Solder Materials Market Report 2026

The solder materials market size has grown strongly in recent years. It will grow from $2.14 billion in 2025 to $2.25 billion in 2026 at a compound annual growth rate (CAGR) of 5.1%. The growth in the historic period can be attributed to increasing use of lead-based solder in consumer electronics, growth of wave and reflow soldering processes, expansion of automotive electronic applications, adoption of rosin-based flux, rising production of solder bars and wires.

The solder materials market size is expected to see steady growth in the next few years. It will grow to $2.72 billion in 2030 at a compound annual growth rate (CAGR) of 4.9%. The growth in the forecast period can be attributed to rising demand for lead-free and eco-friendly solder materials, growth in industrial automation and robotic soldering, expansion of solder paste applications in advanced electronics, increasing use in automotive and building industries, development of high-performance specialty solder products. Major trends in the forecast period include rising adoption of lead-free solder materials, growth in specialty solder wire and bars, expansion of no-clean and water-soluble flux usage, increasing use of robotic and laser soldering processes, development of advanced solder pastes and preforms.

The growing demand for microelectronic devices is expected to drive the growth of the solder materials market in the coming years. Microelectronic devices are small-scale electronic components manufactured at the micrometer or nanometer level. The rising demand for these devices is fueled by the increasing use of advanced consumer electronics. The solder materials market supports this demand by providing essential materials that enable reliable electrical and mechanical connections in microelectronic devices. For example, in February 2024, the Semiconductor Industry Association (SIA), a U.S.-based nonprofit trade organization, reported that global semiconductor sales in the fourth quarter reached $146 billion, representing an 11.6% increase compared with the fourth quarter of 2022 and an 8.4% rise compared with the third quarter of 2023. Consequently, the growing demand for microelectronic devices is driving the growth of the solder materials market.

Leading companies in the solder materials market are focusing on developing innovative solutions, such as advanced high‑reliability solder pastes designed for automotive and electronics applications, to meet the growing demand for improved joint strength, lower defect rates, and reduced total cost of ownership across automotive electronics, consumer devices, and industrial systems. High‑reliability solder pastes are specialized formulations that combine optimized alloy compositions and flux systems to provide superior creep resistance, wider process windows, and consistent reflow performance compared with conventional solder materials, enabling robust interconnects under harsh thermal cycling and mechanical stress. For example, in February 2023, Heraeus Electronics GmbH, a Germany-based electronics materials company, introduced the Microbond SMT660 Innolot 2 solder paste, a next-generation no-clean solder alloy engineered for highly reliable and cost-effective soldering in automotive SMT applications. The product offers enhanced creep resistance and low-defect reflow performance without requiring additional nitrogen during soldering, thereby reducing manufacturing costs and improving the durability of solder joints in demanding environments.

In July 2025, SHENMAO America Inc., a Taiwan-based solder materials company, acquired Profound Material Technology Company Limited (PMTC) for an undisclosed sum. Through this acquisition, SHENMAO aimed to strengthen its presence in the advanced semiconductor packaging segment by incorporating high-performance solder ball capabilities and enhancing its technical expertise in solder alloys for next-generation semiconductor solutions. Profound Material Technology Company Limited (PMTC) is a Taiwan-based manufacturer specializing in high-performance solder balls and solder alloys used in advanced IC packaging formats.

Major companies operating in the solder materials market report are Lucas-Milhaupt Inc., Henkel AG & Co. KGaA, Senju Metal Industries Co. Ltd., Koki Company Limited, Indium Corporation, Kester, Alpha Assembly Solutions, Nihon Superior Co. Ltd., Heraeus Holding GmbH, AIM Metals & Alloys LP, Qualitek International Inc., FCT Assembly Inc., Tamura Corporation, DUKSAN Hi-Metal Co. Ltd., Balver Zinn Josef Jost GmbH & Co. KG, MG Chemicals Ltd., Nihon Handa Denki Co. Ltd., Nihon Genma Manufacturing Co. Ltd., Nihon Almit Co. Ltd., Yashida Corporation, Tongfang Tech Co. Ltd., Shenzhen Bright Technology Development Co. Ltd., Shenzhen Jufeng Solder Co. Ltd.

Asia-Pacific was the largest region in the solder materials market share in 2025. North America was the second-largest region in the solder materials market. The regions covered in the solder materials market are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the solder materials market are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The solder materials market consists of sales of lead-based and lead-free solder materials. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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