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Global High-Density Interconnect (HDI) PCB Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications), By Application, By Regional Outlook and Forecast, 2023 - 2030

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    Report

  • 215 Pages
  • July 2023
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5868939
Description Jump to:
The Global High-Density Interconnect (HDI) PCB Market size is expected to reach $26.9 billion by 2030, rising at a market growth of 10.9% CAGR during the forecast period.
HDI PCBs have been used more frequently in the automotive sector because they can operate more effectively with less weight. Automobiles are advancing in connectivity and computerization, just like the rest of society. Therefore, the Automotive segment will acquire 2/5th share of the market by 2030, due to the rising trend toward advanced safety systems, autonomous driving, and the miniaturization of electrical devices in the automotive industry. The diagnostics, engine controls, safety features, and other conveniences in modern automobiles are handled by the 50 or so microprocessors that are present on board. Some of the factors impacting the market are increasing need for size reduction and weight reduction, accelerating demand growth for consumer electronics and exorbitantly high costs associated with construction of HDIs.



The need for smaller, quicker products has prompted changes in printed circuit board technology. Compact HDI boards have fewer vias, pads, gaps, and copper traces. HDIs have denser wiring; as a result, PCBs are lighter, more compact, and have fewer layers. One HDI board can replace multiple PCBs in a device, eliminating the need for additional boards. With HDI PCBs, additional components can be accommodated on each side of the PCB, enhancing both its functioning and the capabilities of the goods or machinery into which it is included. Along with having a high level of capability, HDI boards are also smaller and lighter than conventional PCBs. Additionally, Consumer electronics sector is being driven forward by consumer demand for products that are more durable, faster, lighter, and less priced. Electronics used for entertainment are referred to as consumer electronics, and examples include TVs, radios, video players, PCs, iPads, as well as tablets, and smartphones. Thus, the market is anticipated to expand over the course of the forecast period due to the growing demand for consumer electronics devices with greater power performance and rising demand as well as the production of these devices.

However, HDI PCBs are renowned for their sophisticated routing and high component density placement. Higher production costs may result from the need for more sophisticated manufacturing techniques and technologies as design complexity rises. Laser direct imaging (LDI), among other specialized techniques, is needed for the production of HDI PCBs. This technique is applied at the fabrication stage since HDI calls for the creation of precise lines on the boards. The complexity and precision of the manufacturing process are increased by implementing these cutting-edge technologies, which raises the cost. These variables drive up the price of HDI PCBs, which in turn limits the expansion of the market.

Application Outlook

On the basis of application, the market is classified into smartphone & tablet, PC & laptop, smart wearables, and others. The smartphone and tablet segment acquired the largest revenue share in the market in 2022. Consumers are drawn to smartphones and tablets with the most recent technology improvements, like quicker processors, better cameras, better displays, and longer battery life. Users are driven to upgrade to the newest and most sophisticated devices by the ongoing advancement of technology.



End-user Outlook

Based on end user, the market is characterized by consumer electronics, automotive, industrial electronics, IT & telecommunications, and others. The automotive segment procured a considerable growth rate in the market in 2022. With HDI PCBs, manufacturers may create devices with greater functionality in a smaller footprint and at a lower weight. The lower weight can result in more effective functioning, which is notably important in the automobile and aircraft industries. Because of their greater functionality, enhanced performance, increased dependability, and optimum space use, HDIs are becoming increasingly popular for use in contemporary vehicle electronics.


Regional Outlook

Region wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment witnessed the maximum revenue share in the market in 2022. The expansion of the regional market is attributable to the growing use of HDI in the automotive, consumer electronics, and healthcare sectors in nations like China, India, and South Korea. As Western nations' demand for Asian consumer electronics has skyrocketed, the market has grown even more. The region's growing disposable income has also led to a growth in the use of household appliances, which is predicted to enhance the regional market throughout the course of the projection period.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.

Scope of the Study

By End-user

  • Consumer Electronics
  • Automotive
  • Industrial Electronics
  • IT & Telecommunications
  • Others

By Application

  • Smartphone & Tablet
  • PC & Laptop
  • Smart Wearables
  • Others

By Geography

  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • MEIKO ELECTRONICS CO., LTD.
  • DAP CORPORATION
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Unitech Printed Circuit Board Corp.
  • FICT LIMITED (Fujitsu Limited)
  • TTM Technologies, Inc.
  • UNIMICRON TECHNOLOGY CORP.
  • NCAB Group AB
  • Ibiden Co., Ltd.
  • Sierra Circuits, Inc.

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global High-Density Interconnect (HDI) PCB Market, by End User
1.4.2 Global High-Density Interconnect (HDI) PCB Market, by Application
1.4.3 Global High-Density Interconnect (HDI) PCB Market, by Geography
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis
Chapter 4. Global High-Density Interconnect (HDI) PCB Market by End User
4.1 Global Consumer Electronics Market by Region
4.2 Global Automotive Market by Region
4.3 Global Industrial Electronics Market by Region
4.4 Global IT & Telecommunications Market by Region
4.5 Global Others Market by Region
Chapter 5. Global High-Density Interconnect (HDI) PCB Market by Application
5.1 Global Smartphone & Tablet Market by Region
5.2 Global PC & Laptop Market by Region
5.3 Global Smart Wearables Market by Region
5.4 Global Others Market by Region
Chapter 6. Global High-Density Interconnect (HDI) PCB Market by Region
6.1 North America High-Density Interconnect (HDI) PCB Market
6.1.1 North America High-Density Interconnect (HDI) PCB Market by End User
6.1.1.1 North America Consumer Electronics Market by Country
6.1.1.2 North America Automotive Market by Country
6.1.1.3 North America Industrial Electronics Market by Country
6.1.1.4 North America IT & Telecommunications Market by Country
6.1.1.5 North America Others Market by Country
6.1.2 North America High-Density Interconnect (HDI) PCB Market by Application
6.1.2.1 North America Smartphone & Tablet Market by Country
6.1.2.2 North America PC & Laptop Market by Country
6.1.2.3 North America Smart Wearables Market by Country
6.1.2.4 North America Others Market by Country
6.1.3 North America High-Density Interconnect (HDI) PCB Market by Country
6.1.3.1 US High-Density Interconnect (HDI) PCB Market
6.1.3.1.1 US High-Density Interconnect (HDI) PCB Market by End User
6.1.3.1.2 US High-Density Interconnect (HDI) PCB Market by Application
6.1.3.2 Canada High-Density Interconnect (HDI) PCB Market
6.1.3.2.1 Canada High-Density Interconnect (HDI) PCB Market by End User
6.1.3.2.2 Canada High-Density Interconnect (HDI) PCB Market by Application
6.1.3.3 Mexico High-Density Interconnect (HDI) PCB Market
6.1.3.3.1 Mexico High-Density Interconnect (HDI) PCB Market by End User
6.1.3.3.2 Mexico High-Density Interconnect (HDI) PCB Market by Application
6.1.3.4 Rest of North America High-Density Interconnect (HDI) PCB Market
6.1.3.4.1 Rest of North America High-Density Interconnect (HDI) PCB Market by End User
6.1.3.4.2 Rest of North America High-Density Interconnect (HDI) PCB Market by Application
6.2 Europe High-Density Interconnect (HDI) PCB Market
6.2.1 Europe High-Density Interconnect (HDI) PCB Market by End User
6.2.1.1 Europe Consumer Electronics Market by Country
6.2.1.2 Europe Automotive Market by Country
6.2.1.3 Europe Industrial Electronics Market by Country
6.2.1.4 Europe IT & Telecommunications Market by Country
6.2.1.5 Europe Others Market by Country
6.2.2 Europe High-Density Interconnect (HDI) PCB Market by Application
6.2.2.1 Europe Smartphone & Tablet Market by Country
6.2.2.2 Europe PC & Laptop Market by Country
6.2.2.3 Europe Smart Wearables Market by Country
6.2.2.4 Europe Others Market by Country
6.2.3 Europe High-Density Interconnect (HDI) PCB Market by Country
6.2.3.1 Germany High-Density Interconnect (HDI) PCB Market
6.2.3.1.1 Germany High-Density Interconnect (HDI) PCB Market by End User
6.2.3.1.2 Germany High-Density Interconnect (HDI) PCB Market by Application
6.2.3.2 UK High-Density Interconnect (HDI) PCB Market
6.2.3.2.1 UK High-Density Interconnect (HDI) PCB Market by End User
6.2.3.2.2 UK High-Density Interconnect (HDI) PCB Market by Application
6.2.3.3 France High-Density Interconnect (HDI) PCB Market
6.2.3.3.1 France High-Density Interconnect (HDI) PCB Market by End User
6.2.3.3.2 France High-Density Interconnect (HDI) PCB Market by Application
6.2.3.4 Russia High-Density Interconnect (HDI) PCB Market
6.2.3.4.1 Russia High-Density Interconnect (HDI) PCB Market by End User
6.2.3.4.2 Russia High-Density Interconnect (HDI) PCB Market by Application
6.2.3.5 Spain High-Density Interconnect (HDI) PCB Market
6.2.3.5.1 Spain High-Density Interconnect (HDI) PCB Market by End User
6.2.3.5.2 Spain High-Density Interconnect (HDI) PCB Market by Application
6.2.3.6 Italy High-Density Interconnect (HDI) PCB Market
6.2.3.6.1 Italy High-Density Interconnect (HDI) PCB Market by End User
6.2.3.6.2 Italy High-Density Interconnect (HDI) PCB Market by Application
6.2.3.7 Rest of Europe High-Density Interconnect (HDI) PCB Market
6.2.3.7.1 Rest of Europe High-Density Interconnect (HDI) PCB Market by End User
6.2.3.7.2 Rest of Europe High-Density Interconnect (HDI) PCB Market by Application
6.3 Asia Pacific High-Density Interconnect (HDI) PCB Market
6.3.1 Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
6.3.1.1 Asia Pacific Consumer Electronics Market by Country
6.3.1.2 Asia Pacific Automotive Market by Country
6.3.1.3 Asia Pacific Industrial Electronics Market by Country
6.3.1.4 Asia Pacific IT & Telecommunications Market by Country
6.3.1.5 Asia Pacific Others Market by Country
6.3.2 Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
6.3.2.1 Asia Pacific Smartphone & Tablet Market by Country
6.3.2.2 Asia Pacific PC & Laptop Market by Country
6.3.2.3 Asia Pacific Smart Wearables Market by Country
6.3.2.4 Asia Pacific Others Market by Country
6.3.3 Asia Pacific High-Density Interconnect (HDI) PCB Market by Country
6.3.3.1 China High-Density Interconnect (HDI) PCB Market
6.3.3.1.1 China High-Density Interconnect (HDI) PCB Market by End User
6.3.3.1.2 China High-Density Interconnect (HDI) PCB Market by Application
6.3.3.2 Japan High-Density Interconnect (HDI) PCB Market
6.3.3.2.1 Japan High-Density Interconnect (HDI) PCB Market by End User
6.3.3.2.2 Japan High-Density Interconnect (HDI) PCB Market by Application
6.3.3.3 India High-Density Interconnect (HDI) PCB Market
6.3.3.3.1 India High-Density Interconnect (HDI) PCB Market by End User
6.3.3.3.2 India High-Density Interconnect (HDI) PCB Market by Application
6.3.3.4 South Korea High-Density Interconnect (HDI) PCB Market
6.3.3.4.1 South Korea High-Density Interconnect (HDI) PCB Market by End User
6.3.3.4.2 South Korea High-Density Interconnect (HDI) PCB Market by Application
6.3.3.5 Singapore High-Density Interconnect (HDI) PCB Market
6.3.3.5.1 Singapore High-Density Interconnect (HDI) PCB Market by End User
6.3.3.5.2 Singapore High-Density Interconnect (HDI) PCB Market by Application
6.3.3.6 Malaysia High-Density Interconnect (HDI) PCB Market
6.3.3.6.1 Malaysia High-Density Interconnect (HDI) PCB Market by End User
6.3.3.6.2 Malaysia High-Density Interconnect (HDI) PCB Market by Application
6.3.3.7 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market
6.3.3.7.1 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
6.3.3.7.2 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
6.4 LAMEA High-Density Interconnect (HDI) PCB Market
6.4.1 LAMEA High-Density Interconnect (HDI) PCB Market by End User
6.4.1.1 LAMEA Consumer Electronics Market by Country
6.4.1.2 LAMEA Automotive Market by Country
6.4.1.3 LAMEA Industrial Electronics Market by Country
6.4.1.4 LAMEA IT & Telecommunications Market by Country
6.4.1.5 LAMEA Others Market by Country
6.4.2 LAMEA High-Density Interconnect (HDI) PCB Market by Application
6.4.2.1 LAMEA Smartphone & Tablet Market by Country
6.4.2.2 LAMEA PC & Laptop Market by Country
6.4.2.3 LAMEA Smart Wearables Market by Country
6.4.2.4 LAMEA Others Market by Country
6.4.3 LAMEA High-Density Interconnect (HDI) PCB Market by Country
6.4.3.1 Brazil High-Density Interconnect (HDI) PCB Market
6.4.3.1.1 Brazil High-Density Interconnect (HDI) PCB Market by End User
6.4.3.1.2 Brazil High-Density Interconnect (HDI) PCB Market by Application
6.4.3.2 Argentina High-Density Interconnect (HDI) PCB Market
6.4.3.2.1 Argentina High-Density Interconnect (HDI) PCB Market by End User
6.4.3.2.2 Argentina High-Density Interconnect (HDI) PCB Market by Application
6.4.3.3 UAE High-Density Interconnect (HDI) PCB Market
6.4.3.3.1 UAE High-Density Interconnect (HDI) PCB Market by End User
6.4.3.3.2 UAE High-Density Interconnect (HDI) PCB Market by Application
6.4.3.4 Saudi Arabia High-Density Interconnect (HDI) PCB Market
6.4.3.4.1 Saudi Arabia High-Density Interconnect (HDI) PCB Market by End User
6.4.3.4.2 Saudi Arabia High-Density Interconnect (HDI) PCB Market by Application
6.4.3.5 South Africa High-Density Interconnect (HDI) PCB Market
6.4.3.5.1 South Africa High-Density Interconnect (HDI) PCB Market by End User
6.4.3.5.2 South Africa High-Density Interconnect (HDI) PCB Market by Application
6.4.3.6 Nigeria High-Density Interconnect (HDI) PCB Market
6.4.3.6.1 Nigeria High-Density Interconnect (HDI) PCB Market by End User
6.4.3.6.2 Nigeria High-Density Interconnect (HDI) PCB Market by Application
6.4.3.7 Rest of LAMEA High-Density Interconnect (HDI) PCB Market
6.4.3.7.1 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by End User
6.4.3.7.2 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by Application
Chapter 7. Company Profiles
7.1 MEIKO ELECTRONICS CO., LTD.
7.1.1 Company Overview
7.1.2 SWOT Analysis
7.2 DAP CORPORATION
7.2.1 Company Overview
7.2.2 SWOT Analysis
7.3 Unitech Printed Circuit Board Corp.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 SWOT Analysis
7.4 FICT LIMITED (Fujitsu Limited)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.4.5 SWOT Analysis
7.5 UNIMICRON TECHNOLOGY CORP.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 NCAB Group AB
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 SWOT Analysis
7.7 Ibiden Co., Ltd.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Sierra Circuits, Inc.
7.8.1 Company Overview
7.8.2 SWOT Analysis
7.9 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 SWOT Analysis
7.10. TTM Technologies, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 SWOT Analysis
Chapter 8. Winning Imperatives for High-Density Interconnect (HDI) PCB Market

Companies Mentioned

  • MEIKO ELECTRONICS CO., LTD.
  • DAP CORPORATION
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Unitech Printed Circuit Board Corp.
  • FICT LIMITED (Fujitsu Limited)
  • TTM Technologies, Inc.
  • UNIMICRON TECHNOLOGY CORP.
  • NCAB Group AB
  • Ibiden Co., Ltd.
  • Sierra Circuits, Inc.

Methodology

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