Low Dielectric Materials Global Market Report 2024

The low dielectric materials market size has grown exponentially in recent years. It will grow from $2.04 billion in 2023 to $2.45 billion in 2024 at a compound annual growth rate (CAGR) of 20.5%. Historically, growth can be attributed to the increasing demand for high-speed data processing, the rise of wireless communication, miniaturization in electronics, the development of high-frequency applications, and the emergence of IoT devices.

The low dielectric materials market size is expected to see exponential growth in the next few years. It will grow to $5.45 billion in 2028 at a compound annual growth rate (CAGR) of 22.1%. The projected growth in the forecast period is driven by increasing demand in electric vehicles, the expanding Internet of Things (IoT) market, continuous miniaturization in electronics, growing data center requirements, and advancements in semiconductor manufacturing. Major trends expected during this period include integration in aerospace and defense, further miniaturization in electronics, advancements in 5G technology, the rise in the Internet of Things (IoT), and an increased demand for high-speed data processing.

The emergence of 5G communications is expected to drive the growth of the low-dielectric materials market in the foreseeable future. 5G represents the latest generation of wireless communication technology aimed at significantly enhancing the speed and responsiveness of wireless networks. Low dielectric constant resins are commonly utilized in the production of equipment such as antenna interlayers, cables, and communication devices for 5G networks. For instance, data from 5G Americas, a US-based industry trade organization, revealed that global 5G wireless connections surged by 76% from the end of 2021 to the end of 2022, reaching 1.05 billion. Projections indicate a further increase to 5.9 billion connections by the end of 2027. As a result, the advent of 5G communications is a key driver propelling the growth of the low-dielectric materials market.

The anticipated increase in electronics production is set to drive the growth of the low-dielectric material market in the foreseeable future. Electronics, a field encompassing the study, design, and application of devices involving controlled electron flow, relies on low dielectric materials to mitigate signal interference and optimize the efficiency of electronic components by reducing capacitance effects. For example, as reported by Electronics Weekly, a UK-based trade journal, electronic production in the U.S. surged by over 8% in November 2020, followed by an additional 8.7% increase in January 2021. Hence, the upward trend in electronics manufacturing serves as the driving force behind the expansion of the low-dielectric material market.

In the low dielectric materials market, the primary trend gaining significant momentum is the introduction of new technological innovations. Major market players are actively unveiling cutting-edge technology products crafted using optimized electrical technology to fortify their market standing. For instance, in November 2021, Sartomer, a US-based company specializing in manufacturing specialty UV resins and additives, introduced PRO14729, PRO14730, and PRO14731. These UV-curable resins exhibit a low dielectric constant (Dk) and are specifically tailored for diverse electronics applications such as antenna elements, radomes, lenses, copper clad laminates, B-staging, server storage, and IoT applications. Leveraging optimized electrical performance technology, these materials enhance the performance, functionality, and operational speed of electronic devices. These novel ultra-low dielectric loss materials are integral components of the expanding array of UV-curable solutions for electronics.

Prominent companies within the low-dielectric material market are concentrating on the development of state-of-the-art products, such as liquid crystal powder, aiming to elevate high-speed communication capabilities and secure a competitive advantage. Liquid crystal powder comprises finely divided particles possessing distinctive optical and electrical traits, demonstrating behavior akin to liquid crystals. For instance, in August 2021, ENEOS Corporation, a fully integrated oil company based in Japan, unveiled XYDAR LF-31P, a liquid crystal powder (LCP) showcasing world-leading dielectric properties. This particular LCP is meticulously engineered to cater to the demands of high-speed communication in next-generation electronic devices. Designed to address the escalating need for efficient communication circuits and to mitigate transmission loss within semiconductor components due to heightened communication volumes, XYDAR LF-31P boasts a fine particle size distribution averaging 5-7µm. It notably exhibits an industry-leading low dielectric loss tangent of 0.0007, significantly enhancing its efficacy in reducing transmission loss and bolstering high-speed communication capabilities.

In May 2021, Rogers Corporation, a manufacturer in the US specializing in electric components and low dielectric materials, entered into a partnership with Fortify, the US-based 3D printing company, for an undisclosed sum. This collaboration aims to expand their production of low-loss dielectric materials tailored for radio frequency (RF) devices and electronics. Additionally, the partnership intends to capitalize on their respective expertise to enable scalable manufacturing of high-value RF components.

Major companies operating in the low dielectric materials market report are Daikin Industries Ltd., Mitsubishi Corporation, Nishimura Advanced Ceramics Co. Ltd., Idemitsu Kosan Co. Ltd., Nippon Steel & Sumitomo Metal Corporation, Saudi Basic Industries Corporation (SABIC), Applied Materials Inc., Sumitomo Chemical Co. Ltd., Asahi Kasei Corporation, Shin-Etsu Chemical Co. Ltd., TDK Corporation, Murata Manufacturing Co. Ltd., DuPont (E.I. du Pont de Nemours and Company), Teijin Limited, Huntsman Corporation, Iwatani Corporation, The Chemours Company, Kuraray Co. Ltd., Showa Denko Materials Co. Ltd., JSR Corporation, Zeon Corporation, Taiyo Yuden Co. Ltd., Tokai Carbon Co. Ltd., Tokyo Ohka Kogyo Co. Ltd., KEMET Corporation, AVX Corporation, Hindustan Fluorocarbons Limited, CeramTec GmbH, DNF Co Ltd., Gelest Inc., Vishay Intertechnology Inc.

Asia-Pacific was the largest region in the low dielectric materials market in 2023. The regions covered in the low dielectric materials market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the low dielectric materials market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

In the low dielectric materials market, the main types are thermoset, thermoplastic, and ceramics. Thermoset materials are used in electronics fields such as printed circuit boards and encapsulation due to their dimensional stability, good chemical resistance, insulation, and adhesion properties. These materials undergo a chemical reaction due to factors such as heat, a catalyst, or ultraviolet light, leaving them in a largely infusible state. Examples of thermoset materials include fluoropolymer, modified polyphenylene ether, polyimide, cyclic olefin copolymer, cyanate ester, liquid crystal polymer, and others, which find applications in PCBs, antennas, microelectronics, wire and cable, radome, and other electronic components.

The low dielectric materials market research report is one of a series of new reports that provides low dielectric materials market statistics, including low dielectric materials industry global market size, regional shares, competitors with a low dielectric materials market share, detailed low dielectric materials market segments, market trends and opportunities, and any further data you may need to thrive in the low dielectric materials industry. This low dielectric materials market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The low dielectric material market consists of sales of ceramics, benzocyclobutene (BCB), SiLK, SLK, and polyetheretherketone (PEEK). Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.