The Latin America, Middle East and Africa Wafer Level Packaging Market is expected to witness market growth of 21.6% CAGR during the forecast period (2022-2028).
One of the most important applications for WLP was still to come, as I/O requirements grew, necessitating ever-higher connection density. The RDL, or Redistribution Layer, was born as a result of this, and it reroutes chip connections via conductive metal traces. RDL is also useful since it allows WLP packaging to incorporate multiple chips with distinct functionalities, resulting in the SiP, or System in Package. These encapsulated systems are commonly employed in the mobile device market because they can be manufactured very small to fit space constraints and because they bundle all of the required functionality into an individual structure.
Wafer level fan-out, a low-density technology that promises to reduce fan-out costs, is being implemented by a number of packaging companies. FOPLP is projected to be critical for future 5G, AI, Biotech, smart city, Advanced Driver Assistance System (ADAS), and IoT applications. Major criteria include the ability to offer innovative testing and packing services as well as secure customer relationships. Wafer level packaging technology is in high demand across a variety of industries, including consumer electronics, aerospace and defense, automotive, telecommunications, and others, due to its smaller form factor and improved thermal performance.
The increased popularity of advanced and high-end technology-based items, along with reduced electronics prices, has resulted in a spike in consumer electronics demand. Additionally, technological innovations, such as the Internet of Things, or IoT as well as Long-Term Evolution (LTE), are supporting the consumption of electronic goods in the region, which will help the region's semiconductor market to strengthen in the next years. Moreover, increased utilization of smartphones, televisions, and laptops in Brazil and Mexico is expected to benefit the Latin American market. Consumers in this region are spending on high-end electronic equipment as their disposable income levels continue to rise.
The availability of skilled labor resources, as well as substantial technological breakthroughs, is expected to propel the wafer level packaging market in the Middle East and Africa to new heights during the coming years. Furthermore, innovative industrial electronics, as well as high-end computing technologies, are in high demand throughout the region, due to which, the demand for semiconductors is estimated to surge in the region. This factor is expected to benefit the demand for wafer packaging solutions and the growth of the wafer level packaging market is expected to be propelled.
The Brazil market dominated the LAMEA Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $243.7 million by 2028. The Argentina market is estimated to grow at a CAGR of 22.3% during (2022 - 2028). Additionally, The UAE market is expected to display a CAGR of 21.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
One of the most important applications for WLP was still to come, as I/O requirements grew, necessitating ever-higher connection density. The RDL, or Redistribution Layer, was born as a result of this, and it reroutes chip connections via conductive metal traces. RDL is also useful since it allows WLP packaging to incorporate multiple chips with distinct functionalities, resulting in the SiP, or System in Package. These encapsulated systems are commonly employed in the mobile device market because they can be manufactured very small to fit space constraints and because they bundle all of the required functionality into an individual structure.
Wafer level fan-out, a low-density technology that promises to reduce fan-out costs, is being implemented by a number of packaging companies. FOPLP is projected to be critical for future 5G, AI, Biotech, smart city, Advanced Driver Assistance System (ADAS), and IoT applications. Major criteria include the ability to offer innovative testing and packing services as well as secure customer relationships. Wafer level packaging technology is in high demand across a variety of industries, including consumer electronics, aerospace and defense, automotive, telecommunications, and others, due to its smaller form factor and improved thermal performance.
The increased popularity of advanced and high-end technology-based items, along with reduced electronics prices, has resulted in a spike in consumer electronics demand. Additionally, technological innovations, such as the Internet of Things, or IoT as well as Long-Term Evolution (LTE), are supporting the consumption of electronic goods in the region, which will help the region's semiconductor market to strengthen in the next years. Moreover, increased utilization of smartphones, televisions, and laptops in Brazil and Mexico is expected to benefit the Latin American market. Consumers in this region are spending on high-end electronic equipment as their disposable income levels continue to rise.
The availability of skilled labor resources, as well as substantial technological breakthroughs, is expected to propel the wafer level packaging market in the Middle East and Africa to new heights during the coming years. Furthermore, innovative industrial electronics, as well as high-end computing technologies, are in high demand throughout the region, due to which, the demand for semiconductors is estimated to surge in the region. This factor is expected to benefit the demand for wafer packaging solutions and the growth of the wafer level packaging market is expected to be propelled.
The Brazil market dominated the LAMEA Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $243.7 million by 2028. The Argentina market is estimated to grow at a CAGR of 22.3% during (2022 - 2028). Additionally, The UAE market is expected to display a CAGR of 21.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
ByType
- WLCSP
- 5D TSV WLP
- 3D TSV WLP
- Nano WLP
- Others
By Technology
- Fan IN
- Fan OUT
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. LAMEA Wafer Level Packaging Market by End User
Chapter 4. LAMEA Wafer Level Packaging Market by Type
Chapter 5. LAMEA Wafer Level Packaging Market by Technology
Chapter 6. LAMEA Wafer Level Packaging Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
Methodology
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