The APAC radiation-hardened electronics market is expected to grow from US$ 250.30 million in 2021 to US$ 366.01 million by 2028; it is estimated to grow at a CAGR of 5.6% from 2021 to 2028.
The increase in demand for radiation-hardened electronics by the end-use industries has influenced manufacturers to invest in product development. Some of the major players operating in the market include BAE Systems; Microchip Technology Inc.; Texas Instruments Incorporated; Renesas Electronics Corporation; and Xilinx, Inc. Some of the recent product developments across the region have taken place in recent years. For instance, in October 2021, VORAGO Technologies announced the Arm Cortex-M4 VA41628 and VA41629, 2 new radiation-hardened microcontrollers designed to give flexibility in space-based missions for the aerospace and defense sector. Consumers of the product will be able to upgrade from previous generations of rad-hard arm microcontrollers with functional compatibility and a more powerful entry-level M4 core and scale up to more highly integrated M4 core options with code compatibility owing to the new product additions to VORAGO's M4 family. Further, Renesas Electronics Corporation introduced a new radiation-hardened 16-channel current driver with an integrated 4-bit decoder in May 2019 to help satellite command and telemetry systems reduce their size, weight, and power (SWaP). The ISL72814SEH combines the decoder, input level shifter, and 16 current driver arrays in a single monolithic IC. For Medium Earth Orbit (MEO), Geosynchronous Earth Orbit (GEO), Highly Elliptical Orbit (HEO), and deep space mission profiles, the device allows satellite designers to considerably boost system capacity while reducing solution footprint by 50%. The rise in investment in product development by the radiation-hardened electronic manufacturers is expected to contribute to the growth of the radiation-hardened electronics market over the forecast period.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the APAC radiation-hardened electronics market. The APAC radiation-hardened electronics market is expected to grow at a good CAGR during the forecast period.
BAE Systems; Data Device Corporation; Honeywell International Inc.; Infineon Technologies AG; Microchip Technology Inc.; Renesas Electronics Corporation; STMicroelectronics; Texas Instruments Incorporated; VORAGO Technologies; and Xilinx, Inc. (AMD) are among the leading companies in the APAC radiation-hardened electronics market.
The increase in demand for radiation-hardened electronics by the end-use industries has influenced manufacturers to invest in product development. Some of the major players operating in the market include BAE Systems; Microchip Technology Inc.; Texas Instruments Incorporated; Renesas Electronics Corporation; and Xilinx, Inc. Some of the recent product developments across the region have taken place in recent years. For instance, in October 2021, VORAGO Technologies announced the Arm Cortex-M4 VA41628 and VA41629, 2 new radiation-hardened microcontrollers designed to give flexibility in space-based missions for the aerospace and defense sector. Consumers of the product will be able to upgrade from previous generations of rad-hard arm microcontrollers with functional compatibility and a more powerful entry-level M4 core and scale up to more highly integrated M4 core options with code compatibility owing to the new product additions to VORAGO's M4 family. Further, Renesas Electronics Corporation introduced a new radiation-hardened 16-channel current driver with an integrated 4-bit decoder in May 2019 to help satellite command and telemetry systems reduce their size, weight, and power (SWaP). The ISL72814SEH combines the decoder, input level shifter, and 16 current driver arrays in a single monolithic IC. For Medium Earth Orbit (MEO), Geosynchronous Earth Orbit (GEO), Highly Elliptical Orbit (HEO), and deep space mission profiles, the device allows satellite designers to considerably boost system capacity while reducing solution footprint by 50%. The rise in investment in product development by the radiation-hardened electronic manufacturers is expected to contribute to the growth of the radiation-hardened electronics market over the forecast period.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the APAC radiation-hardened electronics market. The APAC radiation-hardened electronics market is expected to grow at a good CAGR during the forecast period.
APAC Radiation-Hardened Electronics Market Segmentation
The APAC radiation-hardened electronics market is segmented based on component, manufacturing technique, application, and country. Based on component, the market is segmented into power management components, analog and digital mixed signal devices, memory, and controllers & processors. The power management component segment dominated the market in 2021 and is expected to be the fastest-growing segment during the forecast period. Based on manufacturing technique, the market is segmented into radiation hardening by design (RHBD) and radiation hardening by process (RHBP). The radiation hardening by design (RHBD) segment dominated the market in 2021. It is anticipated to be the fastest-growing segment during the forecast period. Based on application, the market is segmented into aerospace & defense, nuclear power plant, space, and others. The space segment dominated the market in 2021, and the others segment is expected to be the fastest-growing segment during the forecast period. Based on country, the APAC radiation-hardened electronics market is segmented into Australia, China, India, Japan, South Korea, and the Rest of APAC.BAE Systems; Data Device Corporation; Honeywell International Inc.; Infineon Technologies AG; Microchip Technology Inc.; Renesas Electronics Corporation; STMicroelectronics; Texas Instruments Incorporated; VORAGO Technologies; and Xilinx, Inc. (AMD) are among the leading companies in the APAC radiation-hardened electronics market.
Table of Contents
1. Introduction1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC Radiation-Hardened Electronics Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
5. APAC Radiation-Hardened Electronics Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Radiation-Hardened Electronics
5.1.2 Increasing Investment in Space Programs
5.2 Market Restraints
5.2.1 High Complexity in Designing Radiation-Hardened Electronics
5.3 Market Opportunities
5.3.1 Increasing Investment in Product Development by Major Players
5.4 Future Trends
5.4.1 Rising Adoption of radiation-hardened electronics for Medical Applications
5.5 Impact Analysis of Drivers and Restraints
6. Radiation-Hardened Electronics Market - APAC Analysis
6.1 APAC Radiation-Hardened Electronics Market Overview
6.2 APAC Radiation-Hardened Electronics Market Revenue Forecast and Analysis
7. APAC Radiation-Hardened Electronics Market Analysis - By Component
7.1 Overview
7.2 APAC Radiation-Hardened Electronics Market, by Component (2020 and 2028)
7.3 Power Management Components
7.3.1 Overview
7.3.2 Power Management Components: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.4 Analog and Digital Mixed Signal Devices
7.4.1 Overview
7.4.2 Analog and Digital Mixed Signal Devices: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.5 Memory
7.5.1 Overview
7.5.2 Memory: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.6 Controllers and Processors
7.6.1 Overview
7.6.2 Controllers and Processors: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
8. APAC Radiation-Hardened Electronics Market Analysis - By Manufacturing Technique
8.1 Overview
8.2 APAC Radiation-Hardened Electronics Market, by Manufacturing Technique (2020 and 2028)
8.3 Radiation Hardening by Design (RHBD)
8.3.1 Overview
8.3.2 Radiation Hardening by Design (RHBD): Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
8.4 Radiation Hardening by Process (RHBP)
8.4.1 Overview
8.4.2 Radiation Hardening by Process (RHBP): Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9. APAC Radiation-Hardened Electronics Market Analysis - by Application
9.1 Overview
9.2 APAC Radiation-Hardened Electronics Market, by Application (2020 and 2028)
9.3 Aerospace & Defense
9.3.1 Overview
9.3.2 Aerospace & Defense: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.4 Nuclear Power Plant
9.4.1 Overview
9.4.2 Nuclear Power Plant: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.5 Space
9.5.1 Overview
9.5.2 Space: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.6 Others
9.6.1 Overview
9.6.2 Others: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
10. APAC Radiation-Hardened Electronics Market - Country Analysis
10.1 Overview
10.1.1 APAC: Radiation-Hardened Electronics Market, by Key Country
10.1.1.1 Australia: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.1.1 Australia: Radiation-Hardened Electronics Market, by Component
10.1.1.1.2 Australia: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.1.3 Australia: Radiation-Hardened Electronics Market, by Application
10.1.1.2 China: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.2.1 China: Radiation-Hardened Electronics Market, by Component
10.1.1.2.2 China: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.2.3 China: Radiation-Hardened Electronics Market, by Application
10.1.1.3 India: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.3.1 India: Radiation-Hardened Electronics Market, by Component
10.1.1.3.2 India: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.3.3 India: Radiation-Hardened Electronics Market, by Application
10.1.1.4 Japan: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.4.1 Japan: Radiation-Hardened Electronics Market, by Component
10.1.1.4.2 Japan: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.4.3 Japan: Radiation-Hardened Electronics Market, by Application
10.1.1.5 South Korea: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.5.1 South Korea: Radiation-Hardened Electronics Market, by Component
10.1.1.5.2 South Korea: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.5.3 South Korea: Radiation-Hardened Electronics Market, by Application
10.1.1.6 Rest of APAC: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
10.1.1.6.1 Rest of APAC: Radiation-Hardened Electronics Market, by Component
10.1.1.6.2 Rest of APAC: Radiation-Hardened Electronics Market, by Manufacturing Technique
10.1.1.6.3 Rest of APAC: Radiation-Hardened Electronics Market, by Application
11. Industry Landscape
11.1 Overview
11.2 Market Initiative
11.3 Merger and Acquisition
11.4 New Development
12. Company Profiles
12.1 BAE Systems
12.1.1 Key Facts
12.1.2 Business Description
12.1.3 Products and Services
12.1.4 Financial Overview
12.1.5 SWOT Analysis
12.1.6 Key Developments
12.2 Data Device Corporation
12.2.1 Key Facts
12.2.2 Business Description
12.2.3 Products and Services
12.2.4 Financial Overview
12.2.5 SWOT Analysis
12.2.6 Key Developments
12.3 Honeywell International Inc.
12.3.1 Key Facts
12.3.2 Business Description
12.3.3 Products and Services
12.3.4 Financial Overview
12.3.5 SWOT Analysis
12.3.6 Key Developments
12.4 Infineon Technologies AG
12.4.1 Key Facts
12.4.2 Business Description
12.4.3 Products and Services
12.4.4 Financial Overview
12.4.5 SWOT Analysis
12.4.6 Key Developments
12.5 Renesas Electronics Corporation
12.5.1 Key Facts
12.5.2 Business Description
12.5.3 Products and Services
12.5.4 Financial Overview
12.5.5 SWOT Analysis
12.5.6 Key Developments
12.6 Texas Instruments Incorporated
12.6.1 Key Facts
12.6.2 Business Description
12.6.3 Products and Services
12.6.4 Financial Overview
12.6.5 SWOT Analysis
12.6.6 Key Developments
12.7 STMicroelectronics
12.7.1 Key Facts
12.7.2 Business Description
12.7.3 Products and Services
12.7.4 Financial Overview
12.7.5 SWOT Analysis
12.7.6 Key Developments
12.8 Xilinx, Inc. (AMD)
12.8.1 Key Facts
12.8.2 Business Description
12.8.3 Products and Services
12.8.4 Financial Overview
12.8.5 SWOT Analysis
12.8.6 Key Developments
12.9 VORAGO Technologies
12.9.1 Key Facts
12.9.2 Business Description
12.9.3 Products and Services
12.9.4 Financial Overview
12.9.5 SWOT Analysis
12.9.6 Key Developments
12.10 Microchip Technology Inc.
12.10.1 Key Facts
12.10.2 Business Description
12.10.3 Products and Services
12.10.4 Financial Overview
12.10.5 SWOT Analysis
12.10.6 Key Developments
13. Appendix
13.1 About the Publisher
13.2 Word Index
List of Figures
Figure 1. APAC Radiation-Hardened Electronics Market Segmentation
Figure 2. APAC Radiation-Hardened Electronics Market Segmentation - by Country
Figure 3. APAC Radiation-Hardened Electronics Market Overview
Figure 4. APAC Radiation-Hardened Electronics Market, by Component
Figure 5. APAC Radiation-Hardened Electronics Market, by Country
Figure 6. APAC PEST Analysis
Figure 7. APAC Radiation-Hardened Electronics Market- Ecosystem Analysis
Figure 8. APAC Radiation-Hardened Electronics Market: Impact Analysis of Drivers and Restraints
Figure 9. APAC Radiation-Hardened Electronics Market Revenue Forecast and Analysis (US$ Million)
Figure 10. APAC Radiation-Hardened Electronics Market, by Component (2020 and 2028)
Figure 11. APAC Power Management Components: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 12. APAC Analog and Digital Mixed Signal Devices: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 13. APAC Memory: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. APAC Controllers and Processors: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. APAC Radiation-Hardened Electronics Market, by Manufacturing Technique (2020 and 2028)
Figure 16. APAC Radiation Hardening by Design (RHBD): Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 17. APAC Radiation Hardening by Process (RHBP): Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. APAC Radiation-Hardened Electronics Market, by Application (2020 and 2028)
Figure 19. APAC Aerospace & Defense: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. APAC Nuclear Power Plant: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. APAC Space: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. APAC Others: Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Figure 23. APAC: Radiation-Hardened Electronics Market, by Key Country - Revenue (2020) (US$ Million)
Figure 24. APAC: Radiation-Hardened Electronics Market Revenue Share, by Key Country (2020 and 2028)
Figure 25. Australia: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
Figure 26. China: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
Figure 27. India: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
Figure 28. Japan: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
Figure 29. South Korea: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
Figure 30. Rest of APAC: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)List of Tables
Table 1. APAC Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)
Table 2. APAC: Radiation-Hardened Electronics Market, by Country - Revenue and Forecast to 2028 (US$ Million)
Table 3. Australia: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 4. Australia: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 5. Australia: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 6. China: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 7. China: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 8. China: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 9. India: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 10. India: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 11. India: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 12. Japan: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 13. Japan: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 14. Japan: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 15. South Korea: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 16. South Korea: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 17. South Korea: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 18. Rest of APAC: Radiation-Hardened Electronics Market, by Component- Revenue and Forecast to 2028 (US$ Million)
Table 19. Rest of APAC: Radiation-Hardened Electronics Market, by Manufacturing Technique- Revenue and Forecast to 2028 (US$ Million)
Table 20. Rest of APAC: Radiation-Hardened Electronics Market, by Application-Revenue and Forecast to 2028 (US$ Million)
Table 21. List of Abbreviation
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- BAE Systems
- Data Device Corporation
- Honeywell International Inc.
- Infineon Technologies AG
- Microchip Technology Inc.
- Renesas Electronics Corporation
- STMicroelectronics
- Texas Instruments Incorporated
- VORAGO Technologies
- Xilinx, Inc. (AMD)
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 142 |
| Published | August 2022 |
| Forecast Period | 2022 - 2028 |
| Estimated Market Value ( USD | $ 250.3 Million |
| Forecasted Market Value ( USD | $ 366.01 Million |
| Compound Annual Growth Rate | 5.6% |
| Regions Covered | Asia Pacific |
