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North America Passive And Interconnecting Electronic Components Market Size, Share & Industry Trends Analysis Report By Type (Interconnecting, and Passive), By Interconnecting Type, By Passive Type, By Application, By Country and Growth Forecast, 2022 - 2028

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    Report

  • 102 Pages
  • June 2022
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5636283
The North America Passive And Interconnecting Electronic Components Market is expected to witness market growth of 4.7% CAGR during the forecast period (2022-2028).

Smart grids are energy networks that can monitor energy flows automatically and respond to changes in supply and demand as needed. Smart grids reach consumers and suppliers by giving real-time usage statistics when combined with smart metering systems.

Smart grids, which display information on supply and demand, are especially useful for integrating increasing amounts of variable renewable energy sources, such as solar and wind power, as well as new loads, such as energy storage and electric vehicle charging while maintaining system stability and efficiency. Furthermore, smart grids allow consumers who generate their own energy to react to market prices by selling excess energy back to the grid.

Smart grids enable new market actors such as aggregators and energy service firms to deliver new sorts of services to customers, allowing them to modify their use and benefit from the grid's flexibility.

The United States Census Bureau released a report today that looks at computer and internet usage trends in 2018. The report, Computer and Internet Use in the United States: 2018, analyzes trends at the national, state, and county levels using data from the American Community Survey (ACS). Over the last few decades, the use of computers has increased dramatically. The percentage of households that utilize the internet has risen over time as well. The internet has had an impact on their professional lives as well, allowing us to work from home more frequently. Data from the Current Population Survey is used to offer historical context, while data from the American Community Survey is used to emphasize more current patterns.

Smartphone ownership has exceeded all other computing device ownership. Smartphones were found in 84 percent of households, whereas 78 percent had a desktop or laptop computer. The percentage of people who own a tablet has dropped to 63 percent. Those of cities were more likely than residents of rural areas to use computers (93 percent of urban households vs. 89 percent of rural households) and to have some type of internet subscription (86 percent of urban households compared to 81 percent of rural households).

The US market dominated the North America Passive And Interconnecting Electronic Components Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $50,605.4 million by 2028. The Canada market is anticipated to grow at a CAGR of 7% during (2022-2028). Additionally, The Mexico market is expected to showcase a CAGR of 6.1% during (2022-2028).

Based on Type, the market is segmented into Interconnecting, and Passive. Based on Interconnecting Type, the market is segmented into Connectors/Sockets, PCB, Switches, Relays, and Others. Based on Passive Type, the market is segmented into Capacitors, Resistors & Inductors, Transformers and Diode. Based on Application, the market is segmented into Consumer Electronics, Aerospace & Defense, IT & Telecom, Automotive, Industrial, Healthcare and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include TE Connectivity Ltd., Samsung Electro-Mechanics Co., Ltd. (Samsung Group), Fujitsu Limited, Vishay Intertechnology, Inc., Panasonic Corporation, Rohm Semiconductors Co., Ltd., TDK Corporation, Murata Manufacturing Co., Ltd., Yageo Corporation, and Koch Industries, Inc. (Molex LLC).

Scope of the Study


Market Segments Covered in the Report:


By Type
  • Interconnecting
  • Connectors/Sockets
  • PCB
  • Switches
  • Relays
  • Others
  • Passive
  • Capacitors
  • Resistors & Inductors
  • Transformers
  • Diode
By Application
  • Consumer Electronics
  • Aerospace & Defense
  • IT & Telecom
  • Automotive
  • Industrial
  • Healthcare
  • Others
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America

Key Market Players


List of Companies Profiled in the Report:

  • TE Connectivity Ltd.
  • Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
  • Fujitsu Limited
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Rohm Semiconductors Co., Ltd.
  • TDK Corporation
  • Murata Manufacturing Co., Ltd.
  • Yageo Corporation
  • Koch Industries, Inc. (Molex LLC)

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Passive And Interconnecting Electronic Components Market, by Type
1.4.2 North America Passive And Interconnecting Electronic Components Market, by Application
1.4.3 North America Passive And Interconnecting Electronic Components Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in Passive And Interconnecting Electronic Components Market
Chapter 4. North America Passive And Interconnecting Electronic Components Market by Type
4.1 North America Interconnecting Market by Country
4.2 North America Passive And Interconnecting Electronic Components Market by Interconnecting Type
4.2.1 North America Connectors/Sockets Market by Country
4.2.2 North America PCB Market by Country
4.2.3 North America Switches Market by Country
4.2.4 North America Relays Market by Country
4.2.5 North America Others Market by Country
4.3 North America Passive Market by Country
4.4 North America Passive And Interconnecting Electronic Components Market by Passive Type
4.4.1 North America Capacitors Market by Country
4.4.2 North America Resistors & Inductors Market by Country
4.4.3 North America Transformers Market by Country
4.4.4 North America Diode Market by Country
Chapter 5. North America Passive And Interconnecting Electronic Components Market by Application
5.1 North America Consumer Electronics Market by Country
5.2 North America Aerospace & Defense Market by Country
5.3 North America IT & Telecom Market by Country
5.4 North America Automotive Market by Country
5.5 North America Industrial Market by Country
5.6 North America Healthcare Market by Country
5.7 North America Others Market by Country
Chapter 6. North America Passive And Interconnecting Electronic Components Market by Country
6.1 US Passive And Interconnecting Electronic Components Market
6.1.1 US Passive And Interconnecting Electronic Components Market by Type
6.1.1.1 US Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.1.1.2 US Passive And Interconnecting Electronic Components Market by Passive Type
6.1.2 US Passive And Interconnecting Electronic Components Market by Application
6.2 Canada Passive And Interconnecting Electronic Components Market
6.2.1 Canada Passive And Interconnecting Electronic Components Market by Type
6.2.1.1 Canada Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.2.1.2 Canada Passive And Interconnecting Electronic Components Market by Passive Type
6.2.2 Canada Passive And Interconnecting Electronic Components Market by Application
6.3 Mexico Passive And Interconnecting Electronic Components Market
6.3.1 Mexico Passive And Interconnecting Electronic Components Market by Type
6.3.1.1 Mexico Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.3.1.2 Mexico Passive And Interconnecting Electronic Components Market by Passive Type
6.3.2 Mexico Passive And Interconnecting Electronic Components Market by Application
6.4 Rest of North America Passive And Interconnecting Electronic Components Market
6.4.1 Rest of North America Passive And Interconnecting Electronic Components Market by Type
6.4.1.1 Rest of North America Passive And Interconnecting Electronic Components Market by Interconnecting Type
6.4.1.2 Rest of North America Passive And Interconnecting Electronic Components Market by Passive Type
6.4.2 Rest of North America Passive And Interconnecting Electronic Components Market by Application
Chapter 7. Company Profiles
7.1 TE Connectivity Ltd.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 Recent strategies and developments
7.1.5.1 Product Launches and Product Expansions
7.1.5.2 Acquisition and Mergers
7.1.6 SWOT Analysis
7.2 Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 Fujitsu Limited
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental Analysis
7.3.4 SWOT Analysis
7.4 Vishay Intertechnology, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research and Development Expense
7.4.5 Recent strategies and developments
7.4.5.1 Product Launches and Product Expansions
7.4.5.2 Acquisition and Mergers
7.5 Panasonic Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments
7.5.5.1 Product Launches and Product Expansions
7.6 Rohm Semiconductors Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 TDK Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.8 Murata Manufacturing Co., Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Yageo Corporation
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional and Segmental Analysis
7.10. Koch Industries, Inc. (Molex LLC)
7.10.1 Company Overview

Companies Mentioned

  • TE Connectivity Ltd.
  • Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
  • Fujitsu Limited
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Rohm Semiconductors Co., Ltd.
  • TDK Corporation
  • Murata Manufacturing Co., Ltd.
  • Yageo Corporation
  • Koch Industries, Inc. (Molex LLC)

Methodology

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