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US Hermetic Packaging Market (2022-2027) by Configuration, Type, Application, Industry, Competitive Analysis and the Impact of Covid-19 with Ansoff Analysis

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  • 187 Pages
  • March 2022
  • Region: United States
  • Infogence Global Research
  • ID: 5585857
The US Hermetic Packaging Market is estimated to be USD 748.92 Mn in 2022 and is projected to reach USD 966.35 Mn by 2027, growing at a CAGR of 5.23%.

Market dynamics are forces that impact the prices and behaviors of the US Hermetic Packaging Market stakeholders. These forces create pricing signals which result from the changes in the supply and demand curves for a given product or service. Forces of Market Dynamics may be related to macro-economic and micro-economic factors. There are dynamic market forces other than price, demand, and supply. Human emotions can also drive decisions, influence the market, and create price signals.

As the market dynamics impact the supply and demand curves, decision-makers aim to determine the best way to use various financial tools to stem various strategies for speeding the growth and reducing the risks.

Market Segmentations

The US Hermetic Packaging Market is segmented based on Configuration, Type, Application, and Industry
  • By Configuration, the market is classified into Metal Can Packages, Multilayer Ceramic Packages, and Pressed Ceramic Packages.
  • By Type, the market is classified into Ceramic-Metal Sealing, Glass-Metal Sealing, Passivation Glass, Reed Glass, and Transponder Glass.
  • By Application, the market is classified into Transistors, Sensors, Lasers, Airbag Ignitors, Photodiodes, Oscillating Crystals, MEMS Switches, and Others.
  • By Industry, the market is classified into Military & Defense, Aeronautics & Space, Automotive, Energy & Nuclear Safety, Medical, Telecommunications, Consumer Electronics, and Others.

Company Profiles

The report provides a detailed analysis of the competitors in the market. It covers the financial performance analysis for the publicly listed companies in the market. The report also offers detailed information on the companies' recent development and competitive scenario. Some of the companies covered in this report are Ametek Inc, Amkor Technology Inc, Aptiv plc, Bel Fuse Inc, Ceramtec, Coat-X, Complete Hermetics, Egide, Hermetic Solutions Group, ITT Inc, Kyocera Corp, Legacy Technologies Inc, Mackin Technologies, Materion Corp, Micross Components Inc, etc.

Competitive Quadrant

The report includes Competitive Quadrant, a proprietary tool to analyze and evaluate the position of companies based on their Industry Position score and Market Performance score. The tool uses various factors for categorizing the players into four categories. Some of these factors considered for analysis are financial performance over the last 3 years, growth strategies, innovation score, new product launches, investments, growth in market share, etc.

Ansoff Analysis

The report presents a detailed Ansoff matrix analysis for the US Hermetic Packaging Market. Ansoff Matrix, also known as Product/Market Expansion Grid, is a strategic tool used to design strategies for the growth of the company. The matrix can be used to evaluate approaches in four strategies viz. Market Development, Market Penetration, Product Development and Diversification. The matrix is also used for risk analysis to understand the risk involved with each approach.

The analyst analyses the US Hermetic Packaging Market using the Ansoff Matrix to provide the best approaches a company can take to improve its market position.

Based on the SWOT analysis conducted on the industry and industry players, The analyst has devised suitable strategies for market growth.

Why buy this report?

  • The report offers a comprehensive evaluation of the US Hermetic Packaging Market. The report includes in-depth qualitative analysis, verifiable data from authentic sources, and projections about market size. The projections are calculated using proven research methodologies.
  • The report has been compiled through extensive primary and secondary research. The primary research is done through interviews, surveys, and observation of renowned personnel in the industry.
  • The report includes an in-depth market analysis using Porter's 5 forces model and the Ansoff Matrix. In addition, the impact of Covid-19 on the market is also featured in the report.
  • The report also includes the regulatory scenario in the industry, which will help you make a well-informed decision. The report discusses major regulatory bodies and major rules and regulations imposed on this sector across various geographies.
  • The report also contains the competitive analysis using Positioning Quadrants, the analyst's Proprietary competitive positioning tool.

Report Highlights:

  • A complete analysis of the market, including parent industry
  • Important market dynamics and trends
  • Market segmentation
  • Historical, current, and projected size of the market based on value and volume
  • Market shares and strategies of key players
  • Recommendations to companies for strengthening their foothold in the market

Table of Contents

1 Report Description
1.1 Study Objectives
1.2 Market Definition
1.3 Currency
1.4 Years Considered
1.5 Language
1.6 Key Stakeholders
2 Research Methodology
2.1 Research Process
2.2 Data Collection and Validation
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Models
2.3 Market Size Estimation
2.3.1 Bottom-Up Approach
2.3.2 Top-Down Approach
2.4 Assumptions of the Study
2.5 Limitations of the Study
3 Executive Summary
3.1 Introduction
3.2 Market Size, Segmentations and Outlook
4 Market Dynamics
4.1 Drivers
4.1.1 Increasing Use of Hermetic Packaging for Protecting Highly Sensitive Electronic Components
4.1.2 Increasing Demand from Industries Such as Aerospace and Automobile Electronics
4.2 Restraints
4.2.1 Stringent Leak Rate Requirements for Hermetic Packaging
4.3 Opportunities
4.3.1 Adoption of Hermetic Packaging For the Protection of Implantable Medical Devices
4.4 Challenges
4.4.1 High Infrastructure Cost Incurred Due to the Controlled and Regulated Packaging Environment
4.4.2 Emergence of Quasi-Hermetic Packaging
5 Market Analysis
5.1 Regulatory Scenario
5.2 Porter's Five Forces Analysis
5.3 Impact of COVID-19
5.4 Ansoff Matrix Analysis
6 US Hermetic Packaging Market, By Configuration
6.1 Introduction
6.2 Metal Can Packages
6.3 Multilayer Ceramic Packages
6.4 Pressed Ceramic Packages
7 US Hermetic Packaging Market, By Type
7.1 Introduction
7.2 Ceramic-Metal Sealing
7.3 Glass-Metal Sealing
7.4 Passivation Glass
7.5 Reed Glass
7.6 Transponder Glass
8 US Hermetic Packaging Market, By Application
8.1 Introduction
8.2 Transistors
8.3 Sensors
8.4 Lasers
8.5 Airbag Ignitors
8.6 Photodiodes
8.7 Oscillating Crystals
8.8 MEMS Switches
8.9 Others
9 US Hermetic Packaging Market, By Industry
9.1 Introduction
9.2 Military & Defense
9.3 Aeronautics & Space
9.4 Automotive
9.5 Energy & Nuclear Safety
9.6 Medical
9.7 Telecommunications
9.8 Consumer Electronics
9.9 Others
10 Competitive Landscape
10.1 Competitive Quadrant
10.2 Market Share Analysis
10.3 Strategic Initiatives
10.3.1 M&A and Investments
10.3.2 Partnerships and Collaborations
10.3.3 Product Developments and Improvements
11 Company Profiles
11.1 Ametek Inc
11.2 Amkor Technology Inc
11.3 Aptiv plc
11.4 Bel Fuse Inc
11.5 Ceramtec
11.6 Coat-X
11.7 Complete Hermetics
11.8 Egide
11.9 Hermetic Solutions Group
11.10 ITT Inc
11.11 Kyocera Corp
11.12 Legacy Technologies Inc
11.13 Mackin Technologies
11.14 Materion Corp
11.15 Micross Components Inc
11.16 Palomar Technologies
11.17 Renesas Electronics Corp (Intersil Corp)
11.18 Rosenberger
11.19 Schott Ag
11.20 Special Hermetic Products Inc
11.21 Stratedge
11.22 Teledyne Technologies Inc
11.23 Winchester Interconnect
12 Appendix
12.1 Questionnaire

Companies Mentioned

  • Ametek Inc
  • Amkor Technology Inc
  • Aptiv plc
  • Bel Fuse Inc
  • Ceramtec
  • Coat-X
  • Complete Hermetics
  • Egide
  • Hermetic Solutions Group
  • ITT Inc
  • Kyocera Corp
  • Legacy Technologies Inc
  • Mackin Technologies
  • Materion Corp
  • Micross Components Inc
  • Palomar Technologies
  • Renesas Electronics Corp (Intersil Corp)
  • Rosenberger
  • Schott Ag
  • Special Hermetic Products Inc
  • Stratedge
  • Teledyne Technologies Inc
  • Winchester Interconnect

Table Information