The semiconductor bonding market in Asia Pacific is expected to grow from US$ 274.55 million in 2022 to US$ 469.89 million by 2028. It is estimated to grow at a CAGR of 9.4% from 2022 to 2028.
Adoption of Die Bonding in Telecommunication
The growing demand for high-performance optical communication devices boosts 5G deployment and datacenter applications. Further, this supports 5G wireless fronthaul and next-generation Ethernet modules, which include 2x200GbE, 4x100GbE, 400GbE, and CWDM/DWDM transceivers. The demand for high-performance optical devices is also generating requirements for smaller packaging housing, rapid technology innovation, smaller chips/dies with higher density in the package, higher-volume manufacturing, quick product iterations, and an economical price point. The new requirements are also needed in lidar, AR/VR, advanced photonic sensors, MEMS, and highly integrated silicon photonics devices. For manufacturing all the above devices, successfully deploying flexible die bonding solutions with high post-bonding accuracy and great long-term stability is required. Various manufacturers are producing flexible high bonding solutions to meet this requirement. For instance, MRSI-HVM by MRSI Systems is a flexible high-speed die bonder which can achieve <±1.5 µm @ 3 sigma. Thus, with this, the company provides the best manufacturing solution for increasing volume and mix in manufacturing 5G and datacenter core devices.Market Overview
Australia, China, India, Japan, South Korea, and rest of Asia Pacific are the key contributors to the semiconductor bonding market in the Asia Pacific. The market growth is attributed to the presence of several OSAT (Outsourced Semiconductor Assembly and Test) players in Taiwan and China. In February 2021, SMIC (Semiconductor Manufacturing International Co) announced the total investment of US$ 9.06 billion in Shanghai wafer plant with the government-backed China Integrated Circuit Industry Investment Fund. Similarly, in June 2020, GlobalWafers Co., Ltd invested US$ 339 million in its Taisil (Taiwan) branch to upsurge 300-mm silicon wafer capabilities. This enhanced capacity is projected to meet the growing demand for high-quality silicon wafers. Such developments in the region are driving the demand for wafer bonding devices. ASM Pacific Technology; DIAS Automation (HK) Ltd; Kulicke and Soffa Industries, Inc; Panasonic Corporation; SHINKAWA Electric Co., Ltd; and TORAY ENGINEERING Co. Ltd are a few of the prominent companies operating in the Asia Pacific semiconductor bonding market. These companies are majorly focusing on the market for MEMS sensors, LED sensors, and CMOS image sensors. The increasing number of Integrated Device Manufacturer (IDMs) and bulk manufacturing of electronic devices such as smart watches, mobile phones, and household appliances in China and Taiwan is projected to boost the market growth. For example, HANIMI Semiconductor Co. Ltd has launched its new Flip Chip Bonder-5.0. Its major focus is on high-end semiconductor production, which is propelling the demand for semiconductor bonding.Asia Pacific Semiconductor Bonding Market Segmentation
The Asia Pacific semiconductor bonding market is segmented into type,application, and country.- Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
- Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
- Based on country, the market is segmented into Australia, China, India, Japan, South Korea, and rest of Asia Pacific. Rest of Asia Pacific dominated the market share in 2022.
Table of Contents
1. Introduction1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. APAC Semiconductor Bonding Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
6. Semiconductor Bonding Market - APAC Market Analysis
6.1 APAC Semiconductor Bonding Market Overview
6.2 APAC Semiconductor Bonding Market Revenue Forecast and Analysis
7. APAC Semiconductor Bonding Market Revenue and Forecast to 2028 - Type
7.1 APAC Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8. APAC Semiconductor Bonding Market Revenue and Forecast to 2028 - Application
8.1 Overview
8.2 APAC Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
9. APAC Semiconductor Bonding Market - Country Analysis
9.1 Overview
9.1.1 APAC: Semiconductor Bonding Market, by Key Country
9.1.1.1 Australia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 Australia: Semiconductor Bonding Market, by Type
9.1.1.1.2 Australia: Semiconductor Bonding Market, by Application
9.1.1.2 China: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 China: Semiconductor Bonding Market, by Type
9.1.1.2.2 China: Semiconductor Bonding Market, by Application
9.1.1.3 India: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 India: Semiconductor Bonding Market, by Type
9.1.1.3.2 India: Semiconductor Bonding Market, by Application
9.1.1.4 Japan: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.4.1 Japan: Semiconductor Bonding Market, by Type
9.1.1.4.2 Japan: Semiconductor Bonding Market, by Application
9.1.1.5 South Korea: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.5.1 South Korea: Semiconductor Bonding Market, by Type
9.1.1.5.2 South Korea: Semiconductor Bonding Market, by Application
9.1.1.6 Rest of APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
9.1.1.6.1 Rest of APAC: Semiconductor Bonding Market, by Type
9.1.1.6.2 Rest of APAC: Semiconductor Bonding Market, by Application
10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch
11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 DIAS Automation (HK) Ltd.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 ASMPT
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 Yamaha Motor Corporation
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 HUTEM
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
11.9 EV Group
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Products and Services
11.9.4 Financial Overview
11.9.5 SWOT Analysis
11.9.6 Key Developments
11.10 WestBond, Inc.
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Products and Services
11.10.4 Financial Overview
11.10.5 SWOT Analysis
11.10.6 Key Developments
12. Appendix
12.1 About the Publisher
12.2 Word Index
List of Tables
Table 1. APAC Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. Australia: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 3. Australia: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 4. China: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 5. China: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 6. India: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 7. India: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 8. Japan: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 9. Japan: Semiconductor Bonding Market, by Application- Revenue and Forecast to 2028 (US$ Million)
Table 10. South Korea: Semiconductor Bonding Market, by Type- Revenue and Forecast to 2028 (US$ Million)
Table 11. South Korea: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 12. Rest of APAC: Semiconductor Bonding Market, by Type - Revenue and Forecast to 2028 (US$ Million)
Table 13. Rest of APAC: Semiconductor Bonding Market, by Application - Revenue and Forecast to 2028 (US$ Million)
Table 14. List of Abbreviation
List of Figures
Figure 1. APAC Semiconductor Bonding Market Segmentation
Figure 2. APAC Semiconductor Bonding Market Segmentation - By Country
Figure 3. APAC Semiconductor Bonding Market Overview
Figure 4. APAC Semiconductor Bonding Market, by Type
Figure 5. APAC Semiconductor Bonding Market, by Application
Figure 6. APAC Semiconductor Bonding Market, by Country
Figure 7. APAC - PEST Analysis
Figure 8. APAC Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. APAC Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. APAC Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. APAC Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. APAC Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. APAC Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. APAC Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. APAC Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. APAC RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. APAC MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. APAC LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. APAC 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. APAC CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. APAC: Semiconductor Bonding Market, by Key Country- Revenue (2021) (US$ Million)
Figure 23. APAC: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. Australia: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 25. China: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 26. India: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 27. Japan: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 28. South Korea: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Figure 29. Rest of APAC: Semiconductor Bonding Market - Revenue and Forecast to 2028 (US$ Million)
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ASMPT
- DIAS Automation (HK) Ltd.
- EV Group
- HUTEM
- Kulicke & Soffa Industries, Inc.
- Palomar Technologies
- Panasonic Corporation
- Toray Industries Inc
- WestBond, Inc.
- Yamaha Motor Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 123 |
| Published | December 2022 |
| Forecast Period | 2022 - 2028 |
| Estimated Market Value ( USD | $ 274.55 Million |
| Forecasted Market Value ( USD | $ 469.89 Million |
| Compound Annual Growth Rate | 9.4% |
| Regions Covered | Asia Pacific |
