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Europe Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Regional Analysis - by Type and Application

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    Report

  • 123 Pages
  • December 2022
  • Region: Europe
  • The Insight Partners
  • ID: 5715207
UP TO OFF until Mar 15th 2023
The semiconductor bonding market in Europe is expected to grow from US$ 215.77 million in 2022 to US$ 349.17 million by 2028. It is estimated to grow at a CAGR of 8.4% from 2022 to 2028.

Rising Adoption of Stacked Die Technology in IoT Devices

Due to the OEM'ss increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the Europe semiconductor bonding market.

Market Overview

Europe Semiconductor Bonding Market Segmentation

The Europe semiconductor bonding market is segmented into type, application, and country.
  • Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
  • Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
  • Based on country, the market is segmented into Germany, France, Italy, Russia, the UK, and rest of Europe. Germany dominated the market share in 2022.
ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Europe region.
Frequently Asked Questions about the European Semiconductor Bonding Market

What is the estimated value of the European Semiconductor Bonding Market?

The European Semiconductor Bonding Market was estimated to be valued at $215.77 Million in 2022.

What is the growth rate of the European Semiconductor Bonding Market?

The growth rate of the European Semiconductor Bonding Market is 8.4%, with an estimated value of $349.17 Million by 2028.

What is the forecasted size of the European Semiconductor Bonding Market?

The European Semiconductor Bonding Market is estimated to be worth $349.17 Million by 2028.

Who are the key companies in the European Semiconductor Bonding Market?

Key companies in the European Semiconductor Bonding Market include ASMPT, DIAS Automation (HK) Ltd., EV Group, HUTEM, Kulicke & Soffa Industries, Inc., Palomar Technologies, Panasonic Corporation, Toray Industries Inc and Yamaha Motor Corporation.

Table of Contents

1. Introduction
1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation

2. Key Takeaways

3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research

4. Europe Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 Europe PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions

5. Europe Semiconductor Bonding Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints

6. Semiconductor Bonding Market - Europe Market Analysis
6.1 Europe Semiconductor Bonding Market Overview
6.2 Europe Semiconductor Bonding Market Revenue Forecast and Analysis

7. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 - Type
7.1 Europe Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)

8. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 - Application
8.1 Overview
8.2 Europe Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)

9. Europe Semiconductor Bonding Market - Country Analysis
9.1 Overview
9.1.1 Europe: Semiconductor Bonding Market, by Key Country
9.1.1.1 France: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 France: Semiconductor Bonding Market, by Type
9.1.1.1.2 France: Semiconductor Bonding Market, by Application
9.1.1.2 Germany: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 Germany: Semiconductor Bonding Market, by Type
9.1.1.2.2 Germany: Semiconductor Bonding Market, by Application
9.1.1.3 Italy: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 Italy: Semiconductor Bonding Market, by Type
9.1.1.3.2 Italy: Semiconductor Bonding Market, by Application
9.1.1.4 UK: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.4.1 UK: Semiconductor Bonding Market, by Type
9.1.1.4.2 UK: Semiconductor Bonding Market, by Application
9.1.1.5 Russia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.5.1 Russia: Semiconductor Bonding Market, by Type
9.1.1.5.2 Russia: Semiconductor Bonding Market, by Application
9.1.1.6 Rest of Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.6.1 Rest of Europe: Semiconductor Bonding Market, by Type
9.1.1.6.2 Rest of Europe: Semiconductor Bonding Market, by Application

10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch

11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 DIAS Automation (HK) Ltd.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 ASMPT
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 Yamaha Motor Corporation
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 HUTEM
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
11.9 EV Group
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Products and Services
11.9.4 Financial Overview
11.9.5 SWOT Analysis
11.9.6 Key Developments
11.10 WestBond, Inc.
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Products and Services
11.10.4 Financial Overview
11.10.5 SWOT Analysis
11.10.6 Key Developments

12. Appendix
12.1 About the Publisher
12.2 Word Index

List of Tables
Table 1. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. France: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 3. France: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 4. Germany: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 5. Germany: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 6. Italy: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 7. Italy: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 8. UK: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 9. UK: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 10. Russia: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 11. Russia: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 12. Rest of Europe: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 13. Rest of Europe: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 14. List of Abbreviation

List of Figures
Figure 1. Europe Semiconductor Bonding Market Segmentation
Figure 2. Europe Semiconductor Bonding Market Segmentation - By Country
Figure 3. Europe Semiconductor Bonding Market Overview
Figure 4. Europe Semiconductor Bonding Market, by Type
Figure 5. Europe Semiconductor Bonding Market, by Application
Figure 6. Europe Semiconductor Bonding Market, by Country
Figure 7. Europe - PEST Analysis
Figure 8. Europe Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. Europe Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. Europe Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. Europe Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. Europe Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. Europe Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. Europe Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. Europe Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. Europe RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. Europe MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. Europe LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. Europe 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. Europe CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. Europe: Semiconductor Bonding Market, by Key Country- Revenue (2021) (US$ Million)
Figure 23. Europe: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. France: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 25. Germany: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 26. Italy: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 27. UK: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 28. Russia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 29. Rest of Europe: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)

Companies Mentioned

A selection of companies mentioned in this report includes:

  • ASMPT
  • DIAS Automation (HK) Ltd.
  • EV Group
  • HUTEM
  • Kulicke & Soffa Industries, Inc.
  • Palomar Technologies
  • Panasonic Corporation
  • Toray Industries Inc
  • WestBond, Inc.
  • Yamaha Motor Corporation