A comprehensive and practical reference complete with hands-on exercises and experimental data
In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.
Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.
This important book also includes: - Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips - Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization - Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization - In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting
Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Table of Contents
Preface v
About the Authors vii
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.3 Chip Mounting and Interconnection 20
2.4 Phosphor Coating and Dispensing Process 38
2.5 Encapsulation and Molding Process 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies forWafer Level Packaging 66
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.5 Processes of LED Wafer Level Packaging 96
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.2 Power Supply and Efficiency 159
5.3 Consideration of LED Thermal Performance 163
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.2 Failure Analysis and Life Assessment 181
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.2 Micro- and Mini-LED Display 194
7.3 LED for Visible Light Communication 203
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV-LED 213
8.2 Applications of IR-LEDs 225
8.3 Future Outlook and Other Technology Trends 233
References 235
Index 243
