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Global Semiconductor Production Equipment Market Size, Share & Industry Trends Analysis Report By Dimension, By Supply Chain Process, By Product Type, By Function, By Regional Outlook and Forecast, 2022-2028

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    Report

  • 255 Pages
  • January 2023
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5742117
The Global Semiconductor Production Equipment Market size is expected to reach $153.8 billion by 2028, rising at a market growth of 9.2% CAGR during the forecast period.

Semiconductor production equipment is used to manufacture memory chips, semiconductor circuits, and other components. The ability of free electrons to easily move between atoms in semiconductors allows the free flow of electricity through them. This ability makes semiconductors ideal for designing and developing compounds like wafers, integrated circuits, diodes, etc., used in many electronic devices and systems.

The semiconductor industry is expanding quickly, which is helping to boost sales of modern semiconductor production equipment and propel the market upward. Consumers' rising desire for electronic gadgets drives the demand for chips, which is anticipated to indirectly raise the requirement for semiconductor production equipment. The demand for consumer electronics is rising globally, which can be linked to the growing necessity for user-friendly electronic products as well as the expanding residential sector. For example, MEMS, optoelectronics, and MOEMS devices are used in the mass manufacturing of electronic items, including wearables, smartphones, and white goods.

Due to the delicate nature of semiconductor processing, precise supervision of automated steps, including cutting, drying, washing, etching, and assembly, as well as total control over working parameters like temperature and humidity, are required. A solution for improved control of these parameters, along with other automated processes, and the environment where semiconductors are made, is provided by semiconductor production equipment. Semiconductor production equipment provides numerous advantages like improved production, greater output & dependability, fewer production & design errors, decreased process & equipment downtime, and enhanced workplace security.

COVID-19 Impact Analysis

The pandemic had a negative impact on the semiconductor production equipment market. During the COVID-19 pandemic, the electronics industry suffered adversely, as the pandemic also created a significant shortage in the semiconductor supply chain. Due to the COVID-19 lockdown, numerous semiconductor sector components could not be produced, which led to a shortage of semiconductors worldwide. In addition, end-users of semiconductors originally cut back on their production equipment purchases due to the recession. After the decline in cases, several businesses have displayed considerable indications of recovery.

Market Growth Factors

Growing demand for consumer electronics worldwide

The increasing demand for semiconductor chips from producers of consumer electronics, medical devices, and sensor systems is driving the rise of the semiconductor business. Since more people are using consumer electronics like cell phones, laptops, televisions, and other devices, the industry is growing. The need for production equipment is expected to rise because semiconductors are crucial to many sectors related to consumer electronic products, including telecommunications, information technology, machine automation, power & solar photovoltaic, and others. Rising digital content and improved connectivity, as well as mobility in the coming years, will further promote market expansion.

Rising semiconductor usage in the automotive industry

The automotive industry continues to be a significant source of demand as well as a source of potential for semiconductor vendors, despite recent recessions and demand variations. Trends like the rise in demand for autonomous & electric vehicles and the increasing number of semiconductor components per vehicle are key motivators for semiconductor manufacturers. As more semiconductor components, such as sensors, microcontrollers, and radar chips, are utilized in automobiles, the market for semiconductor production equipment expands.

Market Restraining Factors

High costs of machines and interruptions to the supply chain

The supply chain for the semiconductor production equipment market has a large number of participants. However, the coronavirus pandemic significantly hindered the market's supply chain. The locations of semiconductor production plants must be in tidy areas. Moreover, there should be no flaws in the equipment supplied for making semiconductors. Most importantly, semiconductor equipment is expensive and requires a significant upfront investment. Machine price volatility is anticipated to impede market expansion.

Dimension Outlook

On the basis of dimension, the semiconductor production equipment market is fragmented into 2 dimension, 2.5 dimension, and 3 dimension. The 2 dimension segment acquired a substantial revenue share in the semiconductor production equipment market in 2021. The 2 dimension semiconductors allow reduced length as well as reusability, which further reduces time and system cost. This aspect is causing the segment for equipment used in 2D semiconductor fabrication to grow more quickly.

Supply Chain Process Outlook

Based on supply chain process, the semiconductor production equipment market is categorized into IDM, OSAT, and foundry. The OSAT segment procured a considerable growth rate in the semiconductor production equipment market in 2021. OSAT (Outsourced semiconductor assembly and test) companies provide test services as well as third-party IC packaging. These companies’ test and package silicon products made by foundries before putting them on the market.

Product Type Outlook

On the basis of product type, the semiconductor production equipment market is divided into front-end equipment and back-end equipment. The front-end equipment segment acquired the largest revenue share in the semiconductor production equipment market in 2021. All of the manufacturing tools used to produce semiconductors are included in the front-end equipment. The rising demand for chips that are highly efficient and dense for use in IoT devices, CPUs, GPUs, and other devices is partially responsible for the expansion of the segment.

Function Outlook

Based on function, the semiconductor production equipment market is segmented into integrated circuits and OSD. The integrated circuits (ICs) segment witnessed the maximum revenue share in the semiconductor production equipment market in 2021. An Integrated Device Manufacturer (IDM) oversees each step of the production and sales processes in the semiconductor industry. IDMs help reduce costs, maintain the optimum operation of manufacturing plants, and aid in the development of market strategies. These benefits of IDMs are attributed to the growth of the segment.

Regional Outlook

On the basis of region, the semiconductor production equipment market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region recorded the largest revenue share in the semiconductor production equipment market in 2021. The region's sizable semiconductor industry, which benefits from the demand for semiconductors, is responsible for the segment's rise. This has a favorable impact on the prognosis for the market for semiconductor production equipment in the region.

Semiconductor Production Equipment Market Competition Analysis

The major strategies followed by the market participants are Acquisition. Based on the Analysis presented in the Cardinal matrix; Applied Materials, Inc., ASML Holdings N.V., Lam Research Corporation and KLA Corporation are the forerunners in the Semiconductor Production Equipment Market. Companies such as Carl Zeiss AG, Teradyne, Inc. and Screen Holdings are some of the key innovators in Semiconductor Production Equipment Market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Alsil Material, ASML Holdings N.V., SCREEN Holdings Co., Ltd., Teradyne, Inc., Applied Materials, Inc., Veeco Instruments, Inc., KLA Corporation, Nikon Corporation, Carl Zeiss AG, and Lam Research Corporation.

Strategies deployed in Semiconductor Production Equipment Market

Partnerships, Collaborations and Agreements:

  • Oct-2022: Applied Materials, Inc. collaborated with BE Semiconductor Industries N.V., a company engaged in the manufacturing of semiconductors. Through this collaboration, the combining companies would create a solution for die-based hybrid bonding, a chip-to-chip interconnect technology that enables subsystem designs and heterogeneous chips for applications involving 5G, AI and high-performance computing. Additionally, this would accelerate heterogeneous integration technology and enhance the types of equipment
  • Jan-2022: ASML Holding N.V. collaborated with Intel Corporation, a semiconductor chip manufacturer. This move would help in boosting semiconductor lithography technology. This collaboration would ensure cost-efficient manufacturing of chips by providing lithographic improvements in lesser cycle time, energy, cost and complexity

Product Launches and Product Expansions:

  • Dec-2022: KLA Corporation unveiled Axion T2000 X-ray metrology system to help memory chip manufacturers. This product can count high aspect ratio device features along with exceptional accuracy, speed, precision and resolution. Axion T2000 confirms the smooth production of memory chips utilized for artificial intelligence, edge computing, 5G and data centers
  • Jun-2021: KLA Corporation released four new products: C205 broadband plasma patterned wafer inspection system, I-PAT® inline defect part average testing screening solution, Surfscan® SP A2/A3 unpatterned wafer inspection system and 8935 high productivity patterned wafer inspection system. These launched products would deliver a creative solution for inline screening and finding possible reliability defects. Additionally, these products would assist microchip manufacturing plants in achieving reliability and quality chips to maximize output
  • Sep-2020: KLA unveiled three semiconductor packaging techniques: ICOS T3/T7 Series, Kronos 1190 wafer inspection system and ICOS F160XP die sorting and inspection system. These launched systems help the customers to master the challenges in integrated circuits. Additionally, these products would permit users to advance the fabrication of semiconductor devices

Acquisitions and Mergers:

  • Nov-2022: Lam Research Corp. completed the acquisition of SEMSYSCO GmbH. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI) and other data-intensive applications
  • Nov-2022: Lam Research Corp. acquired SEMSYSCO GmbH, a semiconductor manufacturing company. This acquisition would enhance the of company's packaging capabilities which is suitable for chip-based solutions, artificial intelligence, data-intensive applications and data-intensive applications
  • Oct-2022: ASML took over Berliner Glas Group, a company supplying components for EUV and DUV lithography. This acquisition would lead to the addition of the capabilities of both the companies in manufacturing and R&D to assist further growth and launches of EUV systems to deliver important services to the customers
  • Jun-2022: Applied Materials completed the acquisition of Picosun Oy, a company manufacturing semiconductor equipment. This acquisition would broaden the suite of Applied Materials and customer involvement. Moreover, this would help the company to support customers in putting more functionality and intelligence in various edge computing equipment

»Geographical Expansions:

  • Nov-2022: ZEISS is expanding its geographical footprint in Germany by building a multifunctional factory. This facility is accompanied by technical operations building in which compressed air can be generated. This expansion would help in manufacturing high-tech products like lithography optics that need special conditions
  • Dec-2021: Lam Research Corp. (Nasdaq: LRCX) today announced the expansion of its manufacturing footprint in Oregon. The new facility is Lam’s fifth manufacturing site in the United States and will further enhance its resilience and ability to meet increasing customer demand, as chip suppliers seek to ramp up production globally
  • Dec-2021: Lam Research Corp. is expanding its geographical footprint by opening a manufacturing facility in Oregon, USA. This would enhance the company's ability to meet the demands of customer and ramp up the chip supplies globally

Scope of the Study

Market Segments Covered in the Report:

By Dimension

  • 3-Dimension
  • 2.5-Dimension
  • 2-Dimension

By Supply Chain Process

  • IDM
  • OSAT
  • Others

By Product Type

  • Front-end Equipment
  • Back-end Equipment

By Function

  • Integrated Circuits
  • OSD

By Geography

North America

  • US
  • Canada
  • Mexico
  • Rest of North America

Europe

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Asia Pacific

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

LAMEA

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Alsil Material
  • ASML Holdings N.V
  • SCREEN Holdings Co., Ltd
  • Teradyne, Inc
  • Applied Materials, Inc
  • Veeco Instruments, Inc
  • KLA Corporation
  • Nikon Corporation
  • Carl Zeiss AG
  • Lam Research Corporation

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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Semiconductor Production Equipment Market, by Dimension
1.4.2 Global Semiconductor Production Equipment Market, by Supply Chain Process
1.4.3 Global Semiconductor Production Equipment Market, by Product Type Process
1.4.4 Global Semiconductor Production Equipment Market, by Function
1.4.5 Global Semiconductor Production Equipment Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.1 Top Winning Strategies
3.1.1 Key Leading Strategies: Percentage Distribution (2018-2022)

Chapter 4. Global Semiconductor Production Equipment Market by Dimension
4.1 Global 3-Dimension Market by Region
4.2 Global 2.5-Dimension Market by Region
4.3 Global 2-Dimension Market by Region

Chapter 5. Global Semiconductor Production Equipment Market by Supply Chain Process
5.1 Global IDM Market by Region
5.2 Global OSAT Market by Region
5.3 Global Others Market by Region

Chapter 6. Global Semiconductor Production Equipment Market by Product Type
6.1 Global Front-end Equipment Market by Region
6.2 Global Back-end Equipment Market by Region

Chapter 7. Global Semiconductor Production Equipment Market by Function
7.1 Global Integrated Circuits Market by Region
7.2 Global OSD Market by Region

Chapter 8. Global Semiconductor Production Equipment Market by Region
8.1 North America Semiconductor Production Equipment Market
8.1.1 North America Semiconductor Production Equipment Market by Dimension
8.1.1.1 North America 3-Dimension Market by Country
8.1.1.2 North America 2.5-Dimension Market by Country
8.1.1.3 North America 2-Dimension Market by Country
8.1.2 North America Semiconductor Production Equipment Market by Supply Chain Process
8.1.2.1 North America IDM Market by Country
8.1.2.2 North America OSAT Market by Country
8.1.2.3 North America Others Market by Country
8.1.3 North America Semiconductor Production Equipment Market by Product Type
8.1.3.1 North America Front-end Equipment Market by Country
8.1.3.2 North America Back-end Equipment Market by Country
8.1.4 North America Semiconductor Production Equipment Market by Function
8.1.4.1 North America Integrated Circuits Market by Country
8.1.4.2 North America OSD Market by Country
8.1.5 North America Semiconductor Production Equipment Market by Country
8.1.5.1 US Semiconductor Production Equipment Market
8.1.5.1.1 US Semiconductor Production Equipment Market by Dimension
8.1.5.1.2 US Semiconductor Production Equipment Market by Supply Chain Process
8.1.5.1.3 US Semiconductor Production Equipment Market by Product Type
8.1.5.1.4 US Semiconductor Production Equipment Market by Function
8.1.5.2 Canada Semiconductor Production Equipment Market
8.1.5.2.1 Canada Semiconductor Production Equipment Market by Dimension
8.1.5.2.2 Canada Semiconductor Production Equipment Market by Supply Chain Process
8.1.5.2.3 Canada Semiconductor Production Equipment Market by Product Type
8.1.5.2.4 Canada Semiconductor Production Equipment Market by Function
8.1.5.3 Mexico Semiconductor Production Equipment Market
8.1.5.3.1 Mexico Semiconductor Production Equipment Market by Dimension
8.1.5.3.2 Mexico Semiconductor Production Equipment Market by Supply Chain Process
8.1.5.3.3 Mexico Semiconductor Production Equipment Market by Product Type
8.1.5.3.4 Mexico Semiconductor Production Equipment Market by Function
8.1.5.4 Rest of North America Semiconductor Production Equipment Market
8.1.5.4.1 Rest of North America Semiconductor Production Equipment Market by Dimension
8.1.5.4.2 Rest of North America Semiconductor Production Equipment Market by Supply Chain Process
8.1.5.4.3 Rest of North America Semiconductor Production Equipment Market by Product Type
8.1.5.4.4 Rest of North America Semiconductor Production Equipment Market by Function
8.2 Europe Semiconductor Production Equipment Market
8.2.1 Europe Semiconductor Production Equipment Market by Dimension
8.2.1.1 Europe 3-Dimension Market by Country
8.2.1.2 Europe 2.5-Dimension Market by Country
8.2.1.3 Europe 2-Dimension Market by Country
8.2.2 Europe Semiconductor Production Equipment Market by Supply Chain Process
8.2.2.1 Europe IDM Market by Country
8.2.2.2 Europe OSAT Market by Country
8.2.2.3 Europe Others Market by Country
8.2.3 Europe Semiconductor Production Equipment Market by Product Type
8.2.3.1 Europe Front-end Equipment Market by Country
8.2.3.2 Europe Back-end Equipment Market by Country
8.2.4 Europe Semiconductor Production Equipment Market by Function
8.2.4.1 Europe Integrated Circuits Market by Country
8.2.4.2 Europe OSD Market by Country
8.2.5 Europe Semiconductor Production Equipment Market by Country
8.2.5.1 Germany Semiconductor Production Equipment Market
8.2.5.1.1 Germany Semiconductor Production Equipment Market by Dimension
8.2.5.1.2 Germany Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.1.3 Germany Semiconductor Production Equipment Market by Product Type
8.2.5.1.4 Germany Semiconductor Production Equipment Market by Function
8.2.5.2 UK Semiconductor Production Equipment Market
8.2.5.2.1 UK Semiconductor Production Equipment Market by Dimension
8.2.5.2.2 UK Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.2.3 UK Semiconductor Production Equipment Market by Product Type
8.2.5.2.4 UK Semiconductor Production Equipment Market by Function
8.2.5.3 France Semiconductor Production Equipment Market
8.2.5.3.1 France Semiconductor Production Equipment Market by Dimension
8.2.5.3.2 France Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.3.3 France Semiconductor Production Equipment Market by Product Type
8.2.5.3.4 France Semiconductor Production Equipment Market by Function
8.2.5.4 Russia Semiconductor Production Equipment Market
8.2.5.4.1 Russia Semiconductor Production Equipment Market by Dimension
8.2.5.4.2 Russia Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.4.3 Russia Semiconductor Production Equipment Market by Product Type
8.2.5.4.4 Russia Semiconductor Production Equipment Market by Function
8.2.5.5 Spain Semiconductor Production Equipment Market
8.2.5.5.1 Spain Semiconductor Production Equipment Market by Dimension
8.2.5.5.2 Spain Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.5.3 Spain Semiconductor Production Equipment Market by Product Type
8.2.5.5.4 Spain Semiconductor Production Equipment Market by Function
8.2.5.6 Italy Semiconductor Production Equipment Market
8.2.5.6.1 Italy Semiconductor Production Equipment Market by Dimension
8.2.5.6.2 Italy Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.6.3 Italy Semiconductor Production Equipment Market by Product Type
8.2.5.6.4 Italy Semiconductor Production Equipment Market by Function
8.2.5.7 Rest of Europe Semiconductor Production Equipment Market
8.2.5.7.1 Rest of Europe Semiconductor Production Equipment Market by Dimension
8.2.5.7.2 Rest of Europe Semiconductor Production Equipment Market by Supply Chain Process
8.2.5.7.3 Rest of Europe Semiconductor Production Equipment Market by Product Type
8.2.5.7.4 Rest of Europe Semiconductor Production Equipment Market by Function
8.3 Asia Pacific Semiconductor Production Equipment Market
8.3.1 Asia Pacific Semiconductor Production Equipment Market by Dimension
8.3.1.1 Asia Pacific 3-Dimension Market by Country
8.3.1.2 Asia Pacific 2.5-Dimension Market by Country
8.3.1.3 Asia Pacific 2-Dimension Market by Country
8.3.2 Asia Pacific Semiconductor Production Equipment Market by Supply Chain Process
8.3.2.1 Asia Pacific IDM Market by Country
8.3.2.2 Asia Pacific OSAT Market by Country
8.3.2.3 Asia Pacific Others Market by Country
8.3.3 Asia Pacific Semiconductor Production Equipment Market by Product Type
8.3.3.1 Asia Pacific Front-end Equipment Market by Country
8.3.3.2 Asia Pacific Back-end Equipment Market by Country
8.3.4 Asia Pacific Semiconductor Production Equipment Market by Function
8.3.4.1 Asia Pacific Integrated Circuits Market by Country
8.3.4.2 Asia Pacific OSD Market by Country
8.3.5 Asia Pacific Semiconductor Production Equipment Market by Country
8.3.5.1 China Semiconductor Production Equipment Market
8.3.5.1.1 China Semiconductor Production Equipment Market by Dimension
8.3.5.1.2 China Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.1.3 China Semiconductor Production Equipment Market by Product Type
8.3.5.1.4 China Semiconductor Production Equipment Market by Function
8.3.5.2 Japan Semiconductor Production Equipment Market
8.3.5.2.1 Japan Semiconductor Production Equipment Market by Dimension
8.3.5.2.2 Japan Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.2.3 Japan Semiconductor Production Equipment Market by Product Type
8.3.5.2.4 Japan Semiconductor Production Equipment Market by Function
8.3.5.3 India Semiconductor Production Equipment Market
8.3.5.3.1 India Semiconductor Production Equipment Market by Dimension
8.3.5.3.2 India Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.3.3 India Semiconductor Production Equipment Market by Product Type
8.3.5.3.4 India Semiconductor Production Equipment Market by Function
8.3.5.4 South Korea Semiconductor Production Equipment Market
8.3.5.4.1 South Korea Semiconductor Production Equipment Market by Dimension
8.3.5.4.2 South Korea Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.4.3 South Korea Semiconductor Production Equipment Market by Product Type
8.3.5.4.4 South Korea Semiconductor Production Equipment Market by Function
8.3.5.5 Singapore Semiconductor Production Equipment Market
8.3.5.5.1 Singapore Semiconductor Production Equipment Market by Dimension
8.3.5.5.2 Singapore Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.5.3 Singapore Semiconductor Production Equipment Market by Product Type
8.3.5.5.4 Singapore Semiconductor Production Equipment Market by Function
8.3.5.6 Malaysia Semiconductor Production Equipment Market
8.3.5.6.1 Malaysia Semiconductor Production Equipment Market by Dimension
8.3.5.6.2 Malaysia Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.6.3 Malaysia Semiconductor Production Equipment Market by Product Type
8.3.5.6.4 Malaysia Semiconductor Production Equipment Market by Function
8.3.5.7 Rest of Asia Pacific Semiconductor Production Equipment Market
8.3.5.7.1 Rest of Asia Pacific Semiconductor Production Equipment Market by Dimension
8.3.5.7.2 Rest of Asia Pacific Semiconductor Production Equipment Market by Supply Chain Process
8.3.5.7.3 Rest of Asia Pacific Semiconductor Production Equipment Market by Product Type
8.3.5.7.4 Rest of Asia Pacific Semiconductor Production Equipment Market by Function
8.4 LAMEA Semiconductor Production Equipment Market
8.4.1 LAMEA Semiconductor Production Equipment Market by Dimension
8.4.1.1 LAMEA 3-Dimension Market by Country
8.4.1.2 LAMEA 2.5-Dimension Market by Country
8.4.1.3 LAMEA 2-Dimension Market by Country
8.4.2 LAMEA Semiconductor Production Equipment Market by Supply Chain Process
8.4.2.1 LAMEA IDM Market by Country
8.4.2.2 LAMEA OSAT Market by Country
8.4.2.3 LAMEA Others Market by Country
8.4.3 LAMEA Semiconductor Production Equipment Market by Product Type
8.4.3.1 LAMEA Front-end Equipment Market by Country
8.4.3.2 LAMEA Back-end Equipment Market by Country
8.4.4 LAMEA Semiconductor Production Equipment Market by Function
8.4.4.1 LAMEA Integrated Circuits Market by Country
8.4.4.2 LAMEA OSD Market by Country
8.4.5 LAMEA Semiconductor Production Equipment Market by Country
8.4.5.1 Brazil Semiconductor Production Equipment Market
8.4.5.1.1 Brazil Semiconductor Production Equipment Market by Dimension
8.4.5.1.2 Brazil Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.1.3 Brazil Semiconductor Production Equipment Market by Product Type
8.4.5.1.4 Brazil Semiconductor Production Equipment Market by Function
8.4.5.2 Argentina Semiconductor Production Equipment Market
8.4.5.2.1 Argentina Semiconductor Production Equipment Market by Dimension
8.4.5.2.2 Argentina Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.2.3 Argentina Semiconductor Production Equipment Market by Product Type
8.4.5.2.4 Argentina Semiconductor Production Equipment Market by Function
8.4.5.3 UAE Semiconductor Production Equipment Market
8.4.5.3.1 UAE Semiconductor Production Equipment Market by Dimension
8.4.5.3.2 UAE Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.3.3 UAE Semiconductor Production Equipment Market by Product Type
8.4.5.3.4 UAE Semiconductor Production Equipment Market by Function
8.4.5.4 Saudi Arabia Semiconductor Production Equipment Market
8.4.5.4.1 Saudi Arabia Semiconductor Production Equipment Market by Dimension
8.4.5.4.2 Saudi Arabia Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.4.3 Saudi Arabia Semiconductor Production Equipment Market by Product Type
8.4.5.4.4 Saudi Arabia Semiconductor Production Equipment Market by Function
8.4.5.5 South Africa Semiconductor Production Equipment Market
8.4.5.5.1 South Africa Semiconductor Production Equipment Market by Dimension
8.4.5.5.2 South Africa Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.5.3 South Africa Semiconductor Production Equipment Market by Product Type
8.4.5.5.4 South Africa Semiconductor Production Equipment Market by Function
8.4.5.6 Nigeria Semiconductor Production Equipment Market
8.4.5.6.1 Nigeria Semiconductor Production Equipment Market by Dimension
8.4.5.6.2 Nigeria Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.6.3 Nigeria Semiconductor Production Equipment Market by Product Type
8.4.5.6.4 Nigeria Semiconductor Production Equipment Market by Function
8.4.5.7 Rest of LAMEA Semiconductor Production Equipment Market
8.4.5.7.1 Rest of LAMEA Semiconductor Production Equipment Market by Dimension
8.4.5.7.2 Rest of LAMEA Semiconductor Production Equipment Market by Supply Chain Process
8.4.5.7.3 Rest of LAMEA Semiconductor Production Equipment Market by Product Type
8.4.5.7.4 Rest of LAMEA Semiconductor Production Equipment Market by Function

Chapter 9. Company Profiles
9.1 KLA Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.5.2 Acquisition and Mergers:
9.2 Teradyne, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Recent strategies and developments:
9.2.4.1 Product Launches and Product Expansions:
9.2.4.2 Acquisition and Mergers:
9.3 ASML Holding N.V
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent strategies and developments:
9.3.5.1 Partnerships, Collaborations, and Agreements:
9.3.5.2 Acquisition and Mergers:
9.4 Applied Materials, Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Partnerships, Collaborations, and Agreements:
9.4.5.2 Acquisition and Mergers:
9.5 SCREEN Holdings Co., Ltd
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.6 Veeco Instruments, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Partnerships, Collaborations, and Agreements:
9.7 Nikon Corporation
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expense
9.8 Carl Zeiss AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments:
9.8.5.1 Geographical Expansions:
9.9 Lam Research Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments:
9.9.5.1 Acquisition and Mergers:
9.9.5.2 Geographical Expansions:
9.10. Alsil Material
9.10.1 Company Overview

Companies Mentioned

  • Alsil Material
  • ASML Holdings N.V.
  • SCREEN Holdings Co., Ltd
  • Teradyne, Inc.
  • Applied Materials, Inc.
  • Veeco Instruments, Inc.
  • KLA Corporation
  • Nikon Corporation
  • Carl Zeiss AG
  • Lam Research Corporation

Methodology

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Table Information