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Smart Patches. Biosensors, Graphene, and Intra-Body Communications. Edition No. 1

  • Book

  • 384 Pages
  • August 2023
  • John Wiley and Sons Ltd
  • ID: 5867440

This book defines and elucidates the topic of smart "second skin" clothing, which must be flexible, washable, ironable, long-lasting and battery-free. We explore the possibilities for its use in fields such as health, well-being, sports and leisure.

Smart Patches presents techniques that can be used within the limits established by regulations (EMC, normative, GDPR, ANSES, etc.) to help make smart clothing a marketable product at an affordable price.

This book studies the creation and performance of various sensors and biosensors based on graphene materials and describes the functioning of Intra-Body Communications (IBC), as well as all the internal and external parameters involved in this type of technology. The performances and limits of these IBC and technologies are presented, together with concrete application examples.

Table of Contents

Foreword xi

Acknowledgements xiii

Preface xv

Introduction xix

Part 1 Smart Apparel, Smart Patches and Biosensors 1

Chapter 1 Smart Apparel, Smart Patches and the Related Constraints 3

1.1 Reminders and definitions 3

1.1.1 Main families of textiles 3

1.1.2 Apparel 11

1.2 The smart textile market from a consumer’s point of view 14

1.2.1 Purchase levers 14

1.2.2 Barriers to the purchase of smart apparel 14

1.2.3 Solutions to instill confidence 16

1.2.4 The hype curve for innovations 16

1.3 Constraints surrounding an SA project 20

1.3.1 Financial and marketing aspects 20

1.3.2 Ergonomic aspects 21

1.3.3 Technical aspects 22

1.3.4 Energy-related aspects 23

1.3.5 Industrial aspects 23

1.3.6 Regulatory aspects and recommendations 24

1.3.7 Normative aspects 42

1.3.8 Applicative aspects 45

Chapter 2 Biosensors and Graphene Technology 53

2.1 Introduction to sensors in smart apparel 54

2.1.1 Sensors frequently used in smart apparel 56

2.2 Sensors of "non-biological" physical properties 61

2.2.1 Types of detectors used in these sensors 62

2.2.2 Examples of sensors 62

2.3 Graphene 66

2.3.1 Carbon 66

2.3.2 Graphite 66

2.3.3 Graphene 67

2.3.4 Properties of graphene 69

2.3.5 The usefulness of graphene in smart apparel 72

2.4 Graphene and its secrets 73

2.4.1 Obtaining graphene 74

2.4.2 Graphene producers and suppliers 83

2.4.3 Market price 86

2.4.4 Research around graphene 87

2.4.5 Patents and intellectual property 92

2.5 "Bio" sensors 94

2.5.1 "Physical" sensors connected to bio materials, without analyte 94

2.5.2 "Bio" sensors (biosensors), with analyte 96

2.6 Applications of graphene in smart apparel 112

2.6.1 Biosensors and patches 112

2.6.2 Multisensors: multibiosensor patches 124

2.6.3 Beyond sensors and beyond "bio" 125

2.7 Conclusions on graphene in smart apparel 129

2.7.1 Benefits to the applicative constraints of smart apparel 129

2.7.2 Graphene-based biosensors in smart apparel 135

2.7.3 Critical points that must be examined at the very outset 136

Part 2 Biocontroller 137

Chapter 3 Bioprocessors 139

3.1 Overall structure: "AFE (Analog Front-End) + CPU (Central Processing Unit)" 140

3.1.1 "All-in-two" 141

3.1.2 "All-in-one" 141

3.2 The AFE 142

3.2.1 Functions of an AFE 142

3.2.2 The numerous possible types of AFE 142

3.3 The CPU 158

3.3.1 Signal processing 158

Chapter 4 Power to the Patch 167

4.1 Problems surrounding power supply to a patch 167

4.1.1 Choice of means of energy supply to a patch 167

4.1.2 Estimating a patch’s energy balance 168

4.1.3 Choice of battery, supercapacitor and energy harvesting 172

4.2 Energy harvesting 175

4.2.1 General 176

4.2.2 Existing technologies for smart apparel 187

4.3 Example of energy harvesting for smart apparel 189

4.3.1 Energy harvesting via an HF (high-frequency) NFC link 189

4.3.2 Examples of NFC patches with energy harvesting 196

Chapter 5 OBC (Out-of-Body Communications) and IBC (Intra-Body Communications) in Smart Apparel 199

5.1 Communications in smart apparel 200

5.1.1 OBC 200

5.1.2 IBC 201

5.1.3 Possible means of communication for patches 202

5.2 Connectivity and viability of OBC in smart apparel 204

5.2.1 Viability of OBC connection in smart apparel 204

5.3 From the RF-connected world to OBC in smart apparel 207

5.3.1 The absolute fundamentals of RF 208

5.3.2 Long- or short-range RF connectivity in smart apparel 209

5.3.3 Short range (SR) 211

5.3.4 Medium Range (MR) 213

5.3.5 Medium Range Wide Band (MRWB) (around 100 meters) 213

5.3.6 Long Range (LR) and Far-Field 214

5.4 Architecture of connected smart apparel chains 215

5.4.1 Technological description of the chain 216

5.4.2 Big Data 221

5.4.3 The numerous protocols used 222

5.5 OBC and IBC patch networks in smart apparel 222

5.5.1 The numerous terms in the x AN (x Area Network) family 223

5.5.2 RF x PAN (x Personal Area Network) 225

5.5.3 From the WPAN (Wireless Personal Area Network) to the WBAN (Wireless Body Area Network) 227

5.5.4 PAN and the IEEE 802.15 family 227

5.6 BAN 228

5.6.1 Definition of a BAN-IEEE 802.15.6 228

5.6.2 History of BANs 229

5.6.3 BANs in smart apparel 231

5.6.4 Physical layer of a BAN 236

5.6.5 MAC (Medium Access Control) layer 240

5.6.6 Fields of application for BANs 241

5.6.7 Main challenges in the design of BAN patches 244

5.7 IBC 245

5.7.1 From the BAN to IBC 245

5.7.2 Genesis of IBC 247

5.7.3 The major principles of IBC 252

5.8 Capacitive IBC system 265

5.8.1 Communication between two network elements 265

5.8.2 IBC and bodily non-radiation 269

5.8.3 Fundamental concept of IBC 272

5.9 Modeling of an IBC system 273

5.9.1 Model of an IBC system and channel analysis 274

5.9.2 Modeling of human-body communication channels 274

5.9.3 Electrical model of the medium 278

5.9.4 Electrical model of the channel 280

5.10 Simulations 283

5.11 Examples of smart apparel solutions using IBC 284

5.11.1 Example 1: for beginners 284

5.11.2 Example 2: for the initiated 290

Conclusion: Concrete Implementation of a Solution 295

Epilogue 315

Glossary 317

Authors 319

References 321

Index 327

Authors

Dominique Paret Philips Semiconductors, Paris, France. Pierre Crego Mercury Technologies. Pauline Solere ESIEE.