Industrial Electronic Packaging Market Forecasts from 2023 to 2028

The industrial electronic packaging market is estimated to grow at a CAGR of 6.20% during the forecast period.

Industrial electronic packaging involves designing and manufacturing packaging solutions for industrial goods, ensuring their protection and transportation. The process includes assessing needs, designing, prototyping, manufacturing, ensuring quality, and distribution. The market is driven by several growth factors, including the increasing adoption of automation and smart manufacturing technologies, and the rise in demand for electronics in automotive, aerospace, and energy. Also, the need for durable and reliable packaging to protect sensitive electronic components in harsh operating environments is further augmenting the market growth.

Market Drivers:

Increasing Adoption of Automation and Smart Manufacturing.

The growing trend of automation and smart manufacturing in industrial sectors drives the demand for industrial electronics. This, in turn, boosts the need for specialized packaging solutions to protect and transport electronic components used in automated systems and smart devices.

Rising Demand for Industrial Electronics.

Industries such as automotive, aerospace, energy, and manufacturing are increasingly relying on electronic components for improved efficiency and functionality. This surge in demand for industrial electronics leads to a higher requirement for packaging solutions that can safeguard these sensitive components during transportation and operation.

Need for Durable and Reliable Packaging.

Industrial environments often involve harsh operating conditions, including temperature variations, moisture, and exposure to dust or chemicals. The industrial electronics packaging market addresses this need by providing packaging solutions that offer durability, protection, and reliability, ensuring the safe and secure functioning of electronic components in challenging industrial settings.

Technological Advancements:

Continuous advancements in industrial electronics, such as smaller and more powerful components, create a need for packaging solutions that accommodate miniaturization without compromising functionality or protection. The development of innovative packaging materials, designs, and manufacturing processes keeps pace with technological advancements, driving growth in the market.

Positive growth in the rigid packaging segment:

The rigid packaging format is showing massive growth in the industrial electronic packaging market. This is due to the increasing demand for high-performance electronic devices that require rugged and protective packaging. Rigid packaging formats offer several advantages over other packaging formats, including strength, protection, and heat dissipation. As the demand for high-performance electronic devices continues to grow, the demand for rigid packaging is also expected to grow.

Asia Pacific region is expected to hold a significant share:

The Asia-Pacific region is projected to have a significant share of the industrial electronic packaging market in the anticipated period. This dominance is attributed to factors such as the growing demand for electronic devices, the expansion of the manufacturing sector, and government support. Countries like China, India, Japan, South Korea, and Taiwan are expected to experience substantial growth in this market as the increasing demand for consumer electronics, industrial electronics, and automotive electronics in the countries are key drivers for this growth.

Key developments:

• In June 2022, PCB Technologies introduced iNPACK, a subsidiary providing advanced SiP solutions for various industries. iNPACK focuses on enhancing signal integrity, reducing inductance effects, and offering diverse packaging options.

Segmentation:

By Product

• Testing and Measuring Equipment
• Process Control Equipment
• Industrial Controls
• Power Electronics
• Industrial Automation Equipment
• Others

By Material

• Plastic
• Paper
• Paperboard

By Packaging Type

• Rigid
• Flexible

By End-Users

• Consumer electronics
• Aerospace and Defense
• Automotive
• Telecommunication
• Others

By Geography

• North America
• United States
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• United Kingdom
• Germany
• France
• Italy
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• Japan
• China
• India
• South Korea
• Taiwan
• Thailand
• Indonesia
• Others