Semiconductor Assembly and Packaging Equipment Global Market Report 2024

The semiconductor assembly and packaging equipment market size has grown rapidly in recent years. It will grow from $11.23 billion in 2023 to $12.45 billion in 2024 at a compound annual growth rate (CAGR) of 10.9%. Semiconductor assembly and packaging equipment played a crucial role in the historic period, driven by the growth in emerging markets, a rising demand for semiconductor equipment, an increased need for consumer electronics, and the upswing in disposable income.

The semiconductor assembly and packaging equipment market size is expected to see strong growth in the next few years. It will grow to $17.95 billion in 2028 at a compound annual growth rate (CAGR) of 9.6%. The forecasted growth in the semiconductor assembly and packaging equipment sector is attributed to government initiatives aimed at propelling the semiconductor industry, an increased demand for electric vehicles, heightened requirements from the medical industry, the impact of rising urbanization, and a growing need for portable electronic devices. Key trends anticipated in the forecast period include a concerted focus on launching advanced semiconductor inspection machines incorporating big data and artificial intelligence (AI), innovation in new product offerings such as the introduction of an automatic flip-chip bonder, efforts to introduce compound semiconductor equipment to enhance the wet process product line, and a strategic emphasis on increased investments and partnerships for product development.

The increasing demand for consumer electronics is poised to contribute significantly to the expansion of the semiconductor assembly and packaging equipment market. Consumer electronics, a pivotal sector reliant on the semiconductor industry, has witnessed substantial growth. According to the India Brand Equity Foundation, the Indian appliance and consumer electronics market reached $10.93 billion in 2019 and is projected to grow at a CAGR of 9%, reaching $48.37 billion by 2022. The continuous integration of semiconductor Integrated Circuits (ICs) in various electronic devices to perform diverse functions is driving the demand for semiconductor assembly and packaging equipment, propelled by the expanding consumer electronics market.

The rising popularity of electric vehicles is expected to further drive the growth of the semiconductor assembly and packaging equipment market. Electric vehicles (EVs), powered by electricity stored in rechargeable battery packs or energy storage systems, rely on modern power electronics for their electric propulsion systems. These power electronics require specialized semiconductor components that necessitate precise assembly and packaging. According to a report from the US Department of Energy in March 2022, electric vehicle sales witnessed an 85% increase between 2020 and 2021. The number of new light-duty plug-in electric vehicle sales nearly doubled from 308,000 in 2020 to 608,000 in 2021, reflecting the growing popularity of electric vehicles and driving the demand for semiconductor assembly and packaging equipment.


Technological advancements emerge as a prominent trend driving innovation in the semiconductor assembly and packaging equipment market. Key players in the market are actively introducing new technologies to enhance packaging applications, with a focus on compound equipment. Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions, exemplifies this trend. In January 2022, the company launched an integrated equipment series supporting compound semiconductor manufacturing. The compound semiconductor wet process product line includes various equipment such as gluing, development, photoresist de-gluing, wet etching, cleaning, and metal plating equipment. It is designed to be automatically compatible with flat-edged or notched wafers, showcasing advancements in semiconductor assembly and packaging technology.

Major companies in the semiconductor assembly and packaging equipment market are also investing in the development of new technologies such as semiconductor package substrates to expand their customer bases, increase sales, and boost revenue. A semiconductor package substrate is a critical component in assembling semiconductor devices, including integrated circuits (ICs) and microprocessors. LG Innotek Co. Ltd., a South Korea-based electronic components manufacturer, introduced the 2Metal Chip on Film (COF) in February 2023. COF is an advanced semiconductor package substrate designed for establishing connections between displays and flexible Printed Circuit Boards (PCBs). The product minimizes bezels in devices such as TVs, notebook PCs, monitors, and smartphones while contributing to a reduction in module size. The innovative design features micro-via holes on a thin film and integrates ultra-miniaturized circuits on both sides, facilitating faster signal transmission and enabling ultra-high-definition screens.

In December 2021, YES (Yield Engineering Systems, Inc), a US-based manufacturing company providing process equipment for semiconductor advanced packaging, acquired SPEC (Semiconductor Process Equipment Corporation). The acquisition aimed to enhance YES's technological expertise in markets including High-Performance Computing (HPC), artificial intelligence/machine learning, 5G, autonomous driving, augmented reality, and other computationally intensive applications. SPEC, a US-based company specializing in surface conditioning wet process equipment, offered a portfolio including cleaning, etching, stripping, and plating equipment. The acquisition was anticipated to benefit both current and future customers of YES.

Major companies operating in the semiconductor assembly and packaging equipment market report are Tokyo Electron Ltd., Applied Materials, Inc., Kulicke and Soffa Industries, Inc., ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd., KLA-Tencor, Toshiba Corp, Cypress Semiconductor Corp, ARM Ltd., Renesas Electronics Corporation, Fujitsu Limited, Panasonic Corporation, Continental Device India Ltd (CDIL), MosChip Semiconductor Technologies, Advanced Semiconductor Engineering Inc., Zhixin Semiconductor, UNISOC, Yangtze Memory Technologies Co., Ltd (YTMC), GigaDevice, CR Micro, Silan, Infineon Technologies AG, UnitySC, Dialog Semiconductor PLC, Lam Research Corporation, Hitachi High Technologies Corporation, Advantest, Teradyne Inc., Smart Modular Technologies, Tecsys, Multilaser, Flextronics, Digitron, STMicroelectronics, ROHM Semiconductor, Semiconductors and Technologies Limited Company, Fei – Randburg, Electronic components CSE, Kh Distributors, Avnet Kopp, Renewable Energy Semiconductor Manufacturing company, SGS Ghana Limited.

Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2023. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor assembly and packaging equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Italy, Canada, Spain.

The primary types of semiconductor assembly and packaging equipment include plating equipment, inspection and dicing equipment, wire bonding equipment, and die-bonding equipment. Wire bonding equipment specifically pertains to the process of connecting two pieces of equipment using a wire, a crucial step for hazard prevention. These equipment find diverse applications in consumer electronics, healthcare devices, automotive, enterprise storage, and various other sectors. The key end-users encompass OSATs (Outsourced Semiconductor Assembly and Test) and IDMs (Integrated Device Manufacturers).

The semiconductor assembly and packaging equipment market research report is one of a series of new reports that provides semiconductor assembly and packaging equipment market statistics, including semiconductor assembly and packaging equipment industry global market size, regional shares, competitors with a semiconductor assembly and packaging equipment market share, detailed semiconductor assembly and packaging equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor assembly and packaging equipment industry. This semiconductor assembly and packaging equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor assembly and packaging equipment market consists of sales of precision ACCRETECH dicing blades, probing machines, polish grinders, high rigid grinder, CMP, edge shaping products, sliced wafer demounting and cleaning machine. Values in this market are factory gate values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.