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Asia Pacific Embedded Systems Market Size, Share & Industry Trends Analysis Report By Application, By Component (Hardware and Software), By Hardware Type (MPU, MCU, FPGA, Memory and Others), By Country and Growth Forecast, 2022 - 2028

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    Report

  • 110 Pages
  • December 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5723729
The Asia Pacific Embedded Systems Market should witness market growth of 6.1% CAGR during the forecast period (2022-2028).

Embedded systems employ communication ports to send data via a communication protocol between the processor and peripheral devices, which are frequently other embedded systems. This data is interpreted by the processor with the aid of simple memory-stored software. Typically, the software is very specialized for the purpose the embedded system serves.

Embedded systems' primary attribute is that they are task-specific. The following qualities can also be present in embedded systems: Usually, includes hardware, software, and firmware; they can be embedded in a larger system to perform a targeted function; they are either microprocessor-based or microcontroller-based - both are integrated circuits that give the system compute power; are frequently utilized for sensing and real-time computing in the internet of things (IoT) devices, that are devices that are internet-connected and do not require human interaction.

The rapidly rising demand for microcontrollers is majorly owing to the increasing technological advancement in the automotive industry. In the automotive industry, microcontrollers are required, especially in interactive safety systems and vehicle connectivity systems, and hence drive the market demand of this region during the forecast period. In this region, the automotive sector is steadily growing in terms of vehicle connectivity, and interactive safety systems are expected to significantly support the demand for IoT microcontrollers in the upcoming years.

The China market dominated the Asia Pacific Embedded Systems Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $13, 274.7 million by 2028.The Japan market is experiencing a CAGR of 5.4% during (2022-2028). Additionally, The India market would display a CAGR of 6.7% during (2022-2028).

Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, Aerospace & Defense and Others. Based on Component, the market is segmented into Hardware and Software. Based on Hardware Type, the market is segmented into MPU, MCU, FPGA, Memory and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Renesas Electronics Corporation, Texas Instruments, Inc., NXP Semiconductors N.V., QUALCOMM Incorporated (Qualcomm Technologies, Inc.), Fujitsu Limited, Infineon Technologies AG, Analog Devices, Inc., Microchip Technology, Inc., and STMicroelectronics N.V.

Scope of the Study

By Application

  • Consumer Electronics
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Others

By Component

  • Hardware
    • MPU
    • MCU
    • FPGA
    • Memory
    • Others
  • Software

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Intel Corporation
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • NXP Semiconductors N.V.
  • QUALCOMM Incorporated (Qualcomm Technologies, Inc.)
  • Fujitsu Limited
  • Infineon Technologies AG
  • Analog Devices, Inc.
  • Microchip Technology, Inc.
  • STMicroelectronics N.V.

Unique Offerings

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Embedded Systems Market, by Application
1.4.2 Asia Pacific Embedded Systems Market, by Component
1.4.3 Asia Pacific Embedded Systems Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2018-2022)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2019, Oct - 2022, Nov) Leading Players

Chapter 4. Asia Pacific Embedded Systems Market by Application
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific Automotive Market by Country
4.3 Asia Pacific Industrial Market by Country
4.4 Asia Pacific Aerospace & Defense Market by Country
4.5 Asia Pacific Others Market by Country

Chapter 5. Asia Pacific Embedded Systems Market by Component
5.1 Asia Pacific Hardware Market by Country
5.2 Asia Pacific Embedded Systems Market by Hardware Type
5.2.1 Asia Pacific MPU Market by Country
5.2.2 Asia Pacific MCU Market by Country
5.2.3 Asia Pacific FPGA Market by Country
5.2.4 Asia Pacific Memory Market by Country
5.2.5 Asia Pacific Others Market by Country
5.3 Asia Pacific Software Market by Country

Chapter 6. Asia Pacific Embedded Systems Market by Country
6.1 China Embedded Systems Market
6.1.1 China Embedded Systems Market by Application
6.1.2 China Embedded Systems Market by Component
6.1.2.1 China Embedded Systems Market by Hardware Type
6.2 Japan Embedded Systems Market
6.2.1 Japan Embedded Systems Market by Application
6.2.2 Japan Embedded Systems Market by Component
6.2.2.1 Japan Embedded Systems Market by Hardware Type
6.3 India Embedded Systems Market
6.3.1 India Embedded Systems Market by Application
6.3.2 India Embedded Systems Market by Component
6.3.2.1 India Embedded Systems Market by Hardware Type
6.4 South Korea Embedded Systems Market
6.4.1 South Korea Embedded Systems Market by Application
6.4.2 South Korea Embedded Systems Market by Component
6.4.2.1 South Korea Embedded Systems Market by Hardware Type
6.5 Singapore Embedded Systems Market
6.5.1 Singapore Embedded Systems Market by Application
6.5.2 Singapore Embedded Systems Market by Component
6.5.2.1 Singapore Embedded Systems Market by Hardware Type
6.6 Malaysia Embedded Systems Market
6.6.1 Malaysia Embedded Systems Market by Application
6.6.2 Malaysia Embedded Systems Market by Component
6.6.2.1 Malaysia Embedded Systems Market by Hardware Type
6.7 Rest of Asia Pacific Embedded Systems Market
6.7.1 Rest of Asia Pacific Embedded Systems Market by Application
6.7.2 Rest of Asia Pacific Embedded Systems Market by Component
6.7.2.1 Rest of Asia Pacific Embedded Systems Market by Hardware Type

Chapter 7. Company Profiles
7.1 Intel Corporation
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expenses
7.1.5 Recent strategies and developments:
7.1.5.1 Partnerships, Collaborations, and Agreements:
7.1.5.2 Product Launches and Product Expansions:
7.1.5.3 Acquisition and Mergers:
7.1.6 SWOT Analysis
7.2 STMicroelectronics N.V.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.3.6 SWOT Analysis
7.4 Fujitsu Limited
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 SWOT Analysis
7.5 Analog Devices, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 Infineon Technologies AG
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments:
7.6.5.1 Product Launches and Product Expansions:
7.6.5.2 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 Renesas Electronics Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.7.5.2 Acquisition and Mergers:
7.8 Texas Instruments, Inc.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 QUALCOMM Incorporated (Qualcomm Technologies, Inc.)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Partnerships, Collaborations, and Agreements:
7.10. Microchip Technology, Inc.
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 Recent strategies and developments:
7.10.5.1 Product Launches and Product Expansions:

Companies Mentioned

  • Intel Corporation
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • NXP Semiconductors N.V.
  • QUALCOMM Incorporated (Qualcomm Technologies, Inc.)
  • Fujitsu Limited
  • Infineon Technologies AG
  • Analog Devices, Inc.
  • Microchip Technology, Inc.
  • STMicroelectronics N.V.

Methodology

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