The Latin America, Middle East and Africa Embedded Die Packaging Technology Market would witness market growth of 22.1% CAGR during the forecast period (2022-2028).
A frame carrier is attached with glue to a temporary carrier to create an embedded semiconductor die package. The die mounting points for the frame carrier include a lead frame connection structure surrounding a cavity. In each cavity is a semiconductor die. In the cavity above the die, an encapsulant is placed.
Well, over the lead frame interconnect structure and encapsulant, a package interconnect structure is created. Electrical connections are made between the die, package, and lead frame interconnect structure. In order to create separate embedded die packages, the frame carrier is divided. The semiconductor die may be stacked vertically or arranged side by side within the cavity.
The lead frame interconnects topology allows for the stacking and electrical interconnection of the embedded die packages. A semiconductor device may be attached to the embedded die packaging through the lead frame connection structure and electrically coupled to the die.
Brazil's most connected and intelligent city has been named Curitiba. In addition, Curitiba was a leader in developing the first Bus Rapid Transit (BRT) system, a network of bus lines that revolutionized how city residents get about. Additionally, the city offers its residents free internet access in public spaces. Furthermore, projects, including Fab Labs, urban farms, city navigation applications, and innovation clusters are being worked on in Curitiba. In order to foster a creative atmosphere that will stimulate intelligent solutions following the fulfillment of the SDGs, Curitiba is promoting a smart city movement. Due to rising adoption prospects of IoT and 5G infrastructure across the area, it is expected that these activities to construct smart cities throughout the region would boost the growth of the embedded die packaging technology market.
The Brazil market dominated the LAMEA Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $2,757.5 Thousands by 2028.The Argentina market is experiencing a CAGR of 22.8% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 21.8% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
A frame carrier is attached with glue to a temporary carrier to create an embedded semiconductor die package. The die mounting points for the frame carrier include a lead frame connection structure surrounding a cavity. In each cavity is a semiconductor die. In the cavity above the die, an encapsulant is placed.
Well, over the lead frame interconnect structure and encapsulant, a package interconnect structure is created. Electrical connections are made between the die, package, and lead frame interconnect structure. In order to create separate embedded die packages, the frame carrier is divided. The semiconductor die may be stacked vertically or arranged side by side within the cavity.
The lead frame interconnects topology allows for the stacking and electrical interconnection of the embedded die packages. A semiconductor device may be attached to the embedded die packaging through the lead frame connection structure and electrically coupled to the die.
Brazil's most connected and intelligent city has been named Curitiba. In addition, Curitiba was a leader in developing the first Bus Rapid Transit (BRT) system, a network of bus lines that revolutionized how city residents get about. Additionally, the city offers its residents free internet access in public spaces. Furthermore, projects, including Fab Labs, urban farms, city navigation applications, and innovation clusters are being worked on in Curitiba. In order to foster a creative atmosphere that will stimulate intelligent solutions following the fulfillment of the SDGs, Curitiba is promoting a smart city movement. Due to rising adoption prospects of IoT and 5G infrastructure across the area, it is expected that these activities to construct smart cities throughout the region would boost the growth of the embedded die packaging technology market.
The Brazil market dominated the LAMEA Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $2,757.5 Thousands by 2028.The Argentina market is experiencing a CAGR of 22.8% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 21.8% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
By Vertical
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Healthcare
- Others
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd
- Amkor Technology, Inc
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Embedded Die Packaging Technology Market, by Vertical
1.4.2 LAMEA Embedded Die Packaging Technology Market, by Platform
1.4.3 LAMEA Embedded Die Packaging Technology Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market
Chapter 4. LAMEA Embedded Die Packaging Technology Market by Vertical
4.1 LAMEA Consumer Electronics Market by Country
4.2 LAMEA IT & Telecommunication Market by Country
4.3 LAMEA Automotive Market by Country
4.4 LAMEA Healthcare Market by Country
4.5 LAMEA Others Market by Country
Chapter 5. LAMEA Embedded Die Packaging Technology Market by Platform
5.1 LAMEA Embedded Die in IC Package Substrate Market by Country
5.2 LAMEA Embedded Die in Rigid Board Market by Country
5.3 LAMEA Embedded Die in Flexible Board Market by Country
Chapter 6. LAMEA Embedded Die Packaging Technology Market by Country
6.1 Brazil Embedded Die Packaging Technology Market
6.1.1 Brazil Embedded Die Packaging Technology Market by Vertical
6.1.2 Brazil Embedded Die Packaging Technology Market by Platform
6.2 Argentina Embedded Die Packaging Technology Market
6.2.1 Argentina Embedded Die Packaging Technology Market by Vertical
6.2.2 Argentina Embedded Die Packaging Technology Market by Platform
6.3 UAE Embedded Die Packaging Technology Market
6.3.1 UAE Embedded Die Packaging Technology Market by Vertical
6.3.2 UAE Embedded Die Packaging Technology Market by Platform
6.4 Saudi Arabia Embedded Die Packaging Technology Market
6.4.1 Saudi Arabia Embedded Die Packaging Technology Market by Vertical
6.4.2 Saudi Arabia Embedded Die Packaging Technology Market by Platform
6.5 South Africa Embedded Die Packaging Technology Market
6.5.1 South Africa Embedded Die Packaging Technology Market by Vertical
6.5.2 South Africa Embedded Die Packaging Technology Market by Platform
6.6 Nigeria Embedded Die Packaging Technology Market
6.6.1 Nigeria Embedded Die Packaging Technology Market by Vertical
6.6.2 Nigeria Embedded Die Packaging Technology Market by Platform
6.7 Rest of LAMEA Embedded Die Packaging Technology Market
6.7.1 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical
6.7.2 Rest of LAMEA Embedded Die Packaging Technology Market by Platform
Chapter 7. Company Profiles
7.1 General Electric (GE) Co.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.5.2 Geographical Expansions:
7.2.6 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.5.2 Acquisition and Mergers:
7.4 Fujikura Ltd.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Geographical Expansions:
7.6 Taiwan Semiconductor Manufacturing Company Limited
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.7 ASE Group (ASE Technology Holding)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expenses
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.8 Microsemi Corporation (Microchip Technology)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Schweizer Electronic AG (Wus Printed Circuit)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expenses
7.10. AT&S Group
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
Companies Mentioned
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Methodology
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