The North America Thin Wafer Market should witness market growth of 12.4% CAGR during the forecast period (2022-2028).
Weak acids are used to clean wafers and get rid of contaminants. To ensure that a silicon wafer's surface is clean and free of contaminants, there are several common cleaning processes. RCA cleaning is one of the most efficient techniques. The wafers are textured to generate a rough surface when used for solar cells, increasing surface area and hence efficiency. In the etching process, the created PSG (phosphosilicate glass) is eliminated from the wafer's edge. The silicon used in wafers has a diamond cubic structure with a lattice spacing of 5.430710 and is formed from crystal with a regular crystal structure (0.5430710 nm).
When snip into wafers, the surface is associated with one of the various relative instructions known as crystal orientations. The Miller index determines orientation, with silicon often having (100) or (111) faces. Since many of a single crystal's structural and electrical properties are highly anisotropic, orientation is crucial. The crystal orientation of the wafer determines the ion implantation depths since each direction provides unique pathways for transport.
The expansion of the regional market would be supported by numerous technological advancements, inventions, and expenditures in the various industries of the area. Semiconductor chips and integrated circuits (ICs) are now widely accepted and used across North America as a result of the rising demand for smart devices and technologies. The region's wafer back grinding tape market is anticipated to grow because of the processing of larger internet-enabled data sets, improvements in sensory technology, and an increase in the use of autonomous devices.
The US market dominated the North America Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $4,644.4 million by 2028. The Canada market is showcasing a CAGR of 14.9% during (2022-2028). Additionally, The Mexico market would register a CAGR of 13.9% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Weak acids are used to clean wafers and get rid of contaminants. To ensure that a silicon wafer's surface is clean and free of contaminants, there are several common cleaning processes. RCA cleaning is one of the most efficient techniques. The wafers are textured to generate a rough surface when used for solar cells, increasing surface area and hence efficiency. In the etching process, the created PSG (phosphosilicate glass) is eliminated from the wafer's edge. The silicon used in wafers has a diamond cubic structure with a lattice spacing of 5.430710 and is formed from crystal with a regular crystal structure (0.5430710 nm).
When snip into wafers, the surface is associated with one of the various relative instructions known as crystal orientations. The Miller index determines orientation, with silicon often having (100) or (111) faces. Since many of a single crystal's structural and electrical properties are highly anisotropic, orientation is crucial. The crystal orientation of the wafer determines the ion implantation depths since each direction provides unique pathways for transport.
The expansion of the regional market would be supported by numerous technological advancements, inventions, and expenditures in the various industries of the area. Semiconductor chips and integrated circuits (ICs) are now widely accepted and used across North America as a result of the rising demand for smart devices and technologies. The region's wafer back grinding tape market is anticipated to grow because of the processing of larger internet-enabled data sets, improvements in sensory technology, and an increase in the use of autonomous devices.
The US market dominated the North America Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $4,644.4 million by 2028. The Canada market is showcasing a CAGR of 14.9% during (2022-2028). Additionally, The Mexico market would register a CAGR of 13.9% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Scope of the Study
By Wafer Size
- 300 mm
- 200 mm
- 125 mm
By Technology
- Dicing
- Polishing
- Grinding
By Application
- Memory
- LED
- MEMS
- CIS
- RF Devices
- Interposer
- Logic
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Shin-Etsu Chemical Co., Ltd.
- SUMCO Corporation
- GlobalWafers Co., Ltd.
- Siltronic AG
- SK Siltron Co., Ltd.
- SUSS MicroTec SE
- Soitec
- DISCO Corporation
- 3M Company
- Applied Materials, Inc.
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 4. North America Thin Wafer Market by Wafer Size
Chapter 5. North America Thin Wafer Market by Technology
Chapter 6. North America Thin Wafer Market by Application
Chapter 7. North America Thin Wafer Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Shin-Etsu Chemical Co., Ltd.
- SUMCO Corporation
- GlobalWafers Co., Ltd.
- Siltronic AG
- SK Siltron Co., Ltd.
- SUSS MicroTec SE
- Soitec
- DISCO Corporation
- 3M Company
- Applied Materials, Inc.
Methodology
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