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High Temperature Polymer Dielectrics. Fundamentals and Applications in Power Equipment. Edition No. 1

  • Book

  • 400 Pages
  • December 2023
  • John Wiley and Sons Ltd
  • ID: 5863924
High Temperature Polymer Dielectrics

Overview on how to achieve polymer dielectrics at high temperatures, with emphasis on diverse applications in various electrical insulation fields

High Temperature Polymer Dielectrics: Fundamentals and Applications in Power Equipment systematically describes the latest research progress surrounding high-temperature polymer dielectric (HTPD) materials and their applications in electrical insulation fields such as high-temperature energy storage capacitors, motors, packaging, printed circuit board, new energy power equipment, and aerospace electrical equipment. The comprehensive text provides a description of the market demand and theoretical research value of HTPDs in electrical equipment and enables readers to improve the performance and design of existing HTPD materials, and to develop efficient new high temperature polymer dielectric materials in general.

Specific sample topics covered in High Temperature Polymer Dielectrics include: - Thermal and electrical properties of high-temperature polymers, and the excellent thermal stability, mechanical properties, and long service life of polymer dielectrics - Why fluorinated polymers are more thermally stable than their corresponding hydrogen-substituted polymers - Static Thermomechanical Analysis (TMA), a technique for measuring the functional relationship between the deformation of the materials and the temperature and time under different actions - Polyetheretherketone (PEEK), a semi-crystalline polymer material with ether bonds and ketone carbonyl groups in molecular chains

Providing a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances, High Temperature Polymer Dielectrics is an essential resource for materials scientists, electrical engineers, polymer chemists, physicists, and professionals working in the chemical industry as a whole.

Table of Contents

Preface xiii

1 Overview of High-Temperature Polymers 1
Xue-Jie Liu, Mengyu Xiao, Wenjie Huang, Xing Yang, and Jun-Wei Zha

1.1 Introduction 1

1.2 Development of High-Temperature Polymers 2

1.3 Parameters of Polymers with High Temperature Resistance 3

1.4 Thermal Analysis Technology 5

1.5 High-Temperature Polymer Materials 9

1.6 Summary and Outlook 14

2 Basic Principles of Dielectrics 21
Anastasios Chr. Patsidis and Georgios Chr. Psarras

2.1 Introduction 21

2.2 Definition of Dielectrics 21

2.3 Dipole Moment and Types of Dielectric Materials 22

2.4 Polarization and Dielectric Permittivity 23

2.5 Polarization Under Static Electric Field 24

2.6 Polarization Under Time Varying Electric Field 32

2.7 Conduction Phenomena in Dielectrics 38

2.8 Active Dielectrics 40

2.9 Polymers as Dielectric Materials 43

2.10 Thermal Properties of Dielectrics 47

2.11 Concluding Remarks 51

3 High-Temperature Energy Storage Polymer Dielectrics for Capacitors 57
Zongliang Xie, He Li, Zongren Peng, and Yi Liu

3.1 Introduction 57

3.2 Basic Parameters of High-Temperature Capacitor Materials 60

3.3 Randomly Dispersed Polymer/Inorganic Nanofiller Composites 69

3.4 Core@Shell-Structured Nanofillers for Polymer Composites 76

3.5 Layered Polymer Composites 80

3.6 Novel Polymers and All-Organic Polymer Composites 85

3.7 Conclusion and Perspective 94

4 Review on High-Temperature Polymers for Cable Insulation: State-of-the-Art and Future Developments 103
Youcef Kemari, Guillaume Belijar, Zarel Valdez-Nava, Frédéric Forget, and Sombel Diaham

4.1 Brief History of Cables Development and Insulating Materials 103

4.2 Technologies of Modern Power Cables 106

4.3 Review of the Most Relevant Electrical Characteristics of High Temperature Insulating Materials 125

4.4 Trends and Outlooks 140

5 High-Temperature Polymer-Based Dielectrics for Advanced Electronic Packaging 149
Jie Liu, Peng Li, Jianwei Zhao, and Shuhui Yu

5.1 Introduction 149

5.2 High-Temperature Polymer and Polymer-Based Dielectrics 160

5.3 Summary and Perspectives 172

6 High-Temperature Polymer Dielectrics for Printed Circuit Board 181
Xu Wang, Xinyu Chen, Junhui Luo, Xin Wang, Yan Chen, and Xiangyang Liu

6.1 Epoxy Resin Used for PCB 182

6.2 Phenolic Resins Used for PCB 188

6.3 Polyimide Used for PCB 197

6.4 Polymer Materials Used for PCB at High Frequency 206

7 High-Temperature Polymer Dielectrics for New Energy Power Equipment 227
Meng Xiao, Zhiyuan Zhang, Yuyan Chen, Xiaodan Du, and Boxue Du

7.1 Introduction 227

7.2 High-frequency Power Transformer and Dry-type Bushing 228

7.3 Modification of Polyimide 233

7.4 High-temperature Resistant Dielectric Material for Capacitor 239

7.5 High-temperature Resistant Dielectric Material for IGBT 250

7.6 Concluding Remarks 256

8 High-Temperature Polymer Dielectrics for Aerospace Electrical Equipment 269
Daomin Min, Xiaofan Song, Lingyu Yang, Yuanshuo Zhang, Shihang Wang, and Shengtao Li

8.1 Introduction 269

8.2 Challenges of Insulating Materials Under High Temperatures 272

8.3 High Temperature Resistant and Strong DC Insulating Polymer Dielectrics 280

8.4 High-temperature-Resistant Polymer Dielectrics with Strong Nonlinear Conductivity 288

8.5 High-Temperature-Resistant Polymer Dielectrics Under the Coupling of Electron Irradiation and High Voltage 295

8.6 High Temperature Resistant and High-Frequency Strong Insulating Polymer Dielectrics 300

9 Smart Polymer Dielectrics 313
Xiaoyan Huang, Lu Han, Zhiwen Huang, and Qi Li

9.1 Introduction 313

9.2 Self-Adaptive Dielectrics 315

9.3 Self-Reporting Dielectrics 324

9.4 Self-Healing Dielectrics 336

9.5 Outlook 352

10 The Future Development of High-temperature Polymer Dielectrics 365
Qi-Kun Feng, Yong-Xin Zhang, Xin-Jie Wang, and Zhi-Min Dang

10.1 Introduction 365

10.2 Present Development and Challenges 365

10.3 Future Perspectives and Trends 368

10.4 Summary 370

Acknowledgments 371

References 371

Index 375

Authors

Jun-Wei Zha University of Science and Technology Beijing, China. Zhi-Min Dang Tsinghua University, China.