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Development Trends of Hybrid Bonding Technology and Applications in Semiconductors

  • Report

  • 10 Pages
  • August 2023
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5868594
As semiconductor chip components continue to shrink and circuit density increases, the size and spacing of signal interconnect electrodes are facing a constant demand for downsizing. This miniaturization trend poses even higher requirements for interconnect bonding technology in chip stacking. Currently, hybrid bonding stands out as the key technology that best meets these demands. This report examines the current development status of hybrid bonding technology, investigates its integration into various application chip packaging by industry players, and explores the future trends in technological advancements and applications.



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Table of Contents

1. Development of Hybrid Bonding Technology
1.1 The Demand for High-Density OSAT Drives the Development of Microbumps
1.2 An Introduction to Hybrid Bonding Technology
2.Case Studies of Hybrid Bonding Applications
2.1 Sony
2.2 AMD
2.3 Intel
3. Analyst's Perspective
Appendix
List of Companies
List of Figures
Figure 1 Development of Block Size and I/O Count
Figure 2 Introduction to Hybrid Bonding Process
Figure 3 Sony's CIS (Complementary Metal-Oxide-Semiconductor Image Sensor) Using Hybrid Bonding to Join the Upper Pixel Chip and Lower Logic Chip
Figure 4: AMD RyzenTM 7 5800X3D CPU Utilizing Hybrid Bonding to Combine L3 Cache with Lower CCD
Figure 5 Evolution of Intel's Foveros Technology

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • AMD
  • IMEC
  • Intel
  • Samsung
  • Sony
  • TSMC
  • Ziptronix

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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