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Silicon Carbide Market Report

  • Report

  • 84 Pages
  • May 2023
  • Region: Global
  • Techcet
  • ID: 5783270

The Special Report on Silicon Carbide (SiC) wafers used to make semiconductor devices includes market drivers, wafer forecast, wafer-making landscape, and supplier activities. This report also includes a comprehensive look at wafer making, including manufacturing costs and consumable and capital expenditures costs needed to build a wafer-making facility.

Who will benefit from this report? 

Chip fabricators, SiC wafer makers, investors, and policymakers. This essential set of Information is needed to plan and deliver SiC devices and wafers to meet growing global demand.

Table of Contents

1 Executive Summary
1.1 SiC Wafer Market Overview
1.2 Silicon Carbide Market Drivers
1.3 Other Wide Bandgap (WBG) Semiconductor Materials
1.4 Supplier Activities
1.5 General Comments

2 Scope, Purpose and Methodology
2.1 Scope
2.2 Purpose
2.3 Methodology

3 SiC Wafer Market Outlook
3.1 Silicon Carbide End-Use Application Market Drivers
3.1.1 Market Driver: Electric Vehicles & Charging Stations
3.1.2 Market Driver: Data Centers and Power Devices
3.1.3 Market Driver: 5G Communications
3.2 Semiconductor Device Manufacturing Market Drivers
3.2.1 Inverter Modules
3.2.2 Power Devices Forecast (Diodes and MOSFETs).
3.2.3 Power Inverter Modules (for EV’s)
3.3 Summary of SiC Market Drivers
3.4 Potentially Disruptive Technologies - GaN, Ga Oxide

4 Silicon Carbide Market Landscape
4.1 Economic and Industry Trends
4.2 SiC Wafer Forecast
4.2.1 N-Type Wafer Forecast
4.2.2 Semi-Insulating Wafer Forecast
4.3 SiC Wafer Suppliers and Market Shares
4.4 Supplier Activities - M&A
4.5 Comments on Regional and Global Trends

5 SiC Wafer Manufacturing Costs and Considerations
5.1 Brief History of SiC as a Semiconductor Substrate
5.2 SiC Material Properties
5.3 SiC Wafering Process Flow
5.3.1 SiC Wafering Sequence
5.3.2 SiC Boule Growth
5.4 SiC Wafer Manufacturing Cost Breakdown
5.4.1 SiC Furnace Capacity Planning
5.4.2 SiC Crystal Growth Consumables
5.4.3 OD Grinding (and puck grinding if needed)
5.4.4 Wafer Slicing
5.4.5 Edge Grinding
5.4.6 Pre-Polishing
5.4.7 Polishing/CMP and Cleaning
5.4.8 Epitaxy
5.4.9 Comments regarding OEM landscape for process equipment

6 Supply Chain and Company Profiles
6.1 Raw Material Dependencies and Concerns
6.2 SiC Wafer Suppliers
6.3 SiC Device Manufacturers
6.4 Process Equipment Suppliers (OEM’s)
6.5 SiC Process Consumables
6.6 Company Profiles

7 Summary and closing comments8 Appendices


The author employs subject matter experts having first-hand experience within the industries which they analyze. Most of the analysts have over 25 years of direct and relevant experience in their field. Our analysts survey the commercial and technical staff of IC manufacturers and their suppliers, and conduct extensive research of literature and commerce statistics to ascertain the current and future market environment and global supply risks. Combining this data with the author’s proprietary, quantitative wafer forecast results in a viable long-term market forecast for a variety of process materials.