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Global Outsourced Semiconductor Assembly and Testing Market Size, Share & Industry Trends Analysis Report By Application, By Packaging Type, By Process, By Regional Outlook and Forecast, 2022 - 2028

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    Report

  • 249 Pages
  • August 2022
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5658983
Description Jump to:
The Global Outsourced Semiconductor Assembly and Testing Market size is expected to reach $47.3 billion by 2028, rising at a market growth of 4.9% CAGR during the forecast period.

Companies that offer third-party IC-packaging, as well as test services, are known as OSAT (Outsourced semiconductor assembly and test). These businesses package silicon products created by foundries & test them before they are released onto the market. It primarily focuses on providing cutting-edge packaging and test solutions for semiconductor companies in emerging markets like automotive, electronics, wearable technology, and the Internet of Things (IoT), in addition to well-established markets like communications, consumer, and computing.



It offers creative, affordable solutions that increase functionality, processing speed, & performance while taking up less space in an electronic device. After the wafer fabrication & wafer probe stages of the semiconductor manufacturing process, OSAT companies play a significant role in the final stage. These businesses provide packaging or assembling solutions that entail turning bare semiconductors into finished semiconductors. This protects the die and makes it easier for electrical connections and heat dissipation while also assisting in die protection.

It performs final testing after packaging to make sure the packaged semiconductor satisfies performance requirements. The company provides a wide range of semiconductor test services, such as different types of final, wafer, system-level, and strip testing in addition to full end-o f-line services, including final shipping. Since this stage of the production process requires the most labor, it is frequently carried out in nations with lower labor costs, like China and Malaysia.

OSAT semiconductor firms that provide IC-packaging and test services to outside parties. Before putting them on the market, these vendors test and package semiconductor devices produced by foundries. Market players provide cutting-edge and reasonably priced solutions that increase functionality, performance, and processing speed while taking up less space in an electronic device.

COVID-19 Impact Analysis

The COVID-19 disease outbreak has had a significant impact on manufacturing and production operations, which has slowed the growth of the OSAT market. The market for outsourced semiconductor assembly & test is anticipated to experience a strong recovery as a result of the substantial demand for Internet of Things device installation across numerous industries, the rapidly expanding initiatives for smart cities, and the quick uptake of smart device technologies. However, the negative effects of COVID-19 on the market are only anticipated to last for a brief period of time.

Market Growth Factors

Increasing Demand For Consumer Electronics Across The World

The rising demand for semiconductor chips from manufacturers of medical devices, consumer electronics, and sensor systems is what fuels the semiconductor industry's expansion. The market is expanding due to the constantly expanding use of consumer electronics, such as smartphones, computers, televisions, and other devices. Since semiconductors are essential to many industries related to consumer electronic appliances, including telecommunications, information technology, machine automation, power & solar photovoltaic, and others, it is anticipated that the demand for OSAT is expected to increase.

The Use Of Semiconductors Has Increased In The Automotive Industry

Despite recent recessions and demand fluctuations, the automotive industry continues to be a major source of demand and a source of opportunity for semiconductor & OSAT vendors. For semiconductor producers and OSAT vendors, trends such as autonomous and electric vehicles as well as the rising number of semiconductor components per vehicle are the main driving forces. The market for OSAT and semiconductor foundries is growing as more semiconductor components, including sensors, microcontrollers, and radar chips, among others, are used in automobiles.

Marketing Restraining Factor:

Huge Investments In Packaging Solutions Are Impeding Demand

High capital expenditures are needed in the high-end semiconductor testing and assembly industry to produce pricey equipment. Higher demand for low thermal ratings necessitates the use of innovative packaging techniques. Leading market players are knowledgeable about these investments. Small and medium-sized businesses struggle to provide premium services, which restrains the expansion of the market. Major businesses are also dealing with a chip shortage and exchange rate fluctuations at the moment because of the COVID-19 pandemic situation.



Process Outlook

Based on process, the outsourced semiconductor assembly & testing market is segmented into sawing, sorting, testing, and assembly. The testing segment dominated the outsourced semiconductor assembly & testing market by generating the maximum revenue in 2021. This is because the product's quality can be verified through physical, functional, and electrical testing of the product. The demand for electronic products is increasing across industries, necessitating quality testing like inspection, X-ray, lead frame fabrication, and others.

Packaging Type Outlook

On the basis of packaging type, the outsourced semiconductor assembly & testing market is fragmented into ball grid array, chip scale package, multi-package, stacked die, and quad & dual. In 2021, the multi-package segment generated a substantial revenue share in the outsourced semiconductor assembly and testing market. The earliest type of system-in-package is a multi-chip module, which combines two or more integrated circuits with a common base & a single package.

Application Outlook

By application, the outsourced semiconductor assembly & testing market is divided into automotive, consumer electronics, industrial, telecommunication, aerospace and defense, medical & healthcare, and logistics & transportation. In 2021, the industrial segment covered a substantial revenue share in the outsourced semiconductor assembly and testing market. Integrated circuit chips are created using assembly services, which are then used to test the product before it is shipped. These services are therefore in great demand across industrial applications.

Regional Outlook

Region wise, the outsourced semiconductor assembly & testing market is analyzed across North America, Europe, Asia Pacific and LAMEA. In 2021, the Asia Pacific segment led the outsourced semiconductor assembly and testing market with the largest revenue share. During the forecast period, a surge in demand for advanced semiconductor chip package solutions in the automotive sector is anticipated to fuel the expansion of the outsourced semiconductor assembly and testing market in the region.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.

Scope of the Study

Market Segments Covered in the Report:

By Application
  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Medical & Healthcare
  • Automotive
  • Aerospace & Defense
  • Logistics & Transportation
By Packaging Type
  • Ball Grid Array
  • Quad & Dual
  • Multi-package
  • Chip Scale Package
  • Stacked Die
By Process
  • Testing
  • Sorting
  • Sawing
  • Assembly
By Geography
  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Amkor Technology, Inc.
  • Advanced Silicon S.A
  • Alphacore, Inc.
  • Device Engineering, Inc.
  • HiDensity Group
  • Luminar Technologies, Inc.
  • Presto Engineering
  • Sencio BV
  • Shortlink AB
  • SiFive, Inc.

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Outsourced Semiconductor Assembly and Testing Market, by Application
1.4.2 Global Outsourced Semiconductor Assembly and Testing Market, by Packaging Type
1.4.3 Global Outsourced Semiconductor Assembly and Testing Market, by Process
1.4.4 Global Outsourced Semiconductor Assembly and Testing Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Global Outsourced Semiconductor Assembly and Testing Market by Application
3.1 Global Consumer Electronics Market by Region
3.2 Global Industrial Market by Region
3.3 Global Telecommunications Market by Region
3.4 Global Medical & Healthcare Market by Region
3.5 Global Automotive Market by Region
3.6 Global Aerospace & Defense Market by Region
3.7 Global Logistics & Transportation Market by Region
Chapter 4. Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
4.1 Global Ball Grid Array Market by Region
4.2 Global Quad & Dual Market by Region
4.3 Global Multi-package Market by Region
4.4 Global Chip Scale Package Market by Region
4.5 Global Stacked Die Market by Region
Chapter 5. Global Outsourced Semiconductor Assembly and Testing Market by Process
5.1 Global Testing Market by Region
5.2 Global Sorting Market by Region
5.3 Global Sawing Market by Region
5.4 Global Assembly Market by Region
Chapter 6. Global Outsourced Semiconductor Assembly and Testing Market by Region
6.1 North America Outsourced Semiconductor Assembly and Testing Market
6.1.1 North America Outsourced Semiconductor Assembly and Testing Market by Application
6.1.1.1 North America Consumer Electronics Market by Country
6.1.1.2 North America Industrial Market by Country
6.1.1.3 North America Telecommunications Market by Country
6.1.1.4 North America Medical & Healthcare Market by Country
6.1.1.5 North America Automotive Market by Country
6.1.1.6 North America Aerospace & Defense Market by Country
6.1.1.7 North America Logistics & Transportation Market by Country
6.1.2 North America Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.2.1 North America Ball Grid Array Market by Country
6.1.2.2 North America Quad & Dual Market by Country
6.1.2.3 North America Multi-package Market by Country
6.1.2.4 North America Chip Scale Package Market by Country
6.1.2.5 North America Stacked Die Market by Country
6.1.3 North America Outsourced Semiconductor Assembly and Testing Market by Process
6.1.3.1 North America Testing Market by Country
6.1.3.2 North America Sorting Market by Country
6.1.3.3 North America Sawing Market by Country
6.1.3.4 North America Assembly Market by Country
6.1.4 North America Outsourced Semiconductor Assembly and Testing Market by Country
6.1.4.1 US Outsourced Semiconductor Assembly and Testing Market
6.1.4.1.1 US Outsourced Semiconductor Assembly and Testing Market by Application
6.1.4.1.2 US Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.4.1.3 US Outsourced Semiconductor Assembly and Testing Market by Process
6.1.4.2 Canada Outsourced Semiconductor Assembly and Testing Market
6.1.4.2.1 Canada Outsourced Semiconductor Assembly and Testing Market by Application
6.1.4.2.2 Canada Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.4.2.3 Canada Outsourced Semiconductor Assembly and Testing Market by Process
6.1.4.3 Mexico Outsourced Semiconductor Assembly and Testing Market
6.1.4.3.1 Mexico Outsourced Semiconductor Assembly and Testing Market by Application
6.1.4.3.2 Mexico Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.4.3.3 Mexico Outsourced Semiconductor Assembly and Testing Market by Process
6.1.4.4 Rest of North America Outsourced Semiconductor Assembly and Testing Market
6.1.4.4.1 Rest of North America Outsourced Semiconductor Assembly and Testing Market by Application
6.1.4.4.2 Rest of North America Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.1.4.4.3 Rest of North America Outsourced Semiconductor Assembly and Testing Market by Process
6.2 Europe Outsourced Semiconductor Assembly and Testing Market
6.2.1 Europe Outsourced Semiconductor Assembly and Testing Market by Application
6.2.1.1 Europe Consumer Electronics Market by Country
6.2.1.2 Europe Industrial Market by Country
6.2.1.3 Europe Telecommunications Market by Country
6.2.1.4 Europe Medical & Healthcare Market by Country
6.2.1.5 Europe Automotive Market by Country
6.2.1.6 Europe Aerospace & Defense Market by Country
6.2.1.7 Europe Logistics & Transportation Market by Country
6.2.2 Europe Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.2.1 Europe Ball Grid Array Market by Country
6.2.2.2 Europe Quad & Dual Market by Country
6.2.2.3 Europe Multi-package Market by Country
6.2.2.4 Europe Chip Scale Package Market by Country
6.2.2.5 Europe Stacked Die Market by Country
6.2.3 Europe Outsourced Semiconductor Assembly and Testing Market by Process
6.2.3.1 Europe Testing Market by Country
6.2.3.2 Europe Sorting Market by Country
6.2.3.3 Europe Sawing Market by Country
6.2.3.4 Europe Assembly Market by Country
6.2.4 Europe Outsourced Semiconductor Assembly and Testing Market by Country
6.2.4.1 Germany Outsourced Semiconductor Assembly and Testing Market
6.2.4.1.1 Germany Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.1.2 Germany Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.1.3 Germany Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.2 UK Outsourced Semiconductor Assembly and Testing Market
6.2.4.2.1 UK Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.2.2 UK Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.2.3 UK Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.3 France Outsourced Semiconductor Assembly and Testing Market
6.2.4.3.1 France Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.3.2 France Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.3.3 France Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.4 Russia Outsourced Semiconductor Assembly and Testing Market
6.2.4.4.1 Russia Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.4.2 Russia Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.4.3 Russia Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.5 Spain Outsourced Semiconductor Assembly and Testing Market
6.2.4.5.1 Spain Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.5.2 Spain Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.5.3 Spain Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.6 Italy Outsourced Semiconductor Assembly and Testing Market
6.2.4.6.1 Italy Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.6.2 Italy Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.6.3 Italy Outsourced Semiconductor Assembly and Testing Market by Process
6.2.4.7 Rest of Europe Outsourced Semiconductor Assembly and Testing Market
6.2.4.7.1 Rest of Europe Outsourced Semiconductor Assembly and Testing Market by Application
6.2.4.7.2 Rest of Europe Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.2.4.7.3 Rest of Europe Outsourced Semiconductor Assembly and Testing Market by Process
6.3 Asia Pacific Outsourced Semiconductor Assembly and Testing Market
6.3.1 Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Application
6.3.1.1 Asia Pacific Consumer Electronics Market by Country
6.3.1.2 Asia Pacific Industrial Market by Country
6.3.1.3 Asia Pacific Telecommunications Market by Country
6.3.1.4 Asia Pacific Medical & Healthcare Market by Country
6.3.1.5 Asia Pacific Automotive Market by Country
6.3.1.6 Asia Pacific Aerospace & Defense Market by Country
6.3.1.7 Asia Pacific Logistics & Transportation Market by Country
6.3.2 Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.2.1 Asia Pacific Ball Grid Array Market by Country
6.3.2.2 Asia Pacific Quad & Dual Market by Country
6.3.2.3 Asia Pacific Multi-package Market by Country
6.3.2.4 Asia Pacific Chip Scale Package Market by Country
6.3.2.5 Asia Pacific Stacked Die Market by Country
6.3.3 Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Process
6.3.3.1 Asia Pacific Testing Market by Country
6.3.3.2 Asia Pacific Sorting Market by Country
6.3.3.3 Asia Pacific Sawing Market by Country
6.3.3.4 Asia Pacific Assembly Market by Country
6.3.4 Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Country
6.3.4.1 China Outsourced Semiconductor Assembly and Testing Market
6.3.4.1.1 China Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.1.2 China Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.1.3 China Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.2 Japan Outsourced Semiconductor Assembly and Testing Market
6.3.4.2.1 Japan Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.2.2 Japan Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.2.3 Japan Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.3 India Outsourced Semiconductor Assembly and Testing Market
6.3.4.3.1 India Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.3.2 India Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.3.3 India Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.4 South Korea Outsourced Semiconductor Assembly and Testing Market
6.3.4.4.1 South Korea Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.4.2 South Korea Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.4.3 South Korea Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.5 Singapore Outsourced Semiconductor Assembly and Testing Market
6.3.4.5.1 Singapore Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.5.2 Singapore Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.5.3 Singapore Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.6 Malaysia Outsourced Semiconductor Assembly and Testing Market
6.3.4.6.1 Malaysia Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.6.2 Malaysia Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.6.3 Malaysia Outsourced Semiconductor Assembly and Testing Market by Process
6.3.4.7 Rest of Asia Pacific Outsourced Semiconductor Assembly and Testing Market
6.3.4.7.1 Rest of Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Application
6.3.4.7.2 Rest of Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.3.4.7.3 Rest of Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Process
6.4 LAMEA Outsourced Semiconductor Assembly and Testing Market
6.4.1 LAMEA Outsourced Semiconductor Assembly and Testing Market by Application
6.4.1.1 LAMEA Consumer Electronics Market by Country
6.4.1.2 LAMEA Industrial Market by Country
6.4.1.3 LAMEA Telecommunications Market by Country
6.4.1.4 LAMEA Medical & Healthcare Market by Country
6.4.1.5 LAMEA Automotive Market by Country
6.4.1.6 LAMEA Aerospace & Defense Market by Country
6.4.1.7 LAMEA Logistics & Transportation Market by Country
6.4.2 LAMEA Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.2.1 LAMEA Ball Grid Array Market by Country
6.4.2.2 LAMEA Quad & Dual Market by Country
6.4.2.3 LAMEA Multi-package Market by Country
6.4.2.4 LAMEA Chip Scale Package Market by Country
6.4.2.5 LAMEA Stacked Die Market by Country
6.4.3 LAMEA Outsourced Semiconductor Assembly and Testing Market by Process
6.4.3.1 LAMEA Testing Market by Country
6.4.3.2 LAMEA Sorting Market by Country
6.4.3.3 LAMEA Sawing Market by Country
6.4.3.4 LAMEA Assembly Market by Country
6.4.4 LAMEA Outsourced Semiconductor Assembly and Testing Market by Country
6.4.4.1 Brazil Outsourced Semiconductor Assembly and Testing Market
6.4.4.1.1 Brazil Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.1.2 Brazil Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.1.3 Brazil Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.2 Argentina Outsourced Semiconductor Assembly and Testing Market
6.4.4.2.1 Argentina Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.2.2 Argentina Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.2.3 Argentina Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.3 UAE Outsourced Semiconductor Assembly and Testing Market
6.4.4.3.1 UAE Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.3.2 UAE Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.3.3 UAE Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.4 Saudi Arabia Outsourced Semiconductor Assembly and Testing Market
6.4.4.4.1 Saudi Arabia Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.4.2 Saudi Arabia Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.4.3 Saudi Arabia Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.5 South Africa Outsourced Semiconductor Assembly and Testing Market
6.4.4.5.1 South Africa Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.5.2 South Africa Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.5.3 South Africa Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.6 Nigeria Outsourced Semiconductor Assembly and Testing Market
6.4.4.6.1 Nigeria Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.6.2 Nigeria Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.6.3 Nigeria Outsourced Semiconductor Assembly and Testing Market by Process
6.4.4.7 Rest of LAMEA Outsourced Semiconductor Assembly and Testing Market
6.4.4.7.1 Rest of LAMEA Outsourced Semiconductor Assembly and Testing Market by Application
6.4.4.7.2 Rest of LAMEA Outsourced Semiconductor Assembly and Testing Market by Packaging Type
6.4.4.7.3 Rest of LAMEA Outsourced Semiconductor Assembly and Testing Market by Process
Chapter 7. Company Profiles
7.1 Amkor Technology, Inc.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expense
7.1.5 Recent strategies and developments:
7.1.5.1 Product Launches and Product Expansions:
7.1.5.2 Geographical Expansions:
7.2 Advanced Silicon S.A
7.2.1 Company Overview
7.3 Alphacore, Inc.
7.3.1 Company Overview
7.4 Device Engineering, Inc.
7.4.1 Company Overview
7.5 Hidensity Group
7.5.1 Company Overview
7.6 Luminar Technologies, Inc.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.7 Presto Engineering
7.7.1 Company Overview
7.7.2 Recent strategies and developments:
7.7.2.1 Partnerships, Collaborations, and Agreements:
7.7.2.2 Acquisition and Mergers:
7.8 Sencio BV
7.8.1 Company Overview
7.9 Shortlink AB
7.9.1 Company Overview
7.10. SiFive, Inc.
7.10.1 Company Overview

Companies Mentioned

  • Amkor Technology, Inc.
  • Advanced Silicon S.A
  • Alphacore, Inc.
  • Device Engineering, Inc.
  • HiDensity Group
  • Luminar Technologies, Inc.
  • Presto Engineering
  • Sencio BV
  • Shortlink AB
  • SiFive, Inc.

Methodology

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