The global PCB design and stack-up market is anticipated to grow with a CAGR of 9.6% over the forecast period, i.e., 2019-2021. Factors such as rise in number of IoT devices, followed by robust investment in semiconductor industry are projected to drive the growth of the market in the coming years. Additionally, surge in disposable income, and growing use of internet are also expected to boost the market trend. The market is estimated to garner a value of more than 115 thousand designs by the end of 2021, up from a value of close to 95 thousand designs in the year 2019.
The global PCB design and stack-up market is segmented into numerous segment, which includes segmentation by application, end-user, and designers. By end-user the market is segmented into consumer electronics, communications, computers, automotive, and others. Out of these segments, the computers segment is anticipated to hold the largest value close to 30 thousand designs by the end of 2021, up from a value of about 25 thousand designs in the year 2019.
On the basis of region, the global PCB design and stack-up market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The market in North America is anticipated to garner a value of more than 45 thousand designs by the end of 2021. In 2019, the market in this region generate value of over 39 thousand designs.
Some of the prominent industry leaders in the global PCB design and stack-up market that are included in the report are Zuken UK Limited, Cadence Design Systems, Inc., Autodesk Inc., Altium Limited, EasyEDA LCC, Siemens AG, Downstream Technologis, LLC, Novarm Limited, ANSYS, Inc., and others.
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Companies Mentioned
- Zuken UK Limited
- Cadence Design Systems Inc.
- Autodesk Inc.
- Altium Limited
- EasyEDA LCC
- Siemens AG
- Downstream Technologis LLC
- Novarm Limited
- ANSYS Inc.
