The North America ALD Equipment Market would witness market growth of 7.6% CAGR during the forecast period (2022-2028).
By using elimination processes between a silicon-based molecule and a halogen-functionalized metallic molecule, a variety of metals can be deposited on a surface. Exothermic Fluor silane removal reactions are used in the majority of metal ALD procedures to deposit metal on substrate surfaces. Similar to thermal ALD, metal ALD may deposit a variety of metals on a surface at higher temperatures of about 175 to 325 °C. Thermal and metal ALD use temperatures that are higher than other processes, but they are still much lower than other CVD techniques.
Particle ALD is quite similar to traditional ALD. Particle ALD is focused on coating the full surface of a particle, in contrast to conventional ALD methods, which focuses on a flat or slightly curved surface. A particle's surface can be coated with a variety of materials, with excellent uniformity and ease of integration, without missing any portions of the particle. This technique is distinctive because it is one of the few that can handle the intricate coating geometry for spherical particles while fundamentally applying the ALD principles.
The consumer electronics segment in the region is booming and is anticipated to bolster in the coming years. According to the U.S. Department of Commerce, shipments of manufactured computer and electronic goods reached $339.4 billion in 2012, making up 5.9% of all manufacturing exports from the United States. Shipments of semiconductors and associated products, including integrated circuits, microprocessors, memory chips, diodes, transistors, solar cells, as well as other optoelectronic devices, reached $72.2 billion in 2010, accounting for one-fifth of the overall industry output. Therefore, the demand for ALD equipment is increasing, and thus, the regional ALD equipment market is expediting.
The US market dominated the North America ALD Equipment Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,349.2 Million by 2028. The Canada market is experiencing a CAGR of 10% during (2022-2028). Additionally, The Mexico market would exhibit a CAGR of 9.1% during (2022-2028).
Based on Deposition Method, the market is segmented into Plasma-enhanced, Thermal, Spatial, Roll-to-Roll & Powder and Others. Based on Film Type, the market is segmented into Oxide Films, Metal Films, Sulfide Films, Nitride Films and Fluoride Films. Based on Application, the market is segmented into Semiconductor and Non-semiconductor. Based on Semiconductor Type, the market is segmented into More Moore, Research & Development Facilities and More-than Moore. Based on Non-Semiconductor Type, the market is segmented into Energy, Medical, Conventional Optics and Coating. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Applied Materials, Inc., ASM International N.V., Tokyo Electron Ltd., Lam Research Corporation, Kurt J. Lesker, Veeco Instruments Inc., Optorun Co., Ltd., CVD Equipment Corporation, Eugene Technology Co. Ltd., and Beneq Oy.
By using elimination processes between a silicon-based molecule and a halogen-functionalized metallic molecule, a variety of metals can be deposited on a surface. Exothermic Fluor silane removal reactions are used in the majority of metal ALD procedures to deposit metal on substrate surfaces. Similar to thermal ALD, metal ALD may deposit a variety of metals on a surface at higher temperatures of about 175 to 325 °C. Thermal and metal ALD use temperatures that are higher than other processes, but they are still much lower than other CVD techniques.
Particle ALD is quite similar to traditional ALD. Particle ALD is focused on coating the full surface of a particle, in contrast to conventional ALD methods, which focuses on a flat or slightly curved surface. A particle's surface can be coated with a variety of materials, with excellent uniformity and ease of integration, without missing any portions of the particle. This technique is distinctive because it is one of the few that can handle the intricate coating geometry for spherical particles while fundamentally applying the ALD principles.
The consumer electronics segment in the region is booming and is anticipated to bolster in the coming years. According to the U.S. Department of Commerce, shipments of manufactured computer and electronic goods reached $339.4 billion in 2012, making up 5.9% of all manufacturing exports from the United States. Shipments of semiconductors and associated products, including integrated circuits, microprocessors, memory chips, diodes, transistors, solar cells, as well as other optoelectronic devices, reached $72.2 billion in 2010, accounting for one-fifth of the overall industry output. Therefore, the demand for ALD equipment is increasing, and thus, the regional ALD equipment market is expediting.
The US market dominated the North America ALD Equipment Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,349.2 Million by 2028. The Canada market is experiencing a CAGR of 10% during (2022-2028). Additionally, The Mexico market would exhibit a CAGR of 9.1% during (2022-2028).
Based on Deposition Method, the market is segmented into Plasma-enhanced, Thermal, Spatial, Roll-to-Roll & Powder and Others. Based on Film Type, the market is segmented into Oxide Films, Metal Films, Sulfide Films, Nitride Films and Fluoride Films. Based on Application, the market is segmented into Semiconductor and Non-semiconductor. Based on Semiconductor Type, the market is segmented into More Moore, Research & Development Facilities and More-than Moore. Based on Non-Semiconductor Type, the market is segmented into Energy, Medical, Conventional Optics and Coating. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Applied Materials, Inc., ASM International N.V., Tokyo Electron Ltd., Lam Research Corporation, Kurt J. Lesker, Veeco Instruments Inc., Optorun Co., Ltd., CVD Equipment Corporation, Eugene Technology Co. Ltd., and Beneq Oy.
Scope of the Study
Market Segments Covered in the Report:
By Deposition Method
- Plasma-enhanced
- Thermal
- Spatial
- Roll-to-Roll & Powder
- Others
By Film Type
- Oxide Films
- Metal Films
- Sulfide Films
- Nitride Films
- Fluoride Films
By Application
- Semiconductor
- More Moore
- Research & Development Facilities
- More-than Moore
- Non-semiconductor
- Energy
- Medical
- Conventional Optics
- Coating
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Applied Materials, Inc.
- ASM International N.V.
- Tokyo Electron Ltd.
- Lam Research Corporation
- Kurt J. Lesker
- Veeco Instruments Inc.
- Optorun Co., Ltd.
- CVD Equipment Corporation
- Eugene Technology Co. Ltd.
- Beneq Oy
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 4. North America ALD Equipment Market by Deposition Method
Chapter 5. North America ALD Equipment Market by Film Type
Chapter 6. North America ALD Equipment Market by Application
Chapter 7. North America ALD Equipment Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Applied Materials, Inc.
- ASM International N.V.
- Tokyo Electron Ltd.
- Lam Research Corporation
- Kurt J. Lesker
- Veeco Instruments Inc.
- Optorun Co., Ltd.
- CVD Equipment Corporation
- Eugene Technology Co. Ltd.
- Beneq Oy
Methodology
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