Asia Pacific Thin Wafer Market Size, Share & Industry Trends Analysis Report by Wafer Size (300 mm, 200 mm and 125 mm), Technology (Dicing, Polishing and Grinding), Application, Country and Growth Forecast, 2022-2028

The Asia Pacific Thin Wafer Market should witness market growth of 13.4% CAGR during the forecast period (2022-2028).

The benefit of the stealth dicing method is that a cooling liquid is not necessary. For the development of some microelectromechanical systems (MEMS), especially those designed for bioelectronic applications, dry dicing techniques must be used. Additionally, compared to wafer sawing, stealth dicing produces far less debris and improves wafer surface use. This procedure may be followed by wafer grinding to thin the die.

Although several factors have contributed to the emergence of thin wafers, power semiconductor ICs for vehicle industries are the main cause. It is expected that over the next six years, the demand for constant connectivity among consumers would drive a billion increase in the market for power semiconductors in use in cars and light passenger vehicles. These technologies, however, depend on cutting-edge wafer fabrication techniques like wafer thinning. As a result, the demand for thin wafers rises along with the demand for these applications.

The market for thin wafers has great potential in the APAC region. China will be one of the most important countries in the coming years, particularly in the consumer electronics and automobile industries. The largest automotive market in the world, China produced and shipped millions of passenger and light commercial vehicles in 2017. The two biggest automakers, selling almost 4.5 million units each, were Honda and Volkswagen. The market's use of thin wafers has expanded as a result of the increasing volume of vehicle sales.

The China market dominated the Asia Pacific Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $2,252.4 million by 2028. The Japan market is experiencing a CAGR of 12.7% during (2022-2028). Additionally, The India market would exhibit a CAGR of 14.1% during (2022-2028).

Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.

Scope of the Study

By Wafer Size

• 300 mm
• 200 mm
• 125 mm

By Technology

• Dicing
• Polishing
• Grinding

By Application

• Memory
• LED
• MEMS
• CIS
• RF Devices
• Interposer
• Logic
• Others

By Country

• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

• Shin-Etsu Chemical Co., Ltd.
• SUMCO Corporation
• GlobalWafers Co., Ltd.
• Siltronic AG
• SK Siltron Co., Ltd.
• SUSS MicroTec SE
• Soitec
• DISCO Corporation
• 3M Company
• Applied Materials, Inc.

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