd.
- Plan Optik AG
- SCHOTT AG
- Shin Etsu Chemical Co. Ltd.
- Specialty Glass Products
- Sumitomo Electric Industries Ltd.
- Swift Glass Co Inc.
- Sydor Optics
- TECNISCO LTD.
