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Epitaxial Wafer Market - Forecasts from 2023 to 2028

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    Report

  • 133 Pages
  • July 2023
  • Region: Global
  • Knowledge Sourcing Intelligence LLP
  • ID: 5853213

The epitaxial wafer market is estimated to grow at a CAGR of 10.41% during the forecast period.

The epitaxial wafer market is projected to grow strongly during the forecast period. It encompasses the production and distribution of epitaxial wafers, which serve as single-crystal semiconductor substrates crucial for the manufacturing of electronic devices. These wafers hold substantial importance within the semiconductor industry as they facilitate the creation of integrated circuits, optoelectronic devices, and power devices. The market caters to various sectors, including semiconductor manufacturing, optoelectronics, and power electronics. Epitaxial wafers find applications in the fabrication of integrated circuits, light-emitting diodes (LEDs), laser diodes, and power devices. These devices are utilized in a diverse range of industries, such as electronics, lighting, communications, and power management.

Market Competitiveness:

The epitaxial wafer market is highly competitive, with several key players vying for market share. AIXTRON SE, Applied Materials, Inc., ASM International, and Tokyo Electron Limited are prominent epitaxial wafer manufacturers leading the industry with advanced semiconductor equipment and technology. These companies specialize in producing high-quality epitaxial wafers used in various applications, including power electronics, photonics, and microelectronics. These companies have captured a significant portion of the epi wafer market share. Their strong market presence is a testament to their continuous innovation and ability to meet the evolving demands of customers worldwide.

The epitaxial wafer market has witnessed significant growth in recent years due to the increasing demand for semiconductors in various applications. The market size is determined by the total revenue generated from the sale of epitaxial wafers. Factors such as the rising adoption of power electronics, optoelectronics, and wireless communication devices contribute to the expanding market size. Additionally, the market size is influenced by advancements in manufacturing processes, economies of scale, and the overall growth of the semiconductor industry.

Market Drivers:

  • The growing importance of optoelectronic devices- The increasing significance of optoelectronic devices is a notable driver for the epitaxial wafer market. Optoelectronics, which encompasses devices such as LEDs, laser diodes, and photodetectors, has found wide-ranging applications in various industries. Epitaxial wafers play a critical role in the fabrication of high-quality optoelectronic devices. They are essential for the growth of semiconductor layers in LEDs, laser diodes, and photodetectors. They enable the precise formation of semiconductor materials, ensuring optimal performance in light emission efficiency, high-power laser output, and high sensitivity in photodetectors. The increasing adoption of energy-efficient lighting solutions, expanding applications of laser diodes in telecommunications and healthcare, and the demand for high-performance photodetectors in various sectors drive the growing need for epitaxial wafers.
  • Emergence of wide bandgap materials - The emergence and adoption of wide bandgap materials, such as silicon carbide (SiC) and gallium nitride (GaN), are significant drivers in the epitaxial wafer market. Wide bandgap materials possess superior material properties compared to traditional silicon, making them ideal for power electronics and high-frequency applications. SiC wafers offer high breakdown voltage, thermal conductivity, and temperature operation, making them ideal for electric vehicles, renewable energy systems, and industrial power management. Similarly, GaN wafers provide high electron mobility and breakdown voltage, enabling efficient and high-frequency power devices in various sectors, such as power supplies, wireless communications, and automotive electronics. The industry's demand for high-performance devices with enhanced power efficiency and superior electrical characteristics is fueling the growth of epitaxial wafers tailored for wide bandgap materials.

Challenges to market growth.

The production of epitaxial wafers involves intricate processes and requires expensive equipment, resulting in elevated manufacturing costs. Consequently, their adoption may be hindered, particularly within price-sensitive markets. Additionally, the limited supply of epitaxial wafers due to specialized facilities and expertise poses a challenge. Furthermore, the market encounters technological hurdles in developing advanced epitaxial growth techniques and materials, necessitating ongoing research and development efforts.

The heteroepitaxy segment will witness robust growth.

The heteroepitaxial wafer market growth is influenced by the demand and trends of epitaxial wafers made on substrates with different crystal structures. Heteroepitaxy is crucial for manufacturing advanced semiconductor devices, driving the market's growth. These wafers find applications in various fields, including telecommunications, consumer electronics, automotive, and healthcare. Advancements in materials and manufacturing techniques are enhancing the quality and performance of heteroepitaxial wafers. Innovations in deposition methods like molecular beam epitaxy and metalorganic chemical vapor deposition enable high-quality wafer production at larger scales.

Research and development investments contribute to further innovation and expanding capabilities. Challenges faced include high production costs, process complexity, and the need for stringent quality control measures. Overcoming these challenges presents opportunities to develop cost-effective manufacturing techniques, improve process efficiency, and expand material options.

Regional Insights:

Based on geography, the epitaxial wafer market is segmented into North America, South America, Europe, Middle East and Africa, and Asia Pacific. North America is a key region in the epitaxial wafer market. The market growth is driven by the presence of leading semiconductor manufacturers, advanced communication infrastructure, and growing demand from sectors such as telecommunications, automotive, and aerospace. The region's emphasis on research and development, investments in semiconductor manufacturing, and focus on sustainability contribute to its strong position in the market.

Asia Pacific has a prominent epitaxial wafer market share.

Attributed to the robust semiconductor industry and increasing adoption of advanced technologies across various sectors. The thriving consumer electronics market, rapid industrialization, and government initiatives to promote semiconductor manufacturing further fuel the demand for epitaxial wafers in Asia Pacific. Additionally, the emergence of 5G technology and the expansion of electric vehicles in the region are key drivers propelling the market forward.

According to the International Energy Agency (IEA), China's EV market has seen remarkable growth in recent years. In 2021 alone, 2,734 BEVs and 600 PHEVs were registered, reflecting the country's commitment to sustainable transportation. Factors such as government incentives, technological advancements, and growing environmental awareness have contributed to this expansion. China has emerged as a leading market for electric vehicles, with a significant increase in registrations over the past few years.

Market Developments:

  • In March 2022, Showa Denko K.K. (SDK) started mass production of 6-inch silicon carbide single crystal wafers (SiC wafers), which are used as materials for SiC epitaxial wafers in power semiconductors. SDK aims to improve the quality and establish a stable supply system by producing SiC wafers in-house while continuing to purchase from partners.
  • In March 2023, DENSO Corporation chose Resonac Corporation's silicon carbide epitaxial wafer (SiC epi-wafer) as the material for the driver element of its new inverter, which will be installed in Toyota's upcoming BEV model, LEXUS RZ. Resonac's SiC epi-wafer has gained recognition for its high quality and low defect density, making it a favorable choice for high-quality inverter devices. The adoption of SiC-based inverters in the LEXUS RZ enhances the vehicle's energy efficiency and extends its driving range.
  • In March 2023, SweGaN, a compound semiconductor manufacturer based in Europe, revealed its intentions to build a fresh corporate base and a semiconductor production center with extensive capacity in Linköping, Sweden. The establishment, situated at the Innovative Materials Arena, aims to manufacture high quantities of next-generation engineered epitaxial wafers using GaN-on-SiC technology. With a planned completion by the end of Q2, the facility is expected to have a production capacity of up to 40,000 epiwafers per year.
  • In September 2022, AIXTRON SE launched the G10-SiC 200 mm system for high-volume manufacturing of Silicon Carbide (SiC) power devices. The system offers a flexible dual wafer size configuration of 9x150 mm and 6x200 mm, facilitating the transition from 150 mm to 200 mm wafer diameter. With high growth rate process capabilities and automated wafer loading, the G10-SiC provides excellent wafer throughput and low defect counts. The system's epitaxial layer uniformity and high throughput contribute to the cost-effective production of SiC wafers for power electronics applications.

Market Segmentation:

BY TYPE

  • Heteroepitaxy
  • Homoepitaxy

BY WAFER SIZE

  • 2-4 Inch
  • 5-8 Inch
  • 9-12 Inch
  • Others

BY APPLICATION

  • LED
  • Power Semiconductors
  • MEMS-Based Devices
  • Others

BY INDUSTRY VERTICAL

  • Consumer Electronics
  • Automotive
  • Healthcare
  • Manufacturing
  • Others

BY GEOGRAPHY

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East And Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Indonesia
  • Taiwan
  • Others

Table of Contents

1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Market Segmentation
1.5. Currency
1.6. Assumptions
1.7. Base, and Forecast Years Timeline
2. RESEARCH METHODOLOGY
2.1. Research Data
2.2. Research Process
3. EXECUTIVE SUMMARY
3.1. Research Highlights
4. MARKET DYNAMICS
4.1. Market Drivers
4.2. Market Restraints
4.3. Porter’s Five Force Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis
5. EPITAXIAL WAFER MARKET BY TYPE
5.1. Introduction
5.2. Heteroepitaxy
5.3. Homoepitaxy
6. EPITAXIAL WAFER MARKET BY WAFER SIZE
6.1. Introduction
6.2. 2-4 Inch
6.3. 5-8 Inch
6.4. 9-12 Inch
6.5. Others
7. EPITAXIAL WAFER MARKET BY APPLICATION
7.1. Introduction
7.2. LEDs
7.3. Power Semiconductors
7.4. MEMS-Based Devices
7.5. Others
8. EPITAXIAL WAFER MARKET BY INDUSTRY VERTICAL
8.1. Introduction
8.2. Consumer Electronics
8.3. Automotive
8.4. Healthcare
8.5. Maufacturing
8.6. Others
9. EPITAXIAL WAFER MARKET BY GEOGRAPHY
9.1. Introduction
9.2. North America
9.2.1. USA
9.2.2. Canada
9.2.3. Mexico
9.3. South America
9.3.1. Brazil
9.3.2. Argentina
9.3.3. Others
9.4. Europe
9.4.1. Germany
9.4.2. France
9.4.3. United Kingdom
9.4.4. Spain
9.4.5. Others
9.5. Middle East And Africa
9.5.1. Saudi Arabia
9.5.2. UAE
9.5.3. Israel
9.5.4. Others
9.6. Asia Pacific
9.6.1. China
9.6.2. Japan
9.6.3. India
9.6.4. South Korea
9.6.5. Indonesia
9.6.6. Taiwan
9.6.7. Others
10. COMPETITIVE ENVIRONMENT AND ANALYSIS
10.1. Major Players and Strategy Analysis
10.2. Emerging Players and Market Lucrativeness
10.3. Mergers, Acquisitions, Agreements, and Collaborations
10.4. Vendor Competitiveness Matrix
11. COMPANY PROFILES
11.1. AIXTRON SE
11.2. Applied Materials, Inc
11.3. ASM International
11.4. CVD Equipment Corporation
11.5. Kokusai Semiconductor Equipment Corporation (KSEC)
11.6. Lam Research Corporation
11.7. Tokyo Electron Limited
11.8. ULVAC, Inc
11.9. Veeco Instruments Inc.

Companies Mentioned

  • AIXTRON SE
  • Applied Materials, Inc
  • ASM International
  • CVD Equipment Corporation
  • Kokusai Semiconductor Equipment Corporation (KSEC)
  • Lam Research Corporation
  • Tokyo Electron Limited
  • ULVAC, Inc
  • Veeco Instruments Inc.

Methodology

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