The Europe Quad-Flat-No-Lead Packaging Market should witness market growth of 7.9% CAGR during the forecast period (2022-2028).
The leadframe-based QFN package is renowned for its high frequency and speed applications due to its exposed paddle. The board serves as a heat sink for the integrated circuitsand successfully transfers the majority of the excess heat from the package owing to the exposed paddle package's effective reduction of thermal resistance. Leadframe CSP packages have a reputation for being the best option for high-speed applications that call for strong thermal performance.
The requirement for improved thermal performance in a small package to disperse heat and enhance device performance is rising as a result of the trend toward technological improvement. Applications of QFN packages are most often found in the automobile electrical system or portable consumer goods (like PDAs and digital cameras), and products used in telecommunication industry (like handphones and wireless LAN).
With the help of current leadframe manufacturing and design techniques, UTAC has created a low-cost, high-power QFN package that enhances thermal performance by allowing heat to be dissipated from both surfaces. In order to dissipate heat across the top surface of the die, the high performance HQFN incorporates an exposed silicon lid that serves as a heat spreader and is mounted over the die using a laminated thermal film.
Germany is putting a lot of effort into being a top semiconductor producer to safeguard its technological dominance and open up new semiconductor-dependent industries. The nation also possesses an unparalleled density of top-tier device manufacturers and components, materials, and equipment suppliers across the whole value chain. Germany plans to invest in keeping its place as a major center for producing semiconductors. The region's QFNpackaging options would benefit from the expansion of the semiconductor sector. In light of this, the quad-flat-no-lead packagingmarket would experience expansion during the ensuing years.
The Germany market dominated the Europe Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $46.2 Thousands by 2028. The UK market is anticipated to grow at a CAGR of 7% during (2022-2028). Additionally, The France market would exhibit a CAGR of 8.7% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
The leadframe-based QFN package is renowned for its high frequency and speed applications due to its exposed paddle. The board serves as a heat sink for the integrated circuitsand successfully transfers the majority of the excess heat from the package owing to the exposed paddle package's effective reduction of thermal resistance. Leadframe CSP packages have a reputation for being the best option for high-speed applications that call for strong thermal performance.
The requirement for improved thermal performance in a small package to disperse heat and enhance device performance is rising as a result of the trend toward technological improvement. Applications of QFN packages are most often found in the automobile electrical system or portable consumer goods (like PDAs and digital cameras), and products used in telecommunication industry (like handphones and wireless LAN).
With the help of current leadframe manufacturing and design techniques, UTAC has created a low-cost, high-power QFN package that enhances thermal performance by allowing heat to be dissipated from both surfaces. In order to dissipate heat across the top surface of the die, the high performance HQFN incorporates an exposed silicon lid that serves as a heat spreader and is mounted over the die using a laminated thermal film.
Germany is putting a lot of effort into being a top semiconductor producer to safeguard its technological dominance and open up new semiconductor-dependent industries. The nation also possesses an unparalleled density of top-tier device manufacturers and components, materials, and equipment suppliers across the whole value chain. Germany plans to invest in keeping its place as a major center for producing semiconductors. The region's QFNpackaging options would benefit from the expansion of the semiconductor sector. In light of this, the quad-flat-no-lead packagingmarket would experience expansion during the ensuing years.
The Germany market dominated the Europe Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $46.2 Thousands by 2028. The UK market is anticipated to grow at a CAGR of 7% during (2022-2028). Additionally, The France market would exhibit a CAGR of 8.7% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
By Moulding Method
- Punched
- Sawn
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Europe Quad-Flat-No-Lead Packaging Market by Moulding Method
Chapter 4. Europe Quad-Flat-No-Lead Packaging Market by Terminal Pads
Chapter 5. Europe Quad-Flat-No-Lead Packaging Market by Type
Chapter 6. Europe Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 7. Europe Quad-Flat-No-Lead Packaging Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Methodology
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