The rf interconnect market size has grown strongly in recent years. It will grow from $29.7 billion in 2023 to $32.39 billion in 2024 at a compound annual growth rate (CAGR) of 9.1%. The growth observed in the historic period can be attributed to factors such as the increased adoption of smart devices, the expansion of the Internet of Things (IoT), trends in miniaturization and integration, the globalization of supply chains, and the escalating demand for data transfer capabilities. These factors collectively contributed to the development and utilization of RF interconnect solutions during the historic period.
The rf interconnect market size is expected to see strong growth in the next few years. It will grow to $45.31 billion in 2028 at a compound annual growth rate (CAGR) of 8.8%. The anticipated growth in the forecast period can be attributed to factors such as the expansion of 5G networks, the emergence of new communication standards, rapid growth in edge computing, increasing connectivity in the automotive sector, and the continued growth of the Internet of Things (IoT). Major trends expected in the forecast period include an increasing demand for high-frequency applications, trends towards miniaturization and high-density interconnects, advancements in material technologies, the rise of 5G technology, and an emphasis on signal integrity and reliability in RF interconnect solutions.
The growth of the RF interconnect market is significantly fueled by the increasing demand in the telecommunications sector. Telecommunications involves electronically transmitting data over long distances, encompassing voice calls, data, text, photos, and videos. RF interconnect systems play a crucial role in telecommunication companies by facilitating the transmission and reception of high-speed digital signals for sensitive sensor modules. In 2021, according to Telecom Review Africa, there were 61.4 million active mobile subscribers as of December 31, 2020, reflecting a 2.6% increase from the previous quarter. This resulted in a 3.3% point rise in mobile (SIM) penetration to 129.1% during the assessment period. The escalating demand for RF cable assemblies in telecommunications underscores the driving force behind the RF interconnect market.
The anticipated increase in the number of IoT devices is poised to drive the demand for the RF interconnect market in the foreseeable future. IoT devices, embedded with sensors, software, and connectivity features, enable data collection and exchange over the Internet. The proliferation of IoT devices across industries, including smart homes, industrial automation, and healthcare, creates opportunities for RF interconnect providers to deliver solutions for seamless wireless connectivity and data transfer. McKinsey & Company projects the global number of IoT-connected devices to reach 43 billion by 2023, a nearly threefold increase from 2018. DataProt forecasts that active IoT devices will exceed 25.4 billion by 2030, with 152,200 IoT devices connecting to the internet per minute by 2025. The rising number of IoT devices is expected to act as a driving factor for the RF interconnect market.
A key trend gaining traction in the RF interconnect market is product innovation. Major companies in the market are concentrating on developing RF reconnect cables that withstand extreme environments, catering to applications in the defense and aerospace industry. For example, in December 2022, Amphenol RF, a US-based manufacturer of RF interconnect products, introduced high-performance SMA and N-Type configurations for cable mount RF interconnect, specifically designed for low-loss LMR cable types. These innovations feature a black coating suitable for high-demand applications, providing enhanced insulation for superior RF shielding in outdoor settings, with a UV-resistant coating for extended life expectancy.
Innovations in technology, such as thin film process technology, stand out as a significant advancement in sustaining the position of major companies in the RF interconnect market. Thin film process technology involves depositing and patterning extremely thin layers of materials onto a substrate, commonly used in semiconductor and electronic device manufacturing. For instance, in June 2022, Smiths Interconnect, a UK-based leader in advanced electronic components, launched the Planar X Series of thin film bandpass filters designed for harsh environments. Leveraging thin film process technology on various substrates, this series provides high performance in X-, Ku-, and Ka-Bands, catering to mission-critical applications such as radar, satcom, and satellite industries.
In March 2022, RF Industries, a US-based fiber optic cable manufacturing company, acquired Microlab/FXR LLC (Microlab) from the Wireless Telecom Group, Inc. for an undisclosed amount. This strategic acquisition positions RF Industries in the small cell and distributed antenna systems (DAS) markets, integrating Microlab's expertise. Microlab/FXR LLC is a US-based manufacturer of RF interconnect components.
Major companies operating in the rf interconnect market report are Amphenol Corporation, Cobham Advanced Electronic Solutions, Corning Incorporated, Delta Electronics Inc., DigiLens Inc., Ducommun Incorporated, ETL Systems Limited, Flann Microwave Limited, HUBER + SUHNER AG, Jupiter Microwave Components Inc., Penn Engineering & Manufacturing Corporation, Quantic Electronics Inc., Radiall S.A., Samtec Inc., Smiths Interconnect Inc., W. L. Gore & Associates Inc., Laird Technologies Inc., L-Com Inc., Molex LLC, MURATA MANUFACTURING CO. LTD., NXP Semiconductors N.V., Omni Spectra Inc., Pasternack Enterprises Inc., RF Specialties Inc., Spectrum Control, SPINNER GmbH, US Microwave, VIKING INDUSTRIES PVT. LTD., Bel Fuse Inc., Hirose Electric Co. Ltd.
Asia-Pacific was the largest region in the RF interconnect market in 2023. North America is expected to be the fastest-growing region in the RF interconnect market report during the forecast period. The regions covered in the rf interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the rf interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The main types of RF interconnect include RF cable, RF cable assembly, RF coaxial adapter, and RF connector. RF cable refers to a coaxial cable primarily used for transmitting TV channels from an antenna or cable company. These interconnect components operate across various frequency ranges, including up to 6 GHz, up to 50 GHz, and above 50 GHz. They are utilized by diverse end-users such as those in construction, aerospace and defense, oil and gas, IT and telecommunication, consumer electronics, power transmission and distribution, manufacturing, and automotive industries.
The RF interconnect market research report is one of a series of new reports that provides RF interconnect market statistics, including RF interconnect industry global market size, regional shares, competitors with an RF interconnect market share, detailed RF interconnect market segments, market trends, and opportunities, and any further data you may need to thrive in the RF interconnect industry. This RF interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
The rf interconnect market size is expected to see strong growth in the next few years. It will grow to $45.31 billion in 2028 at a compound annual growth rate (CAGR) of 8.8%. The anticipated growth in the forecast period can be attributed to factors such as the expansion of 5G networks, the emergence of new communication standards, rapid growth in edge computing, increasing connectivity in the automotive sector, and the continued growth of the Internet of Things (IoT). Major trends expected in the forecast period include an increasing demand for high-frequency applications, trends towards miniaturization and high-density interconnects, advancements in material technologies, the rise of 5G technology, and an emphasis on signal integrity and reliability in RF interconnect solutions.
The growth of the RF interconnect market is significantly fueled by the increasing demand in the telecommunications sector. Telecommunications involves electronically transmitting data over long distances, encompassing voice calls, data, text, photos, and videos. RF interconnect systems play a crucial role in telecommunication companies by facilitating the transmission and reception of high-speed digital signals for sensitive sensor modules. In 2021, according to Telecom Review Africa, there were 61.4 million active mobile subscribers as of December 31, 2020, reflecting a 2.6% increase from the previous quarter. This resulted in a 3.3% point rise in mobile (SIM) penetration to 129.1% during the assessment period. The escalating demand for RF cable assemblies in telecommunications underscores the driving force behind the RF interconnect market.
The anticipated increase in the number of IoT devices is poised to drive the demand for the RF interconnect market in the foreseeable future. IoT devices, embedded with sensors, software, and connectivity features, enable data collection and exchange over the Internet. The proliferation of IoT devices across industries, including smart homes, industrial automation, and healthcare, creates opportunities for RF interconnect providers to deliver solutions for seamless wireless connectivity and data transfer. McKinsey & Company projects the global number of IoT-connected devices to reach 43 billion by 2023, a nearly threefold increase from 2018. DataProt forecasts that active IoT devices will exceed 25.4 billion by 2030, with 152,200 IoT devices connecting to the internet per minute by 2025. The rising number of IoT devices is expected to act as a driving factor for the RF interconnect market.
A key trend gaining traction in the RF interconnect market is product innovation. Major companies in the market are concentrating on developing RF reconnect cables that withstand extreme environments, catering to applications in the defense and aerospace industry. For example, in December 2022, Amphenol RF, a US-based manufacturer of RF interconnect products, introduced high-performance SMA and N-Type configurations for cable mount RF interconnect, specifically designed for low-loss LMR cable types. These innovations feature a black coating suitable for high-demand applications, providing enhanced insulation for superior RF shielding in outdoor settings, with a UV-resistant coating for extended life expectancy.
Innovations in technology, such as thin film process technology, stand out as a significant advancement in sustaining the position of major companies in the RF interconnect market. Thin film process technology involves depositing and patterning extremely thin layers of materials onto a substrate, commonly used in semiconductor and electronic device manufacturing. For instance, in June 2022, Smiths Interconnect, a UK-based leader in advanced electronic components, launched the Planar X Series of thin film bandpass filters designed for harsh environments. Leveraging thin film process technology on various substrates, this series provides high performance in X-, Ku-, and Ka-Bands, catering to mission-critical applications such as radar, satcom, and satellite industries.
In March 2022, RF Industries, a US-based fiber optic cable manufacturing company, acquired Microlab/FXR LLC (Microlab) from the Wireless Telecom Group, Inc. for an undisclosed amount. This strategic acquisition positions RF Industries in the small cell and distributed antenna systems (DAS) markets, integrating Microlab's expertise. Microlab/FXR LLC is a US-based manufacturer of RF interconnect components.
Major companies operating in the rf interconnect market report are Amphenol Corporation, Cobham Advanced Electronic Solutions, Corning Incorporated, Delta Electronics Inc., DigiLens Inc., Ducommun Incorporated, ETL Systems Limited, Flann Microwave Limited, HUBER + SUHNER AG, Jupiter Microwave Components Inc., Penn Engineering & Manufacturing Corporation, Quantic Electronics Inc., Radiall S.A., Samtec Inc., Smiths Interconnect Inc., W. L. Gore & Associates Inc., Laird Technologies Inc., L-Com Inc., Molex LLC, MURATA MANUFACTURING CO. LTD., NXP Semiconductors N.V., Omni Spectra Inc., Pasternack Enterprises Inc., RF Specialties Inc., Spectrum Control, SPINNER GmbH, US Microwave, VIKING INDUSTRIES PVT. LTD., Bel Fuse Inc., Hirose Electric Co. Ltd.
Asia-Pacific was the largest region in the RF interconnect market in 2023. North America is expected to be the fastest-growing region in the RF interconnect market report during the forecast period. The regions covered in the rf interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the rf interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The main types of RF interconnect include RF cable, RF cable assembly, RF coaxial adapter, and RF connector. RF cable refers to a coaxial cable primarily used for transmitting TV channels from an antenna or cable company. These interconnect components operate across various frequency ranges, including up to 6 GHz, up to 50 GHz, and above 50 GHz. They are utilized by diverse end-users such as those in construction, aerospace and defense, oil and gas, IT and telecommunication, consumer electronics, power transmission and distribution, manufacturing, and automotive industries.
The RF interconnect market research report is one of a series of new reports that provides RF interconnect market statistics, including RF interconnect industry global market size, regional shares, competitors with an RF interconnect market share, detailed RF interconnect market segments, market trends, and opportunities, and any further data you may need to thrive in the RF interconnect industry. This RF interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
1. Executive Summary2. RF Interconnect Market Characteristics3. RF Interconnect Market Trends and Strategies31. Global RF Interconnect Market Competitive Benchmarking32. Global RF Interconnect Market Competitive Dashboard33. Key Mergers and Acquisitions in the RF Interconnect Market
4. RF Interconnect Market - Macro Economic Scenario
5. Global RF Interconnect Market Size and Growth
6. RF Interconnect Market Segmentation
7. RF Interconnect Market Regional and Country Analysis
8. Asia-Pacific RF Interconnect Market
9. China RF Interconnect Market
10. India RF Interconnect Market
11. Japan RF Interconnect Market
12. Australia RF Interconnect Market
13. Indonesia RF Interconnect Market
14. South Korea RF Interconnect Market
15. Western Europe RF Interconnect Market
16. UK RF Interconnect Market
17. Germany RF Interconnect Market
18. France RF Interconnect Market
19. Italy RF Interconnect Market
20. Spain RF Interconnect Market
21. Eastern Europe RF Interconnect Market
22. Russia RF Interconnect Market
23. North America RF Interconnect Market
24. USA RF Interconnect Market
25. Canada RF Interconnect Market
26. South America RF Interconnect Market
27. Brazil RF Interconnect Market
28. Middle East RF Interconnect Market
29. Africa RF Interconnect Market
30. RF Interconnect Market Competitive Landscape and Company Profiles
34. RF Interconnect Market Future Outlook and Potential Analysis
35. Appendix
Executive Summary
RF Interconnect Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on rf interconnect market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for rf interconnect? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? This rf interconnect market global report answers all of these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
Scope
Markets Covered:1) By Type: RF Cable; RF Cable Assembly; RF Coaxial Adapter; RF Connector
2) By Frequency: Up to 6GHz; Up to 50 GHz; Above 50 GHz
3) By End-User: Construction; Aerospace and Défense; Oil and Gas; IT and Telecommunication; Consumer Electronics; Power Transmission and Distribution; Manufacturing; Automotive
Companies Mentioned: Amphenol Corporation; Cobham Advanced Electronic Solutions; Corning Incorporated; Delta Electronics Inc.; DigiLens Inc.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery format: PDF, Word and Excel Data Dashboard.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amphenol Corporation
- Cobham Advanced Electronic Solutions
- Corning Incorporated
- Delta Electronics Inc.
- DigiLens Inc.
- Ducommun Incorporated
- ETL Systems Limited
- Flann Microwave Limited
- HUBER + SUHNER AG
- Jupiter Microwave Components Inc.
- Penn Engineering & Manufacturing Corporation
- Quantic Electronics Inc.
- Radiall S.A.
- Samtec Inc.
- Smiths Interconnect Inc.
- W. L. Gore & Associates Inc.
- Laird Technologies Inc.
- L-Com Inc.
- Molex LLC
- MURATA MANUFACTURING CO. LTD.
- NXP Semiconductors N.V.
- Omni Spectra Inc.
- Pasternack Enterprises Inc.
- RF Specialties Inc.
- Spectrum Control
- SPINNER GmbH
- US Microwave
- VIKING INDUSTRIES PVT. LTD.
- Bel Fuse Inc.
- Hirose Electric Co. Ltd.
Methodology
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