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Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2031

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    Report

  • 248 Pages
  • January 2023
  • Region: Global
  • The Business Research Company
  • ID: 5720987
This report describes and explains the semiconductor assembly and packaging equipment market and covers 2016 to 2021, termed the historic period, and 2021 to 2026 termed the forecast period, along with further forecasts for the period 2026-2031. The report evaluates the market across each region and for the major economies within each region.

The semiconductor assembly and packaging equipment market reached a value of nearly $8,493.3 million in 2021, having grown at a compound annual growth rate (CAGR) of 8.6% since 2016. The market is expected to grow from $8,493.3 million in 2021 to $14,634.7 million in 2026 at a rate of 11.5%. The market is then expected to grow at a CAGR of 8.7% from 2026 and reach $22,181.9 million in 2031.

Growth in the historic period resulted from strong economic growth in emerging markets, increasing demand for semiconductor equipment, increasing demand for consumer electronics, and rise in disposable income. The market was restrained by coronavirus pandemic and trade conflicts between major countries.

Going forward, government initiatives to propel semiconductor industry, increasing demand for electric vehicles, increasing demand from medical industry, rising urbanization, and increasing demand for portable electronic devices. Factor that could hinder the growth of the semiconductor assembly and packaging equipment market in the future include fluctuating price of raw materials, slow economic progress in some countries, and restrictions on export of semiconductors equipment.

The semiconductor assembly and packaging equipment market is segmented by type into plating equipment, inspection and dicing equipment, wire bonding equipment, die-bonding equipment, and other types. The inspection and dicing equipment market was the largest segment of the semiconductor assembly and packaging equipment market segmented by type, accounting for 37.2% of the total in 2021. Going forward, the die-bonding equipment segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by type, at a CAGR of 12.0% during 2021-2026.

The semiconductor assembly and packaging equipment market is segmented by application into consumer electronics, healthcare devices, automotive, enterprise storage, and other applications. The consumer electronics market was the largest segment of the semiconductor assembly and packaging equipment market segmented by application, accounting for 45.9% of the total in 2021. Going forward, the other applications segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by application, at a CAGR of 12.7% during 2021-2026.

The semiconductor assembly and packaging equipment market is segmented by end-user into OSATs and IDMs. The OSATs market was the largest segment of the semiconductor assembly and packaging equipment market segmented by end-user, accounting for 72.3% of the total in 2021. Going forward, the OSATs segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by end-user, at a CAGR of 11.6% during 2021-2026.

Asia Pacific was the largest region in the semiconductor assembly and packaging equipment market, accounting for 54.4% of the total in 2021. It was followed by North America, and then the other regions. Going forward, the fastest-growing regions in the semiconductor assembly and packaging equipment market will be Asia Pacific, and, North America where growth will be at CAGRs of 13.1% and 11.4% respectively. These will be followed by Western Europe, and, South America where the markets are expected to grow at CAGRs of 9.9% and 8.2% respectively.

The global semiconductor assembly and packaging equipment market is consolidated with small number of large players dominating the market. The top ten competitors in the market made up to 61.01% of the total market in 2021. Tokyo Electron Ltd was the largest competitor with 14.51% share of the market, followed by Applied Materials, Inc. with 12.46%, Kulicke and Soffa Industries, Inc. with 9.27%, ASML Holding N.V with 7.76%, BE Semiconductor Industries N.V with 5.03%, Tokyo Seimitsu with 3.31%, Amkor Technology with 3.05%, ASM Pacific Technology with 2.44%, Screen Holdings Co. Ltd with 1.70%, and KLA-Tencor with 1.47%.

The top opportunities in the semiconductor assembly and packaging equipment market segmented by type will arise in the inspection and dicing equipment market segment, which will gain $2,237.0 million of global annual sales by 2026. The top opportunities in the semiconductor assembly and packaging equipment market segmented by application will arise in the consumer electronics market segment, which will gain $ 2,651.5 million of global annual sales by 2026. The top opportunities in the semiconductor assembly and packaging equipment market segmented by end-user will arise in the OSATs market segment, which will gain $4,487.0 million of global annual sales by 2026. The top opportunities in the semiconductor assembly and packaging equipment market size will gain the most in China at $1,322.9 million.

Market-trend-based strategies for the industrial robots include companies focus on the launch of new semiconductor inspection machines using big data and AI, focus on innovating new products such as the introduction of a new automatic flip-chip bonder, consider introducing compound semiconductor equipment to strengthen the wet process product line, focus on increasing their investment, and focus on undergoing partnerships to develop new products and combine the resources of both the companies.

Player-adopted strategies in the industrial robots market includes strengthening its business operations through the launch of new products, enhancing its data-enabled equipment offerings through strategic partnerships, and enhancing its business operations through collaborations and partnerships.

To take advantage of the opportunities, the publisher recommends the semiconductor assembly and packaging equipment companies to focus on big data and ai technology in semiconductor equipment, focus on product innovations, focus on equipment for compound semiconductors, expand in emerging markets, target top semiconductor manufacturing countries, provide competitively priced offerings, participate in trade shows and events, continue to use B2B promotions, continue to target fast-growing applications, target fast-growing end-users.

Frequently Asked Questions about the Global Semiconductor Assembly And Packaging Equipment Market

What is the estimated value of the Global Semiconductor Assembly And Packaging Equipment Market?

The Global Semiconductor Assembly And Packaging Equipment Market was estimated to be valued at $8493.3 Million in 2021.

What is the growth rate of the Global Semiconductor Assembly And Packaging Equipment Market?

The growth rate of the Global Semiconductor Assembly And Packaging Equipment Market is 10.1%, with an estimated value of $22181.9 Million by 2031.

What is the forecasted size of the Global Semiconductor Assembly And Packaging Equipment Market?

The Global Semiconductor Assembly And Packaging Equipment Market is estimated to be worth $22181.9 Million by 2031.

Who are the key companies in the Global Semiconductor Assembly And Packaging Equipment Market?

Key companies in the Global Semiconductor Assembly And Packaging Equipment Market include Tokyo Electron Ltd., Applied Materials, Inc., Kulicke and Soffa Industries, Inc. and BE Semiconductor Industries N.V.

Table of Contents

1. Executive Summary

2. Table of Contents

3. List of Figures

4. List of Tables

5. Report Structure

6. Introduction and Market Characteristics
6.1. General Market Definition
6.2. Summary
6.3. Market Segmentation By Type
6.3.1. Plating Equipment
6.3.2. Inspection And Dicing Equipment
6.3.3. Wire Bonding Equipment
6.3.4. Die-Bonding Equipment
6.3.5. Other Types
6.4. Market Segmentation By Application
6.4.1. Consumer Electronics
6.4.2. Healthcare Devices
6.4.3. Automotive
6.4.4. Enterprise Storage
6.4.5. Other Applications
6.5. Market Segmentation By End-User
6.5.1. OSATs
6.5.2. IDMs

7. Major Market Trends
7.1. Introduction of Big Data and AI Technology In Semiconductor Equipment
7.2. Product Innovation
7.3. Compound Semiconductor Equipment
7.4. Increasing Investments
7.5. Strategic Partnerships

8. Global Market Size And Growth
8.1. Market Size
8.2. Historic Market Growth, 2016 - 2021, Value ($ Million)
8.2.1. Market Drivers 2016 - 2021
8.2.2. Market Restraints 2016 - 2021
8.3. Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
8.3.1. Market Drivers 2021 - 2026
8.3.2. Market Restraints 2021 - 2026

9. Global Market Segmentation
9.1. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
9.2. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
9.3. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

10. Global Market, Regional And Country Analysis
10.1. Global Semiconductor Assembly And Packaging Equipment Market, By Region, Historic and Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
10.2. Global Semiconductor Assembly And Packaging Equipment Market, By Country, Historic and Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

11. Asia-Pacific Market
11.1. Summary
11.2. Market Overview
11.2.1. Region Information
11.2.2. Market Information
11.2.3. Background Information
11.2.4. Government Initiatives
11.2.5. Regulations
11.2.6. Regulatory Bodies
11.2.7. Major Associations
11.2.8. Taxes Levied
11.2.9. Corporate Tax Structure
11.2.10. Investments
11.2.11. Major Companies
11.3. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.4. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.5. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.6. Asia Pacific Semiconductor Assembly And Packaging Equipment Market: Country Analysis
11.7. China Market
11.8. Summary
11.9. Market Overview
11.9.1. Country Information
11.9.2. Market Information
11.9.3. Background Information
11.9.4. Government Initiatives
11.9.5. Regulations
11.9.6. Regulatory Bodies
11.9.7. Major Associations
11.9.8. Taxes Levied
11.9.9. Corporate Tax Structure
11.9.10. Investments
11.9.11. Major Companies
11.10. China Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.11. China Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.12. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.13. India Market
11.14. India Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.15. India Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.16. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.17. Japan Market
11.18. Japan Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.19. Japan Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.20. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.21. Australia Market
11.22. Australia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.23. Australia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.24. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.25. Indonesia Market
11.26. Indonesia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.27. Indonesia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.28. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
11.29. South Korea Market
11.30. South Korea Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
11.31. South Korea Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
11.32. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

12. Western Europe Market
12.1. Summary
12.2. Market Overview
12.2.1. Region Information
12.2.2. Market Information
12.2.3. Background Information
12.2.4. Government Initiatives
12.2.5. Regulations
12.2.6. Regulatory Bodies
12.2.7. Major Associations
12.2.8. Taxes Levied
12.2.9. Corporate Tax Structure
12.2.10. Investments
12.2.11. Major Companies
12.3. Western Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
12.4. Western Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
12.5. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
12.6. Western Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
12.7. UK Market
12.8. UK Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
12.9. UK Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
12.10. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
12.11. Germany Market
12.12. Germany Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
12.13. Germany Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
12.14. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
12.15. France Market
12.16. France Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
12.17. France Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
12.18. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

13. Eastern Europe Market
13.1. Summary
13.2. Market Overview
13.2.1. Region Information
13.2.2. Market Information
13.2.3. Background Information
13.2.4. Government Initiatives
13.2.5. Regulations
13.2.6. Regulatory bodies
13.2.7. Major Associations
13.2.8. Taxes Levied
13.2.9. Corporate Tax Structure
13.2.10. Investments
13.2.11. Major Companies
13.3. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
13.4. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
13.5. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
13.6. Eastern Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
13.7. Russia Market
13.8. Russia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
13.9. Russia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
13.10. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

14. North America Market
14.1. Summary
14.2. Market Overview
14.2.1. Region Information
14.2.2. Market Information
14.2.3. Background Information
14.2.4. Government Initiatives
14.2.5. Regulations
14.2.6. Regulatory bodies
14.2.7. Major Associations
14.2.8. Taxes Levied
14.2.9. Corporate Tax Structure
14.2.10. Investments
14.2.11. Major Companies
14.3. North America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
14.4. North America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
14.5. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
14.6. North America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
14.7. USA Market
14.8. Summary
14.9. Market Overview
14.9.1. Country Information
14.9.2. Market Information
14.9.3. Background Information
14.9.4. Government Initiatives
14.9.5. Regulations
14.9.6. Regulatory bodies
14.9.7. Major Associations
14.9.8. Taxes Levied
14.9.9. Corporate Tax Structure
14.9.10. Investments
14.9.11. Major Companies
14.10. USA Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
14.11. USA Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
14.12. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

15. South America Market
15.1. Summary
15.2. Market Overview
15.2.1. Region Information
15.2.2. Market Information
15.2.3. Background Information
15.2.4. Government Initiatives
15.2.5. Regulations
15.2.6. Regulatory Bodies
15.2.7. Major Associations
15.2.8. Taxes Levied
15.2.9. Corporate Tax Structure
15.2.10. Investments
15.2.11. Major Companies
15.3. South America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
15.4. South America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
15.5. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
15.6. South America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
15.7. Brazil Market
15.8. Brazil Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
15.9. Brazil Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
15.10. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

16. Middle East Market
16.1. Summary
16.2. Market Overview
16.2.1. Region Information
16.2.2. Market Information
16.2.3. Background Information
16.2.4. Government Initiatives
16.2.5. Regulations
16.2.6. Regulatory Bodies
16.2.7. Major Associations
16.2.8. Corporate Tax Structure
16.2.9. Investments
16.2.10. Major Companies
16.3. Middle East Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
16.4. Middle East Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
16.5. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

17. Africa Market
17.1. Summary
17.2. Market Overview
17.2.1. Region Information
17.2.2. Market Information
17.2.3. Background Information
17.2.4. Government Initiatives
17.2.5. Regulations
17.2.6. Regulatory Bodies
17.2.7. Major Associations
17.2.8. Taxes Levied
17.2.9. Corporate Tax Structure
17.2.10. Investments
17.2.11. Major Companies
17.3. Africa Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
17.4. Africa Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
17.5. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

18. Competitive Landscape And Company Profiles
18.1. Company Profiles
18.2. Tokyo Electron Ltd
18.2.1. Company Overview
18.2.2. Products And Services
18.2.3. Financial Overview
18.3. Applied Materials, Inc.
18.3.1. Company Overview
18.3.2. Products And Services
18.3.3. Business Strategy
18.3.4. Financial Overview
18.4. Kulicke and Soffa Industries, Inc
18.4.1. Company Overview
18.4.2. Products And Services
18.4.3. Business Strategy
18.4.4. Financial Overview
18.5. ASML Holding N.V
18.5.1. Company Overview
18.5.2. Products And Services
18.5.3. Financial Overview
18.6. BE Semiconductor Industries N.V
18.6.1. Company Overview
18.6.2. Products And Services
18.6.3. Business Strategy
18.6.4. Financial Overview

19. Key Mergers and Acquisitions
19.1. Atlas Copco Acquired Ceres Technologies Inc.
19.2. Applied Materials Inc. Acquired Picosun Oy
19.3. Wingtech Technology Acquired Nexperia
19.4. Applied Materials Inc. Acquired Kokusai Electric Corporation

20. Market Opportunities And Strategies
20.1. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Countries Offering Most New Opportunities
20.2. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Segments Offering Most New Opportunities
20.3. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Growth Strategies
20.3.1. Market Trend Based Strategies
20.3.2. Competitor Strategies

21. Semiconductor Assembly And Packaging Equipment Market, Conclusions And Recommendations
21.1. Conclusions
21.2. Recommendations
21.2.1. Product
21.2.2. Place
21.2.3. Price
21.2.4. Promotion
21.2.5. People

22. Appendix
22.1. Market Data Sources
22.2. Research Methodology
22.3. Currencies
22.4. About the Publisher
22.5. Copyright and Disclaimer

Executive Summary

Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2031 provides the strategists; marketers and senior management with the critical information they need to assess the global semiconductor assembly and packaging equipment market as it emerges from the COVID 19 shut down.

Reasons to Purchase

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  • Benchmark performance against key competitors.
  • Utilize the relationships between key data sets for superior strategizing.
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Description:

Where is the largest and fastest growing market for semiconductor assembly and packaging equipment? How does the market relate to the overall economy; demography and other similar markets? What forces will shape the market going forward? The semiconductor assembly and packaging equipment Global Market Report 2022, report answers all these questions and many more.

The report covers market characteristics; size and growth; segmentation; regional and country breakdowns; competitive landscape; market shares; trends and strategies for this market. It traces the market’s historic and forecast market growth by geography. It places the market within the context of the wider semiconductor assembly and packaging equipment market; and compares it with other markets.

The report covers the following chapters:

  • Introduction and Market Characteristics
Brief introduction to the segmentations covered in the market, defintions and explanations about semiconductor assembly and packaging equipment market.
  • Key Trends
Highlights the major trends shaping the global semiconductor assembly and packaging equipment market. This section also highlights likely future developments in the market.
  • Global Market Size and Growth
Global historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values, and drivers and restraints that support and control the growth of the market in the historic and forecast periods.
  • Regional Analysis
Historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values and growth and market share comparison by region.
  • Market Segmentation
Contains the market values (2016-2031) and analysis for each segment by type, by application, and by end-user in the market.
  • Regional Market Size and Growth
Regional market size (2021), historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values, and growth and market share comparison of countries within the region. This report includes information on the regions Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa and major countries within each region.
  • Competitive Landscape
Details on the competitive landscape of the market, estimated market shares and company profiles of the leading players.
  • Key Mergers and Acquisitions
Information on recent mergers and acquisitions in the market covered in the report. This section gives key financial details of mergers and acquisitions, which have shaped the market in recent years.
  • Market Opportunities And Strategies
Describes market opportunities and strategies based on findings of the research, with information on growth opportunities across countries, segments and strategies to be followed in those markets.
  • Conclusions And Recommendations
Includes recommendations for semiconductor assembly and packaging equipment providers in terms of product/service offerings geographic expansion, marketing strategies and target groups.
  • Appendix
This section includes details on the NAICS codes covered, abbreviations and currencies codes used in this report.

Scope:

Markets Covered:

1) By Type: Plating Equipment; Inspection And Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment; Other Types
2) By Application: Consumer Electronics; Healthcare Devices; Automotive; Enterprise Storage; Other Applications
3) By End-User: OSATs; IDMs

Companies Mentioned: Tokyo Electron Ltd.; Applied Materials, Inc.; Kulicke and Soffa Industries, Inc.; ASML Holding N.V; BE Semiconductor Industries N.V

Countries: China; Australia; India; Indonesia; Japan; South Korea; USA; Brazil; France; Germany; UK; Russia

Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa

Time series: Five years historic and ten years forecast.

Data: Ratios of market size and growth to related markets; GDP proportions; expenditure per capita; semiconductor assembly and packaging equipment indicators comparison.

Data segmentations: country and regional historic and forecast data; market share of competitors; market segments.

Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • Kulicke and Soffa Industries, Inc.
  • ASML Holding N.V
  • BE Semiconductor Industries N.V

Methodology

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